CN110740569A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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CN110740569A
CN110740569A CN201810798682.3A CN201810798682A CN110740569A CN 110740569 A CN110740569 A CN 110740569A CN 201810798682 A CN201810798682 A CN 201810798682A CN 110740569 A CN110740569 A CN 110740569A
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circuit board
printed circuit
connector
common
group
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陈健才
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Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN201810798682.3A priority Critical patent/CN110740569A/zh
Priority to TW107125756A priority patent/TWI762685B/zh
Priority to US16/117,155 priority patent/US10420219B1/en
Publication of CN110740569A publication Critical patent/CN110740569A/zh
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R27/00Coupling parts adapted for co-operation with two or more dissimilar counterparts
    • H01R27/02Coupling parts adapted for co-operation with two or more dissimilar counterparts for simultaneous co-operation with two or more dissimilar counterparts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/094Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10022Non-printed resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种印刷电路板,用于选择性地安装第一规格连接器或第二规格连接器,所述印刷电路板设有独立焊盘及共用焊盘;当所述印刷电路板安装所述第一规格连接器时,所述第一规格连接器的数据引脚安装于所述共用焊盘;及当所述印刷电路板安装所述第二规格连接器时,所述第二规格连接器的数据引脚安装于所述共用焊盘及独立焊盘。如此一来,在不增加印刷电路板尺寸的前提下,可实现标准的PCIe和PCI插槽功能的自由切换,以满足客户不同的市场需求。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板。
背景技术
一般而言,电子产品为了能够让使用者进行功能的提升和扩充,印刷电路板上会设有多个插槽作为输入与输出的接口。其中,外设部件互联标准(peripheral componentinterconnect,PCI)插槽所传输的信号通信稳定,快速外设部件互联标准(peripheralcomponent interconnect express,PCIe)插槽传输的信号具有速度快及数据处理能力强的特点。它们各自属于不同通讯协议的连接器,具体为PCI低速及PCI-E高速。
然而,目前电子产品朝向微型化与多功能化的趋势发展。如此,在印刷电路板上的面积受到限制的前提下,将无法同时提供PCI插槽及PCIe插槽以支持多种传输接口。
发明内容
鉴于上述内容,有必要提供一种印刷电路板。
一种印刷电路板,用于选择性地安装第一规格连接器或第二规格连接器,所述印刷电路板包括:
安装区域,所述安装区域设有若干共用焊盘及若干独立焊盘,所述若干共用焊盘及所述若干独立焊盘均用于传输电信号;及
本体,所述本体上设有所述安装区域;
当所述印刷电路板安装所述第一规格连接器时,所述第一规格连接器的数据引脚安装于所述若干共用焊盘;及
当所述印刷电路板安装所述第二规格连接器时,所述第二规格连接器的数据引脚安装于所述若干共用焊盘及若干独立焊盘。
进一步地,所述印刷电路板还包括第一线路组,所述第一线路组对应于所述安装区域,所述第一线路组之第一端电连接于所述安装区域内的共用焊盘。
进一步地,所述印刷电路板还包括一南桥电路,所述第一线路组之第二端电连接于所述南桥电路。
进一步地,所述印刷电路板还包括第二线路组,所述第二线路组对应于所述安装区域,所述第二线路组之第一端电连接于所述安装区域内的共用焊盘。
进一步地,所述第二线路组之第二端电连接于所述南桥电路。
进一步地,所述印刷电路板还包括若干电阻,所述若干电阻设置于所述第一线路组内。
进一步地,所述印刷电路板还包括若干电阻,所述若干电阻设置于所述第二线路组内。
进一步地,所述第一线路组及所述第二线路组均为印刷布线。
上述印刷电路板通过在安装区域上设有独立焊盘和共用焊盘,并将第一规格连接器的数据引脚安装于共用焊盘或第二规格连接器的数据引脚安装于独立焊盘和共用焊盘。如此,在不增加PCB尺寸的前提下,经由通用料件的自由切换,无需特别定制料件,以实现标准的PCIe卡和PCI卡的功能自由切换,以满足客户不同的市场需求。
附图说明
下面参照附图结合较佳实施方式对本发明作进一步详细描述。
图1为本发明印刷电路板的较佳实施方式的示意图。
图2为图1中安装区域的示意图。
图3为本发明印刷电路板的较佳实施方式的另一示意图。
主要元件符号说明
印刷电路板 100
第一规格连接器 200
第二规格连接器 300
本体 10
安装区域 12
独立焊盘 14
独立焊盘组 15
共用焊盘组 16
共用焊盘 18
南桥电路 30
第一线路组 40
第二线路组 50
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。
为了使本发明的目的、技术方案及优点能更加清楚明白,以下将会结合附图及实施方式,以对本发明中的印刷电路板作进一步详细的描述及相关说明。
请参考图1及图2,在一较佳实施方式中,一种印刷电路板(Printed CircuitBoard,PCB)100可选择性地安装一第一规格连接器200或一第二规格连接器300。
在一具体实施方式中,所述第一规格连接器200为快速外设部件互联标准(peripheral component interconnect express,PCIe)插槽。所述第二规格连接器300为一外设部件互联标准(peripheral component interconnect,PCI)插槽。
所述印刷电路板100包括一本体10。其中,所述本体10上设有一安装区域12。
所述安装区域12设有独立焊盘组15及共用焊盘组16。所述独立焊盘组15包括若干独立焊盘14,所述共用焊盘组16包括若干共用焊盘18。其中,独立焊盘14及共用焊盘18均为用于传输电信号的信号焊盘。
当所述印刷电路板100选择安装所述第一规格连接器200时,只需将所述第一规格连接器200的数据引脚(图未示)安装于所述共用焊盘18。
当所述印刷电路板100选择安装所述第二规格连接器300时,只需将所述第二规格连接器300的数据引脚(图未示)安装于所述安装区域12内的所有独立焊盘14及共用焊盘18上。如此一来,所述印刷电路板100可根据实际需求以安装不同规格的连接器,以与不同规格的扩展卡建立通信连接。
请参考图3,所述印刷电路板100上还设有一南桥电路30、一第一线路组40及一第二线路组50。
所述第一线路组40对应于所述安装区域12,所述第一线路组40之第一端电连接于所述安装区域12内的共用焊盘18。所述第一线路组40之第二端电连接于所述南桥电路30。
所述第二线路组50对应于所述安装区域12,所述第二线路组50之第一端电连接于所述安装区域12内的共用焊盘18。所述第二线路组50之第二端电连接于所述南桥电路30。
如此一来,所述第一规格连接器200可通过第一线路组40与南桥电路30建立通信连接,所述第二规格连接器300可通过第二线路组50与南桥电路30建立通信连接。
在一较佳实施方式中,所述印刷电路板100还可包括多个电阻(图未示),这些电阻可设置于所述第一线路组40内。进一步地,这些电阻也可设置于所述第二线路组50中。
举例而言,当需要将第一规格扩展卡与印刷电路板100通信连接时,只需将所述第一规格连接器200的数据引脚安装于所述共用焊盘18,并将这些电阻设置于所述第一线路组40中,但所述第二线路组50不需设置任何电阻。如此一来,插置于所述第一规格连接器200内的第一规格扩展卡便可经由第一规格连接器200的数据引脚、共用焊盘18及第一线路组40电连接至南桥电路30,以实现通信连接。
同理,当需要将第二规格扩展卡与印刷电路板100通信连接时,只需将所述第二规格连接器300的数据引脚安装于所述安装区域12内的独立焊盘14及共用焊盘18上,并将这些电阻设置于所述第二线路组50中,但所述第一线路组40不需设置任何电阻。如此一来,插置于所述第二规格连接器300内的第二规格扩展卡便可经由第二规格连接器300的数据引脚、信号焊盘14及共用焊盘18、第二线路组50电连接至南桥电路30,以实现通信连接。
例如,所述第一线路组40及所述第二线路组50的一条线路连接至共用焊盘18。当需要选择安装所述第一规格连接器200时,只需要在第一线路组40中的线路设置电阻,并且所述第二线路组50中的线路不需设置电阻。如此,可以使得其中一个共用焊盘18连接至+5V电源,以使得所述第一规格扩展卡可通过所述第一规格连接器200与所述南桥电路30通信。
当需要选择插接所述第二规格扩展卡时,只需要在第二线路组50中的线路设置电阻,并且所述第一线路组40中的线路不需设置电阻。如此,使得其中一个共用焊盘18可连接至+3.3V电源,以使得所述第二规格扩展卡300可通过所述第二规格连接器300与所述南桥电路30通信。
如此一来,通过选择性在第一线路组40或第二线路组50上设置电阻,以对应切换与所述南桥电路30通信连接的第一规格连接器200或第二规格连接器300。
在一较佳实施方式中,所述第一线路组40及所述第二线路组50均为印刷线路。
因此,当产品的设计需求为搭配PCIe卡规格时,仅需将PCIe插槽的数据引脚安装于所述共用焊盘18,并将PCIe卡插接于PCIe插槽内,即可符合其产品设计需求。当产品的设计需求为搭配PCI卡规格时,仅需将PCI插槽的数据引脚安装于这些独立焊盘14及共用焊盘18,并将PCI卡插接于PCI插槽内,即可符合其产品设计需求。
其中,上述第一规格连接器200以PCIe-X1举例,但不限于PCIe-X1,同样还适用于PCIe-X4、PCIe-X8、PCIe-X16。
如此,在不增加PCB尺寸的前提下,经由通用料件的自由切换,无需特别定制料件,以实现标准的PCIe(如X1、X4、X8、X16)卡与PCI卡功能的自由切换,以满足客户不同的市场需求。
最后应说明的是,以上实施例仅用以说明本发明的技术方案而非限制,尽管参照较佳实施例对本发明进行了详细说明。本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或等同替换,而不脱离本发明技术方案的精神和范围。并且,基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都将属于本发明保护的范围。

Claims (8)

1.一种印刷电路板,用于选择性地安装第一规格连接器或第二规格连接器,其特征在于:所述印刷电路板包括:
安装区域,所述安装区域设有若干共用焊盘及若干独立焊盘,所述共用焊盘及独立焊盘均用于传输电信号;及
本体,所述本体上设有所述安装区域;
当所述印刷电路板安装所述第一规格连接器时,所述第一规格连接器的数据引脚安装于所述若干共用焊盘;及
当所述印刷电路板安装所述第二规格连接器时,所述第二规格连接器的数据引脚安装于所述若干共用焊盘及若干独立焊盘。
2.如权利要求1所述的印刷电路板,其特征在于,所述印刷电路板还包括第一线路组,所述第一线路组对应于所述安装区域,所述第一线路组之第一端电连接于所述安装区域内的共用焊盘。
3.如权利要求2所述的印刷电路板,其特征在于,所述印刷电路板还包括一南桥电路,所述第一线路组之第二端电连接于所述南桥电路。
4.如权利要求3所述的印刷电路板,其特征在于,所述印刷电路板还包括第二线路组,所述第二线路组对应于所述安装区域,所述第二线路组之第一端电连接于所述安装区域内的共用焊盘。
5.如权利要求4所述的印刷电路板,其特征在于,所述第二线路组之第二端电连接于所述南桥电路。
6.如权利要求5所述的印刷电路板,其特征在于,所述印刷电路板还包括若干电阻,所述若干电阻设置于所述第一线路组内。
7.如权利要求5所述的印刷电路板,其特征在于,所述印刷电路板还包括若干电阻,所述若干电阻设置于所述第二线路组内。
8.如权利要求5所述的印刷电路板,其特征在于,所述第一线路组及所述第二线路组均为印刷布线。
CN201810798682.3A 2018-07-19 2018-07-19 印刷电路板 Pending CN110740569A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201810798682.3A CN110740569A (zh) 2018-07-19 2018-07-19 印刷电路板
TW107125756A TWI762685B (zh) 2018-07-19 2018-07-25 印刷電路板
US16/117,155 US10420219B1 (en) 2018-07-19 2018-08-30 Printed circuit board adaptable for multiple interconnection slots

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