IL137026A - Method for manufacturing multi-layer wiring boards - Google Patents
Method for manufacturing multi-layer wiring boardsInfo
- Publication number
- IL137026A IL137026A IL13702698A IL13702698A IL137026A IL 137026 A IL137026 A IL 137026A IL 13702698 A IL13702698 A IL 13702698A IL 13702698 A IL13702698 A IL 13702698A IL 137026 A IL137026 A IL 137026A
- Authority
- IL
- Israel
- Prior art keywords
- layer
- column
- metallic body
- plating
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1998/005192 WO2000030420A1 (fr) | 1998-11-18 | 1998-11-18 | Procede de production de tableaux de connexions |
Publications (2)
Publication Number | Publication Date |
---|---|
IL137026A0 IL137026A0 (en) | 2001-06-14 |
IL137026A true IL137026A (en) | 2004-02-19 |
Family
ID=14209428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL13702698A IL137026A (en) | 1998-11-18 | 1998-11-18 | Method for manufacturing multi-layer wiring boards |
Country Status (7)
Country | Link |
---|---|
US (1) | US6527963B1 (de) |
EP (1) | EP1049364A4 (de) |
JP (1) | JP3217381B2 (de) |
KR (1) | KR100343389B1 (de) |
CN (1) | CN1173616C (de) |
IL (1) | IL137026A (de) |
WO (1) | WO2000030420A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4383257B2 (ja) * | 2004-05-31 | 2009-12-16 | 三洋電機株式会社 | 回路装置およびその製造方法 |
KR100652132B1 (ko) * | 2004-07-12 | 2006-11-29 | 곽경숙 | 인쇄 회로 기판 및 이의 제작 방법 |
KR100589253B1 (ko) * | 2005-12-13 | 2006-06-19 | (주)엠케이켐앤텍 | 금속 회로가 도금된 세라믹 보드 및 이의 제조방법 |
JP4887232B2 (ja) * | 2007-07-24 | 2012-02-29 | 日東電工株式会社 | 配線回路基板の製造方法 |
US9129955B2 (en) * | 2009-02-04 | 2015-09-08 | Texas Instruments Incorporated | Semiconductor flip-chip system having oblong connectors and reduced trace pitches |
KR101070098B1 (ko) * | 2009-09-15 | 2011-10-04 | 삼성전기주식회사 | 인쇄회로기판 및 그의 제조 방법 |
KR101089959B1 (ko) | 2009-09-15 | 2011-12-05 | 삼성전기주식회사 | 인쇄회로기판 및 그의 제조 방법 |
JP6543887B2 (ja) * | 2014-02-24 | 2019-07-17 | 日立化成株式会社 | バンプ付き配線基板及びその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2113477B (en) * | 1981-12-31 | 1985-04-17 | Hara J B O | Method of producing printed circuits |
JPS58213451A (ja) | 1982-06-07 | 1983-12-12 | Hitachi Ltd | 多層配線の形成法 |
US4785137A (en) * | 1984-04-30 | 1988-11-15 | Allied Corporation | Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices |
US4659587A (en) * | 1984-10-11 | 1987-04-21 | Hitachi, Ltd. | Electroless plating process and process for producing multilayer wiring board |
JPS61121392A (ja) * | 1984-11-19 | 1986-06-09 | 日本電信電話株式会社 | 多層配線の製造方法 |
US4735694A (en) * | 1986-06-18 | 1988-04-05 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
JPH0710030B2 (ja) * | 1990-05-18 | 1995-02-01 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 多層配線基板の製造方法 |
JPH05291744A (ja) | 1992-04-10 | 1993-11-05 | Hitachi Chem Co Ltd | 多層配線板の製造法および多層金属層付絶縁基板 |
JPH0621651A (ja) * | 1992-07-03 | 1994-01-28 | Toshiba Corp | 多層配線回路板及びその製造方法 |
US5480048A (en) * | 1992-09-04 | 1996-01-02 | Hitachi, Ltd. | Multilayer wiring board fabricating method |
US5600103A (en) * | 1993-04-16 | 1997-02-04 | Kabushiki Kaisha Toshiba | Circuit devices and fabrication method of the same |
JPH06310857A (ja) * | 1993-04-26 | 1994-11-04 | Hitachi Ltd | 薄膜多層回路とその製造方法 |
JPH06314878A (ja) | 1993-04-30 | 1994-11-08 | Toppan Printing Co Ltd | プリント配線板の製造方法 |
-
1998
- 1998-11-18 EP EP98954732A patent/EP1049364A4/de not_active Withdrawn
- 1998-11-18 JP JP52152899A patent/JP3217381B2/ja not_active Expired - Fee Related
- 1998-11-18 WO PCT/JP1998/005192 patent/WO2000030420A1/ja not_active Application Discontinuation
- 1998-11-18 IL IL13702698A patent/IL137026A/en not_active IP Right Cessation
- 1998-11-18 CN CNB988128926A patent/CN1173616C/zh not_active Expired - Fee Related
- 1998-11-18 US US09/600,424 patent/US6527963B1/en not_active Expired - Lifetime
- 1998-11-18 KR KR1020007007796A patent/KR100343389B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1049364A4 (de) | 2004-06-09 |
KR100343389B1 (ko) | 2002-07-15 |
EP1049364A1 (de) | 2000-11-02 |
US6527963B1 (en) | 2003-03-04 |
KR20010034171A (ko) | 2001-04-25 |
CN1173616C (zh) | 2004-10-27 |
CN1286013A (zh) | 2001-02-28 |
JP3217381B2 (ja) | 2001-10-09 |
WO2000030420A1 (fr) | 2000-05-25 |
IL137026A0 (en) | 2001-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
MM9K | Patent not in force due to non-payment of renewal fees |