IL143207A0 - A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom - Google Patents
A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefromInfo
- Publication number
- IL143207A0 IL143207A0 IL14320799A IL14320799A IL143207A0 IL 143207 A0 IL143207 A0 IL 143207A0 IL 14320799 A IL14320799 A IL 14320799A IL 14320799 A IL14320799 A IL 14320799A IL 143207 A0 IL143207 A0 IL 143207A0
- Authority
- IL
- Israel
- Prior art keywords
- cross
- poragen
- porous
- linkable
- porous matrix
- Prior art date
Links
- 239000011159 matrix material Substances 0.000 title abstract 7
- 239000002243 precursor Substances 0.000 title abstract 2
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/26—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Organic Insulating Materials (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10971098P | 1998-11-24 | 1998-11-24 | |
PCT/US1999/027674 WO2000031183A1 (en) | 1998-11-24 | 1999-11-22 | A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
IL143207A0 true IL143207A0 (en) | 2002-04-21 |
Family
ID=22329136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL14320799A IL143207A0 (en) | 1998-11-24 | 1999-11-22 | A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom |
Country Status (10)
Country | Link |
---|---|
US (4) | US6630520B1 (xx) |
EP (1) | EP1141128B1 (xx) |
JP (2) | JP2002530505A (xx) |
KR (1) | KR100699712B1 (xx) |
CN (1) | CN1325560C (xx) |
AT (1) | ATE323132T1 (xx) |
DE (1) | DE69930874T2 (xx) |
IL (1) | IL143207A0 (xx) |
TW (1) | TWI253456B (xx) |
WO (1) | WO2000031183A1 (xx) |
Families Citing this family (145)
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JP4159199B2 (ja) * | 1999-09-16 | 2008-10-01 | 日東電工株式会社 | 多孔質体及び多孔質体の製造方法 |
US6420441B1 (en) * | 1999-10-01 | 2002-07-16 | Shipley Company, L.L.C. | Porous materials |
US6359091B1 (en) * | 1999-11-22 | 2002-03-19 | The Dow Chemical Company | Polyarylene compositions with enhanced modulus profiles |
JP4940499B2 (ja) * | 2000-03-17 | 2012-05-30 | 東レ株式会社 | 低誘電率重合体 |
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US6271273B1 (en) | 2000-07-14 | 2001-08-07 | Shipley Company, L.L.C. | Porous materials |
CN1252132C (zh) * | 2000-07-19 | 2006-04-19 | 陶氏环球技术公司 | 含涂布增强剂的旋布介电层组合物 |
US20020022708A1 (en) * | 2000-07-19 | 2002-02-21 | Honeywell International Inc. | Compositions and methods for thermosetting molecules in organic compositions |
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- 1999-11-22 JP JP2000584005A patent/JP2002530505A/ja active Pending
- 1999-11-22 KR KR1020017006529A patent/KR100699712B1/ko active IP Right Grant
- 1999-11-22 WO PCT/US1999/027674 patent/WO2000031183A1/en active IP Right Grant
- 1999-11-22 US US09/447,011 patent/US6630520B1/en not_active Expired - Lifetime
- 1999-11-22 IL IL14320799A patent/IL143207A0/xx unknown
- 1999-11-22 CN CNB998136492A patent/CN1325560C/zh not_active Expired - Lifetime
- 1999-11-22 EP EP99962822A patent/EP1141128B1/en not_active Expired - Lifetime
- 1999-11-22 DE DE69930874T patent/DE69930874T2/de not_active Expired - Lifetime
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2000
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2002
- 2002-10-29 US US10/283,552 patent/US6887910B2/en not_active Expired - Lifetime
- 2002-10-29 US US10/283,551 patent/US6653358B2/en not_active Expired - Lifetime
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2004
- 2004-07-16 US US10/893,640 patent/US7109249B2/en not_active Expired - Lifetime
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- 2010-08-13 JP JP2010181420A patent/JP5209679B2/ja not_active Expired - Lifetime
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WO2000031183A1 (en) | 2000-06-02 |
US6630520B1 (en) | 2003-10-07 |
US6653358B2 (en) | 2003-11-25 |
EP1141128A1 (en) | 2001-10-10 |
JP2002530505A (ja) | 2002-09-17 |
CN1325560C (zh) | 2007-07-11 |
US7109249B2 (en) | 2006-09-19 |
CN1328589A (zh) | 2001-12-26 |
DE69930874T2 (de) | 2006-11-02 |
JP2011012272A (ja) | 2011-01-20 |
JP5209679B2 (ja) | 2013-06-12 |
US20050014855A1 (en) | 2005-01-20 |
KR100699712B1 (ko) | 2007-03-27 |
US6887910B2 (en) | 2005-05-03 |
EP1141128B1 (en) | 2006-04-12 |
ATE323132T1 (de) | 2006-04-15 |
US20030083392A1 (en) | 2003-05-01 |
US20030092785A1 (en) | 2003-05-15 |
DE69930874D1 (de) | 2006-05-24 |
TWI253456B (en) | 2006-04-21 |
KR20010107984A (ko) | 2001-12-07 |
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