IL122107A - Perimeter matrix ball grid array circuit package with a populated center - Google Patents
Perimeter matrix ball grid array circuit package with a populated centerInfo
- Publication number
- IL122107A IL122107A IL12210797A IL12210797A IL122107A IL 122107 A IL122107 A IL 122107A IL 12210797 A IL12210797 A IL 12210797A IL 12210797 A IL12210797 A IL 12210797A IL 122107 A IL122107 A IL 122107A
- Authority
- IL
- Israel
- Prior art keywords
- grid array
- circuit package
- ball grid
- array circuit
- matrix ball
- Prior art date
Links
- 239000011159 matrix material Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62335596A | 1996-03-28 | 1996-03-28 | |
PCT/US1997/003511 WO1997036466A1 (en) | 1996-03-28 | 1997-03-07 | Perimeter matrix ball grid array circuit package with a populated center |
Publications (2)
Publication Number | Publication Date |
---|---|
IL122107A0 IL122107A0 (en) | 1998-04-05 |
IL122107A true IL122107A (en) | 2003-10-31 |
Family
ID=24497765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL12210797A IL122107A (en) | 1996-03-28 | 1997-03-07 | Perimeter matrix ball grid array circuit package with a populated center |
Country Status (10)
Country | Link |
---|---|
US (5) | US5894410A (de) |
EP (2) | EP1482773A1 (de) |
JP (4) | JPH11506274A (de) |
KR (1) | KR100288065B1 (de) |
CN (1) | CN1112086C (de) |
AU (1) | AU2070197A (de) |
DE (1) | DE69732166T2 (de) |
IL (1) | IL122107A (de) |
MY (1) | MY123146A (de) |
WO (1) | WO1997036466A1 (de) |
Families Citing this family (85)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY123146A (en) * | 1996-03-28 | 2006-05-31 | Intel Corp | Perimeter matrix ball grid array circuit package with a populated center |
JPH1065039A (ja) * | 1996-08-13 | 1998-03-06 | Sony Corp | 半導体装置 |
US6037044A (en) * | 1998-01-08 | 2000-03-14 | International Business Machines Corporation | Direct deposit thin film single/multi chip module |
JPH11284006A (ja) * | 1998-03-31 | 1999-10-15 | Fujitsu Ltd | 半導体装置 |
US6060777A (en) | 1998-07-21 | 2000-05-09 | Intel Corporation | Underside heat slug for ball grid array packages |
JP3602968B2 (ja) * | 1998-08-18 | 2004-12-15 | 沖電気工業株式会社 | 半導体装置およびその基板接続構造 |
US6655022B1 (en) | 1998-09-24 | 2003-12-02 | Intel Corporation | Implementing micro BGA assembly techniques for small die |
US6034425A (en) * | 1999-03-17 | 2000-03-07 | Chipmos Technologies Inc. | Flat multiple-chip module micro ball grid array packaging |
US6489557B2 (en) | 1999-08-30 | 2002-12-03 | Intel Corporation | Implementing micro BGA™ assembly techniques for small die |
US6566741B2 (en) | 1999-10-21 | 2003-05-20 | Intel Corporation | Grounding of package substrates |
US6392887B1 (en) | 1999-12-14 | 2002-05-21 | Intel Corporation | PLGA-BGA socket using elastomer connectors |
JP2001223324A (ja) * | 2000-02-10 | 2001-08-17 | Mitsubishi Electric Corp | 半導体装置 |
US6448639B1 (en) | 2000-09-18 | 2002-09-10 | Advanced Semiconductor Engineering, Inc. | Substrate having specific pad distribution |
TW462121B (en) * | 2000-09-19 | 2001-11-01 | Siliconware Precision Industries Co Ltd | Heat sink type ball grid array package |
US6403896B1 (en) | 2000-09-27 | 2002-06-11 | Advanced Semiconductor Engineering, Inc. | Substrate having specific pad distribution |
US6816385B1 (en) | 2000-11-16 | 2004-11-09 | International Business Machines Corporation | Compliant laminate connector |
US6882042B2 (en) * | 2000-12-01 | 2005-04-19 | Broadcom Corporation | Thermally and electrically enhanced ball grid array packaging |
US7132744B2 (en) | 2000-12-22 | 2006-11-07 | Broadcom Corporation | Enhanced die-up ball grid array packages and method for making the same |
US20020079572A1 (en) | 2000-12-22 | 2002-06-27 | Khan Reza-Ur Rahman | Enhanced die-up ball grid array and method for making the same |
US7161239B2 (en) | 2000-12-22 | 2007-01-09 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
US6906414B2 (en) * | 2000-12-22 | 2005-06-14 | Broadcom Corporation | Ball grid array package with patterned stiffener layer |
US6853070B2 (en) * | 2001-02-15 | 2005-02-08 | Broadcom Corporation | Die-down ball grid array package with die-attached heat spreader and method for making the same |
US7259448B2 (en) | 2001-05-07 | 2007-08-21 | Broadcom Corporation | Die-up ball grid array package with a heat spreader and method for making the same |
US6413851B1 (en) * | 2001-06-12 | 2002-07-02 | Advanced Interconnect Technology, Ltd. | Method of fabrication of barrier cap for under bump metal |
US6617680B2 (en) * | 2001-08-22 | 2003-09-09 | Siliconware Precision Industries Co., Ltd. | Chip carrier, semiconductor package and fabricating method thereof |
GB2377080B (en) * | 2001-09-11 | 2003-05-07 | Sendo Int Ltd | Integrated circuit package and printed circuit board arrangement |
TW510034B (en) * | 2001-11-15 | 2002-11-11 | Siliconware Precision Industries Co Ltd | Ball grid array semiconductor package |
US6879039B2 (en) * | 2001-12-18 | 2005-04-12 | Broadcom Corporation | Ball grid array package substrates and method of making the same |
US6861750B2 (en) * | 2002-02-01 | 2005-03-01 | Broadcom Corporation | Ball grid array package with multiple interposers |
US7550845B2 (en) | 2002-02-01 | 2009-06-23 | Broadcom Corporation | Ball grid array package with separated stiffener layer |
US6825108B2 (en) * | 2002-02-01 | 2004-11-30 | Broadcom Corporation | Ball grid array package fabrication with IC die support structures |
US7245500B2 (en) * | 2002-02-01 | 2007-07-17 | Broadcom Corporation | Ball grid array package with stepped stiffener layer |
US6876553B2 (en) | 2002-03-21 | 2005-04-05 | Broadcom Corporation | Enhanced die-up ball grid array package with two substrates |
US7196415B2 (en) * | 2002-03-22 | 2007-03-27 | Broadcom Corporation | Low voltage drop and high thermal performance ball grid array package |
US20040104463A1 (en) * | 2002-09-27 | 2004-06-03 | Gorrell Robin E. | Crack resistant interconnect module |
SE0300686D0 (sv) * | 2003-03-13 | 2003-03-13 | Infineon Technologies Wireless | A method and device for protection of a component or module |
TWI225694B (en) * | 2003-04-23 | 2004-12-21 | Advanced Semiconductor Eng | Flip chip package |
JP4975437B2 (ja) * | 2003-10-10 | 2012-07-11 | 台湾積體電路製造股▲ふん▼有限公司 | 電子装置 |
US7489517B2 (en) * | 2004-04-05 | 2009-02-10 | Thomas Joel Massingill | Die down semiconductor package |
US7482686B2 (en) | 2004-06-21 | 2009-01-27 | Braodcom Corporation | Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same |
US7432586B2 (en) | 2004-06-21 | 2008-10-07 | Broadcom Corporation | Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages |
US7411281B2 (en) * | 2004-06-21 | 2008-08-12 | Broadcom Corporation | Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same |
US7235880B2 (en) * | 2004-09-01 | 2007-06-26 | Intel Corporation | IC package with power and signal lines on opposing sides |
US7786591B2 (en) * | 2004-09-29 | 2010-08-31 | Broadcom Corporation | Die down ball grid array package |
CN100424842C (zh) * | 2004-11-17 | 2008-10-08 | 日本特殊陶业株式会社 | 布线基板的制造方法 |
US7269017B2 (en) * | 2004-11-19 | 2007-09-11 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices on laminate ceramic substrate |
KR100574996B1 (ko) * | 2004-11-25 | 2006-05-02 | 삼성전자주식회사 | 반도체 패키지 및 이를 이용한 메모리 카드, 및 이의제조에 이용되는 몰드 |
JP4738996B2 (ja) * | 2004-12-13 | 2011-08-03 | キヤノン株式会社 | 半導体装置 |
JP4592413B2 (ja) * | 2004-12-27 | 2010-12-01 | 三洋電機株式会社 | 回路装置 |
US7772705B2 (en) * | 2005-02-02 | 2010-08-10 | Toshiba America Electronic Components, Inc. | Low thermal resistance package |
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-
1997
- 1997-02-19 MY MYPI97000616A patent/MY123146A/en unknown
- 1997-03-07 JP JP9534409A patent/JPH11506274A/ja active Pending
- 1997-03-07 DE DE69732166T patent/DE69732166T2/de not_active Expired - Lifetime
- 1997-03-07 CN CN97190260A patent/CN1112086C/zh not_active Expired - Lifetime
- 1997-03-07 WO PCT/US1997/003511 patent/WO1997036466A1/en active IP Right Grant
- 1997-03-07 AU AU20701/97A patent/AU2070197A/en not_active Abandoned
- 1997-03-07 IL IL12210797A patent/IL122107A/xx not_active IP Right Cessation
- 1997-03-07 EP EP04021077A patent/EP1482773A1/de not_active Ceased
- 1997-03-07 KR KR1019970708078A patent/KR100288065B1/ko not_active IP Right Cessation
- 1997-03-07 EP EP97908909A patent/EP0835600B1/de not_active Expired - Lifetime
- 1997-10-24 US US08/959,546 patent/US5894410A/en not_active Expired - Lifetime
-
1999
- 1999-03-22 US US09/274,430 patent/US6747362B2/en not_active Expired - Lifetime
-
2001
- 2001-08-07 US US09/925,835 patent/US20040262038A1/en not_active Abandoned
-
2005
- 2005-12-09 US US11/298,267 patent/US20060180345A1/en not_active Abandoned
-
2007
- 2007-10-29 US US11/926,540 patent/US7543377B2/en not_active Expired - Fee Related
-
2008
- 2008-07-23 JP JP2008190163A patent/JP5247281B2/ja not_active Expired - Lifetime
-
2011
- 2011-05-26 JP JP2011117737A patent/JP2011160009A/ja active Pending
-
2014
- 2014-07-11 JP JP2014142905A patent/JP2014187410A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0835600A1 (de) | 1998-04-15 |
DE69732166D1 (de) | 2005-02-10 |
CN1185892A (zh) | 1998-06-24 |
US20040262038A1 (en) | 2004-12-30 |
WO1997036466A1 (en) | 1997-10-02 |
KR100288065B1 (ko) | 2001-05-02 |
US6747362B2 (en) | 2004-06-08 |
IL122107A0 (en) | 1998-04-05 |
US7543377B2 (en) | 2009-06-09 |
EP0835600A4 (de) | 2000-01-12 |
KR19990014736A (ko) | 1999-02-25 |
DE69732166T2 (de) | 2005-12-15 |
JP2014187410A (ja) | 2014-10-02 |
EP0835600B1 (de) | 2005-01-05 |
JP5247281B2 (ja) | 2013-07-24 |
US20080064138A1 (en) | 2008-03-13 |
AU2070197A (en) | 1997-10-17 |
US5894410A (en) | 1999-04-13 |
JPH11506274A (ja) | 1999-06-02 |
EP1482773A1 (de) | 2004-12-01 |
US20060180345A1 (en) | 2006-08-17 |
JP2011160009A (ja) | 2011-08-18 |
JP2008252152A (ja) | 2008-10-16 |
MY123146A (en) | 2006-05-31 |
CN1112086C (zh) | 2003-06-18 |
US20020057558A1 (en) | 2002-05-16 |
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