ATE424008T1 - Verfahren zur herstellung einer kontaktlosen chipkarte oder einer hybriden chipkarte mit und ohne kontakten mit verbesserter flachheit - Google Patents
Verfahren zur herstellung einer kontaktlosen chipkarte oder einer hybriden chipkarte mit und ohne kontakten mit verbesserter flachheitInfo
- Publication number
- ATE424008T1 ATE424008T1 AT03795045T AT03795045T ATE424008T1 AT E424008 T1 ATE424008 T1 AT E424008T1 AT 03795045 T AT03795045 T AT 03795045T AT 03795045 T AT03795045 T AT 03795045T AT E424008 T1 ATE424008 T1 AT E424008T1
- Authority
- AT
- Austria
- Prior art keywords
- chip card
- contacts
- producing
- improved flatness
- hybrid
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
- B32B2305/342—Chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0211387A FR2844621A1 (fr) | 2002-09-13 | 2002-09-13 | Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee |
FR0302258A FR2844620B1 (fr) | 2002-09-13 | 2003-02-25 | Procede de fabrication d'une carte a puce sans contact ou hybride contact - sans contact a planeite renforcee |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE424008T1 true ATE424008T1 (de) | 2009-03-15 |
Family
ID=31947975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03795045T ATE424008T1 (de) | 2002-09-13 | 2003-09-12 | Verfahren zur herstellung einer kontaktlosen chipkarte oder einer hybriden chipkarte mit und ohne kontakten mit verbesserter flachheit |
Country Status (18)
Country | Link |
---|---|
US (2) | US7116231B2 (de) |
EP (1) | EP1442424B1 (de) |
JP (1) | JP2005538463A (de) |
KR (1) | KR100998605B1 (de) |
CN (1) | CN1596419A (de) |
AT (1) | ATE424008T1 (de) |
AU (1) | AU2003276333B2 (de) |
BR (1) | BRPI0306304B1 (de) |
CA (1) | CA2466898A1 (de) |
DE (1) | DE60326317D1 (de) |
ES (1) | ES2323695T3 (de) |
FR (2) | FR2844621A1 (de) |
IL (2) | IL161707A0 (de) |
MX (1) | MXPA04006195A (de) |
RU (2) | RU2415027C2 (de) |
TW (2) | TWI340919B (de) |
WO (1) | WO2004025553A1 (de) |
ZA (1) | ZA200403503B (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2844621A1 (fr) * | 2002-09-13 | 2004-03-19 | A S K | Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee |
RU2340942C2 (ru) * | 2003-03-12 | 2008-12-10 | Бундесдрукерай Гмбх | Способ изготовления вставки для книжного переплета и документа в виде книжки, а также вставка для переплета и документ в виде книжки |
US7209039B2 (en) * | 2003-05-08 | 2007-04-24 | Illinois Tool Works Inc. | Decorative surface covering with embedded RF antenna and RF shield and method for making the same |
AU2005208313A1 (en) * | 2004-01-22 | 2005-08-11 | Mikoh Corporation | A modular radio frequency identification tagging method |
FR2877462B1 (fr) * | 2004-10-29 | 2007-01-26 | Arjowiggins Security Soc Par A | Structure comportant un dispositif electronique pour la fabrication d'un document de securite. |
JP2006244317A (ja) * | 2005-03-04 | 2006-09-14 | Nippon Sheet Glass Co Ltd | パネル用中間膜体、パネル、および、電子タグ |
JP2006277178A (ja) * | 2005-03-29 | 2006-10-12 | Aruze Corp | ゲーム用カード |
JP2006271596A (ja) * | 2005-03-29 | 2006-10-12 | Aruze Corp | ゲーム用カード |
US7571862B2 (en) * | 2005-06-02 | 2009-08-11 | Avery Dennison Corporation | RFID tag that provides a flat print area and a pinch roller that enables the same |
US20060276157A1 (en) * | 2005-06-03 | 2006-12-07 | Chen Zhi N | Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications |
FR2890212B1 (fr) * | 2005-08-30 | 2009-08-21 | Smart Packaging Solutions Sps | Module electronique a double interface de communication, notamment pour carte a puce |
US7224278B2 (en) * | 2005-10-18 | 2007-05-29 | Avery Dennison Corporation | Label with electronic components and method of making same |
US7535356B2 (en) * | 2005-11-29 | 2009-05-19 | Bartronics America, Inc. | Identification band using a conductive fastening for enhanced security and functionality |
JP4825522B2 (ja) * | 2005-12-26 | 2011-11-30 | 共同印刷株式会社 | Icカード、インレットシート及びicカードの製造方法 |
US7646304B2 (en) * | 2006-04-10 | 2010-01-12 | Checkpoint Systems, Inc. | Transfer tape strap process |
US7701352B2 (en) * | 2006-11-22 | 2010-04-20 | Avery Dennison Corporation | RFID label with release liner window, and method of making |
US20080180255A1 (en) * | 2007-01-25 | 2008-07-31 | Michael James Isabell | RFID tag |
WO2008103870A1 (en) | 2007-02-23 | 2008-08-28 | Newpage Wisconsin System Inc. | Multifunctional paper identification label |
JP2008246104A (ja) * | 2007-03-30 | 2008-10-16 | Angel Shoji Kk | Rfidを内蔵したゲームカードおよびその製造方法 |
DE102007038318A1 (de) * | 2007-08-14 | 2009-02-19 | Giesecke & Devrient Gmbh | Hochgeprägter kartenförmiger Datenträger |
JP5040551B2 (ja) * | 2007-09-20 | 2012-10-03 | 大日本印刷株式会社 | 非接触型データキャリア用導電部材とその製造方法及び装置 |
FR2922342B1 (fr) * | 2007-10-11 | 2010-07-30 | Ask Sa | Support de dispositif d'identification radiofrequence renforce et son procede de fabrication |
JP5476663B2 (ja) * | 2007-12-17 | 2014-04-23 | トヨタ自動車株式会社 | コード凹凸照合式キーシステム |
US20100288436A1 (en) * | 2008-02-04 | 2010-11-18 | Solido 3D, Ltd. | Depicting interior details in a three-dimensional object |
JP5287731B2 (ja) * | 2008-02-22 | 2013-09-11 | 凸版印刷株式会社 | トランスポンダ及び冊子体 |
KR101006870B1 (ko) * | 2008-05-02 | 2011-01-12 | 유인종 | 안테나 코일과 집적회로 칩을 구비한 카드에 칩을인레이하는 방법 |
EP2218579A1 (de) * | 2009-02-13 | 2010-08-18 | Bayer MaterialScience AG | Verbessertes Verfahren zur Herstellung eines laminierten Schichtverbundes |
FR2944122B1 (fr) * | 2009-04-01 | 2011-05-06 | Imprimerie Nationale | Insert formant antenne et carte a puce le comportant. |
FR2948796A1 (fr) * | 2009-07-28 | 2011-02-04 | Ask Sa | Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
EP2461275A1 (de) * | 2010-12-02 | 2012-06-06 | Gemalto SA | Sicherheitsdokument und Verfahren zur Herstellung von Sicherheitsdokumenten |
FR2973915B1 (fr) * | 2011-04-05 | 2013-11-22 | Smart Packaging Solutions Sps | Procede de fabrication d'inserts pour passeport electronique |
FR3020548B1 (fr) * | 2014-04-24 | 2020-02-14 | Linxens Holding | Procede de fabrication d'une structure pour carte a puce et structure de carte a puce obtenue par ce procede |
EP3091483B1 (de) * | 2014-11-07 | 2020-08-12 | Murata Manufacturing Co., Ltd. | Drahtloskommunikationsvorrichtung, verfahren zur herstellung davon und verfahren zur herstellung einer dichtung mit einem rfic-element |
BR112017017273A2 (pt) * | 2015-02-20 | 2018-04-17 | Nid Sa | processo para fabricação de um dispositivo compreendendo pelo menos um elemento eletrônico associado a um substrato e a uma antena e produto obtido por meio deste processo |
DE102016106698A1 (de) * | 2016-04-12 | 2017-10-12 | Infineon Technologies Ag | Chipkarte und Verfahren zum Herstellen einer Chipkarte |
FR3058545B1 (fr) * | 2016-11-04 | 2018-10-26 | Smart Packaging Solutions | Procede de fabrication d'un module electronique pour carte a puce |
CN111126541A (zh) * | 2018-11-01 | 2020-05-08 | 葛兰菲安全有限公司 | Rfid智能卡的构造及其制造方法 |
EP3825126B1 (de) * | 2019-11-25 | 2023-03-15 | Linxens Holding | Laminierte folienstruktur und herstellungsverfahren dafür |
CN112446455B (zh) * | 2020-11-18 | 2021-09-07 | 广州展丰智能科技有限公司 | 一种非接触式智能卡生产工艺及系统 |
WO2022147502A1 (en) * | 2020-12-31 | 2022-07-07 | Credit Card Supplies Corporation | Method for manufacturing electronic transaction cards |
TWI804158B (zh) * | 2022-01-17 | 2023-06-01 | 宏通數碼科技股份有限公司 | 卡片結構 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US5574470A (en) * | 1994-09-30 | 1996-11-12 | Palomar Technologies Corporation | Radio frequency identification transponder apparatus and method |
FR2730576B1 (fr) * | 1995-02-15 | 1997-04-04 | Gemplus Card Int | Procede de fabrication de cartes electroniques et cartes obtenues par un tel procede |
US6036099A (en) * | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
US6441736B1 (en) * | 1999-07-01 | 2002-08-27 | Keith R. Leighton | Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices |
AU1051599A (en) * | 1997-11-12 | 1999-05-31 | Supercom Ltd. | Method and apparatus for the automatic production of personalized cards and pouches |
US6018299A (en) * | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
WO2000003354A1 (fr) * | 1998-07-08 | 2000-01-20 | Dai Nippon Printing Co., Ltd. | Carte a circuit integre sans contact et son procede de fabrication |
FR2782821B1 (fr) * | 1998-08-27 | 2001-10-12 | Gemplus Card Int | Procede de fabrication de carte a puce sans contact |
US6262692B1 (en) * | 1999-01-13 | 2001-07-17 | Brady Worldwide, Inc. | Laminate RFID label and method of manufacture |
FR2795846B1 (fr) * | 1999-07-01 | 2001-08-31 | Schlumberger Systems & Service | PROCEDE DE FABRICATION DE CARTES LAMINEES MUNIES D'UNE COUCHE INTERMEDIAIRES DE petg |
US6421013B1 (en) * | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
US6271793B1 (en) * | 1999-11-05 | 2001-08-07 | International Business Machines Corporation | Radio frequency (RF) transponder (Tag) with composite antenna |
FR2801709B1 (fr) * | 1999-11-29 | 2002-02-15 | A S K | Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude |
JP4710124B2 (ja) * | 1999-12-02 | 2011-06-29 | 凸版印刷株式会社 | 非接触icカード記録媒体及びその製造方法 |
US6294998B1 (en) * | 2000-06-09 | 2001-09-25 | Intermec Ip Corp. | Mask construction for profile correction on an RFID smart label to improve print quality and eliminate detection |
US6937153B2 (en) * | 2002-06-28 | 2005-08-30 | Appleton Papers Inc. | Thermal imaging paper laminate |
FR2844621A1 (fr) * | 2002-09-13 | 2004-03-19 | A S K | Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee |
-
2002
- 2002-09-13 FR FR0211387A patent/FR2844621A1/fr active Pending
-
2003
- 2003-02-25 FR FR0302258A patent/FR2844620B1/fr not_active Expired - Fee Related
- 2003-09-12 JP JP2004535605A patent/JP2005538463A/ja active Pending
- 2003-09-12 WO PCT/FR2003/002701 patent/WO2004025553A1/fr active Application Filing
- 2003-09-12 RU RU2006132772/12A patent/RU2415027C2/ru not_active IP Right Cessation
- 2003-09-12 DE DE60326317T patent/DE60326317D1/de not_active Expired - Lifetime
- 2003-09-12 US US10/498,914 patent/US7116231B2/en not_active Expired - Fee Related
- 2003-09-12 ES ES03795045T patent/ES2323695T3/es not_active Expired - Lifetime
- 2003-09-12 AT AT03795045T patent/ATE424008T1/de not_active IP Right Cessation
- 2003-09-12 CN CNA038016478A patent/CN1596419A/zh active Pending
- 2003-09-12 RU RU2004123973/09A patent/RU2324976C2/ru not_active IP Right Cessation
- 2003-09-12 CA CA002466898A patent/CA2466898A1/fr not_active Abandoned
- 2003-09-12 IL IL16170703A patent/IL161707A0/xx unknown
- 2003-09-12 TW TW092125177A patent/TWI340919B/zh not_active IP Right Cessation
- 2003-09-12 MX MXPA04006195A patent/MXPA04006195A/es active IP Right Grant
- 2003-09-12 AU AU2003276333A patent/AU2003276333B2/en not_active Ceased
- 2003-09-12 TW TW095132805A patent/TWI351645B/zh not_active IP Right Cessation
- 2003-09-12 BR BRPI0306304A patent/BRPI0306304B1/pt not_active IP Right Cessation
- 2003-09-12 KR KR1020047006392A patent/KR100998605B1/ko not_active IP Right Cessation
- 2003-09-12 EP EP03795045A patent/EP1442424B1/de not_active Expired - Lifetime
-
2004
- 2004-04-29 IL IL161707A patent/IL161707A/en not_active IP Right Cessation
- 2004-05-07 ZA ZA2004/03503A patent/ZA200403503B/en unknown
-
2006
- 2006-09-07 US US11/516,753 patent/US20070001859A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU2003276333A1 (en) | 2004-04-30 |
ES2323695T3 (es) | 2009-07-23 |
RU2324976C2 (ru) | 2008-05-20 |
RU2415027C2 (ru) | 2011-03-27 |
IL161707A0 (en) | 2004-09-27 |
AU2003276333B2 (en) | 2010-01-21 |
KR20050039713A (ko) | 2005-04-29 |
IL161707A (en) | 2008-12-29 |
FR2844621A1 (fr) | 2004-03-19 |
US20050066513A1 (en) | 2005-03-31 |
EP1442424B1 (de) | 2009-02-25 |
US7116231B2 (en) | 2006-10-03 |
TWI351645B (en) | 2011-11-01 |
RU2006132772A (ru) | 2008-03-20 |
KR100998605B1 (ko) | 2010-12-07 |
JP2005538463A (ja) | 2005-12-15 |
FR2844620B1 (fr) | 2005-01-07 |
CN1596419A (zh) | 2005-03-16 |
TW200705282A (en) | 2007-02-01 |
ZA200403503B (en) | 2005-06-29 |
TW200404261A (en) | 2004-03-16 |
FR2844620A1 (fr) | 2004-03-19 |
RU2004123973A (ru) | 2006-01-20 |
CA2466898A1 (fr) | 2004-03-25 |
BR0306304A (pt) | 2004-09-28 |
MXPA04006195A (es) | 2004-12-06 |
DE60326317D1 (de) | 2009-04-09 |
EP1442424A1 (de) | 2004-08-04 |
US20070001859A1 (en) | 2007-01-04 |
WO2004025553A1 (fr) | 2004-03-25 |
BRPI0306304B1 (pt) | 2015-10-27 |
TWI340919B (en) | 2011-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE424008T1 (de) | Verfahren zur herstellung einer kontaktlosen chipkarte oder einer hybriden chipkarte mit und ohne kontakten mit verbesserter flachheit | |
ATE251325T1 (de) | Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg | |
CY1107019T1 (el) | Μεθοδος για την παραγωγη καρτων εγγραφων πολλων στρωσεων και παραγομενες συμφωνα μ’ αυτη καρτες εγγραφων | |
NO20032102D0 (no) | Kontaktfri eller hybrid kontaktfri smartkort med forbedret styrke av den elektroniske modulen | |
MXPA05010211A (es) | Procedimiento de fabricacion de antena de tarjeta inteligente sobre soporte termoplastico y tarjeta inteligente obtenida por dicho procedimiento. | |
ATE367256T1 (de) | Verfahren zur herstellung eines aus mehreren schichten bestehenden dreidimensionalen bauteils | |
ATE520290T1 (de) | Mehrschichtige leiterplatte und verfahren zur herstellung dazu | |
TW200502319A (en) | Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same | |
ATE94328T1 (de) | Verfahren zur herstellung einer starre und flexible bereiche aufweisenden leiterplatte. | |
ATE388453T1 (de) | Verfahren zur herstellung einer kontaktlosen chipkarte mit einem antennenträger aus fasermaterial | |
TW200708587A (en) | Anisotropic conductive film and method for producing the same | |
DE69214463D1 (de) | Verfahren zur herstellung von plastiklaminaten mit metallschichten insbesondere für gedruckte schaltungen | |
DK0791446T3 (da) | Fremgangsmåde og plast-sprøjtestøbeform til fremstilling af et kompositlegeme | |
ATE181013T1 (de) | Formkörper aus verbundmaterial sowie verfahren zu seiner herstellung | |
DE59911491D1 (de) | Verfahren zur herstellung einer mehrschichtigen ausweiskarte aus kunststoff | |
DE59912998D1 (de) | Verfahren zum einbetten eines ic-bausteins in einer geschäumten schicht einer chipkarte | |
ATE408870T1 (de) | Verfahren zur herstellung eines elektronischen labels | |
ATE535888T1 (de) | Raumgebilde mit einem transponder und verfahren zum erzeugen desselben | |
ATE330792T1 (de) | Verfahren und vorrichtung zur herstellung eines tragbaren datenträgers | |
DE3784906D1 (de) | Verfahren, das eine elastische folie benutzt zum herstellen einer integrierten schaltungspackung mit kontaktflecken in einer abgestuften grube. | |
EP1286302A3 (de) | Verfahren zur Herstellung einer kontaktlosen Chipkarte | |
EP1798671A3 (de) | Verfahren zum Herstellen eines kartenförmigen Datenträgers | |
IL162178A0 (en) | Foil battery with integrated component for use in a chip card | |
DE60000941T2 (de) | Verfahren zur herstellung einer chip-karte mit kontakten mit kostengünstigem dielektrikum | |
ATE325715T1 (de) | Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement davon hergestellt |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |