BR0306304A - Processo de fabricação de um cartão com chip sem contato ou de um cartão com chip hìbrido com contato-sem contato - Google Patents

Processo de fabricação de um cartão com chip sem contato ou de um cartão com chip hìbrido com contato-sem contato

Info

Publication number
BR0306304A
BR0306304A BR0306304-6A BR0306304A BR0306304A BR 0306304 A BR0306304 A BR 0306304A BR 0306304 A BR0306304 A BR 0306304A BR 0306304 A BR0306304 A BR 0306304A
Authority
BR
Brazil
Prior art keywords
chip card
contactless contact
making
contactless
hybrid
Prior art date
Application number
BR0306304-6A
Other languages
English (en)
Other versions
BRPI0306304B1 (pt
Inventor
Georges Kayanakis
Pierre Benato
Christophe Halope
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask Sa filed Critical Ask Sa
Publication of BR0306304A publication Critical patent/BR0306304A/pt
Publication of BRPI0306304B1 publication Critical patent/BRPI0306304B1/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203—One or more of the layers being plastic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

"PROCESSO DE FABRICAçãO DE UM CARTãO COM CHIP SEM CONTATO OU DE UM CARTãO COM CHIP HìBRIDO COM CONTATO-SEM CONTATO". Processo de fabricação de um cartão com chip que compreende um suporte de antena, dois corpos de cartão e um módulo eletrónico ou um chip ligado à antena. Esse processo compreende por outro lado uma primeira etapa de laminação que consiste em soldar de cada lado do suporte de antena (10 ou 40) duas folhas de termoplástico (32, 34 ou 62, 64) em uma temperatura suficiente para que a matéria que compõe as folhas amoleça e flua totalmente de maneira a fazer desaparecer todas as diferenças de espessura do suporte de antena, e uma segunda etapa de laminação realizada depois de um tempo que corresponde ao tempo necessário para que as folhas de termoplástico (32, 34 ou 62, 64) estejam solidificadas, a segunda etapa consistindo em soldar sobre as faces plastificadas e planas do suporte de antena (30 ou 60) de espessura constante plastificado pelas folhas de termoplástico duas camadas feitas de matéria plástica (36, 38 ou 66, 68), que constituem os corpos de cartão, por prensagem a quente.
BRPI0306304A 2002-09-13 2003-09-12 processo de fabricação de um cartão com chip sem contato ou de um cartão com chip híbrido com contato-sem contato BRPI0306304B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0211387A FR2844621A1 (fr) 2002-09-13 2002-09-13 Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
FR0302258A FR2844620B1 (fr) 2002-09-13 2003-02-25 Procede de fabrication d'une carte a puce sans contact ou hybride contact - sans contact a planeite renforcee
PCT/FR2003/002701 WO2004025553A1 (fr) 2002-09-13 2003-09-12 Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planete renforcee

Publications (2)

Publication Number Publication Date
BR0306304A true BR0306304A (pt) 2004-09-28
BRPI0306304B1 BRPI0306304B1 (pt) 2015-10-27

Family

ID=31947975

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0306304A BRPI0306304B1 (pt) 2002-09-13 2003-09-12 processo de fabricação de um cartão com chip sem contato ou de um cartão com chip híbrido com contato-sem contato

Country Status (18)

Country Link
US (2) US7116231B2 (pt)
EP (1) EP1442424B1 (pt)
JP (1) JP2005538463A (pt)
KR (1) KR100998605B1 (pt)
CN (1) CN1596419A (pt)
AT (1) ATE424008T1 (pt)
AU (1) AU2003276333B2 (pt)
BR (1) BRPI0306304B1 (pt)
CA (1) CA2466898A1 (pt)
DE (1) DE60326317D1 (pt)
ES (1) ES2323695T3 (pt)
FR (2) FR2844621A1 (pt)
IL (2) IL161707A0 (pt)
MX (1) MXPA04006195A (pt)
RU (2) RU2324976C2 (pt)
TW (2) TWI340919B (pt)
WO (1) WO2004025553A1 (pt)
ZA (1) ZA200403503B (pt)

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FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
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US7209039B2 (en) * 2003-05-08 2007-04-24 Illinois Tool Works Inc. Decorative surface covering with embedded RF antenna and RF shield and method for making the same
US20080272885A1 (en) * 2004-01-22 2008-11-06 Mikoh Corporation Modular Radio Frequency Identification Tagging Method
FR2877462B1 (fr) * 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
JP2006244317A (ja) * 2005-03-04 2006-09-14 Nippon Sheet Glass Co Ltd パネル用中間膜体、パネル、および、電子タグ
JP2006277178A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
JP2006271596A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
US7571862B2 (en) * 2005-06-02 2009-08-11 Avery Dennison Corporation RFID tag that provides a flat print area and a pinch roller that enables the same
US20060276157A1 (en) * 2005-06-03 2006-12-07 Chen Zhi N Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
FR2890212B1 (fr) * 2005-08-30 2009-08-21 Smart Packaging Solutions Sps Module electronique a double interface de communication, notamment pour carte a puce
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
US7535356B2 (en) * 2005-11-29 2009-05-19 Bartronics America, Inc. Identification band using a conductive fastening for enhanced security and functionality
JP4825522B2 (ja) * 2005-12-26 2011-11-30 共同印刷株式会社 Ｉｃカード、インレットシート及びｉｃカードの製造方法
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US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US20080180255A1 (en) * 2007-01-25 2008-07-31 Michael James Isabell RFID tag
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JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Ｒｆｉｄを内蔵したゲームカードおよびその製造方法
DE102007038318A1 (de) * 2007-08-14 2009-02-19 Giesecke & Devrient Gmbh Hochgeprägter kartenförmiger Datenträger
JP5040551B2 (ja) * 2007-09-20 2012-10-03 大日本印刷株式会社 非接触型データキャリア用導電部材とその製造方法及び装置
FR2922342B1 (fr) * 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
JP5476663B2 (ja) * 2007-12-17 2014-04-23 トヨタ自動車株式会社 コード凹凸照合式キーシステム
US20100288436A1 (en) * 2008-02-04 2010-11-18 Solido 3D, Ltd. Depicting interior details in a three-dimensional object
ES2590339T3 (es) * 2008-02-22 2016-11-21 Toppan Printing Co., Ltd. Transpondedor y forma de libro
KR101006870B1 (ko) * 2008-05-02 2011-01-12 유인종 안테나 코일과 집적회로 칩을 구비한 카드에 칩을인레이하는 방법
EP2218579A1 (de) * 2009-02-13 2010-08-18 Bayer MaterialScience AG Verbessertes Verfahren zur Herstellung eines laminierten Schichtverbundes
FR2944122B1 (fr) * 2009-04-01 2011-05-06 Imprimerie Nationale Insert formant antenne et carte a puce le comportant.
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
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FR2973915B1 (fr) * 2011-04-05 2013-11-22 Smart Packaging Solutions Sps Procede de fabrication d'inserts pour passeport electronique
FR3020548B1 (fr) * 2014-04-24 2020-02-14 Linxens Holding Procede de fabrication d'une structure pour carte a puce et structure de carte a puce obtenue par ce procede
EP3091483B1 (en) * 2014-11-07 2020-08-12 Murata Manufacturing Co., Ltd. Wireless communication device, method for manufacturing same, and method for producing seal fitted with rfic element
EP3259708A1 (fr) * 2015-02-20 2017-12-27 Nid Sa Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne
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FR3058545B1 (fr) * 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
CN111126541A (zh) * 2018-11-01 2020-05-08 葛兰菲安全有限公司 Rfid智能卡的构造及其制造方法
EP3825126B1 (en) 2019-11-25 2023-03-15 Linxens Holding Laminated foil structure and method of forming the same
CN112446455B (zh) * 2020-11-18 2021-09-07 广州展丰智能科技有限公司 一种非接触式智能卡生产工艺及系统
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TWI804158B (zh) * 2022-01-17 2023-06-01 宏通數碼科技股份有限公司 卡片結構

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Also Published As

Publication number Publication date
CA2466898A1 (fr) 2004-03-25
TWI351645B (en) 2011-11-01
BRPI0306304B1 (pt) 2015-10-27
WO2004025553A1 (fr) 2004-03-25
AU2003276333A1 (en) 2004-04-30
JP2005538463A (ja) 2005-12-15
ES2323695T3 (es) 2009-07-23
TW200705282A (en) 2007-02-01
EP1442424B1 (fr) 2009-02-25
KR100998605B1 (ko) 2010-12-07
ZA200403503B (en) 2005-06-29
TWI340919B (en) 2011-04-21
TW200404261A (en) 2004-03-16
RU2415027C2 (ru) 2011-03-27
IL161707A (en) 2008-12-29
US20070001859A1 (en) 2007-01-04
IL161707A0 (en) 2004-09-27
FR2844621A1 (fr) 2004-03-19
RU2004123973A (ru) 2006-01-20
ATE424008T1 (de) 2009-03-15
MXPA04006195A (es) 2004-12-06
AU2003276333B2 (en) 2010-01-21
FR2844620A1 (fr) 2004-03-19
CN1596419A (zh) 2005-03-16
EP1442424A1 (fr) 2004-08-04
US20050066513A1 (en) 2005-03-31
KR20050039713A (ko) 2005-04-29
US7116231B2 (en) 2006-10-03
RU2324976C2 (ru) 2008-05-20
FR2844620B1 (fr) 2005-01-07
RU2006132772A (ru) 2008-03-20
DE60326317D1 (de) 2009-04-09

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 27/10/2015, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 13A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.