IL122052A - Memory device - Google Patents
Memory deviceInfo
- Publication number
- IL122052A IL122052A IL12205297A IL12205297A IL122052A IL 122052 A IL122052 A IL 122052A IL 12205297 A IL12205297 A IL 12205297A IL 12205297 A IL12205297 A IL 12205297A IL 122052 A IL122052 A IL 122052A
- Authority
- IL
- Israel
- Prior art keywords
- memory device
- memory
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28185—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation with a treatment, e.g. annealing, after the formation of the gate insulator and before the formation of the definitive gate conductor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28229—Making the insulator by deposition of a layer, e.g. metal, metal compound or poysilicon, followed by transformation thereof into an insulating layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78642—Vertical transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7888—Transistors programmable by two single electrons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28211—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a gaseous ambient using an oxygen or a water vapour, e.g. RTO, possibly through a layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96308283A EP0843360A1 (en) | 1996-11-15 | 1996-11-15 | Memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
IL122052A0 IL122052A0 (en) | 1998-03-10 |
IL122052A true IL122052A (en) | 2003-06-24 |
Family
ID=8225151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL12205297A IL122052A (en) | 1996-11-15 | 1997-10-28 | Memory device |
Country Status (7)
Country | Link |
---|---|
US (1) | US5952692A (xx) |
EP (1) | EP0843360A1 (xx) |
AU (1) | AU736388B2 (xx) |
CA (1) | CA2220782C (xx) |
IL (1) | IL122052A (xx) |
RU (1) | RU2216821C2 (xx) |
SG (1) | SG101958A1 (xx) |
Families Citing this family (99)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000515328A (ja) * | 1996-08-01 | 2000-11-14 | シーメンス アクチエンゲゼルシヤフト | メモリセル装置の作動方法 |
US6753568B1 (en) * | 1996-11-15 | 2004-06-22 | Hitachi, Ltd. | Memory device |
GB9724642D0 (en) | 1997-11-21 | 1998-01-21 | British Tech Group | Single electron devices |
US6303942B1 (en) | 1998-03-17 | 2001-10-16 | Farmer, Ii Kenneth Rudolph | Multi-layer charge injection barrier and uses thereof |
US6125062A (en) | 1998-08-26 | 2000-09-26 | Micron Technology, Inc. | Single electron MOSFET memory device and method |
US6141260A (en) | 1998-08-27 | 2000-10-31 | Micron Technology, Inc. | Single electron resistor memory device and method for use thereof |
KR100434534B1 (ko) * | 1998-10-13 | 2004-07-16 | 삼성전자주식회사 | 쇼트키 터널 장벽을 이용한 단일 전자 트랜지스터 및 그 제조방법 |
US6548825B1 (en) * | 1999-06-04 | 2003-04-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device including barrier layer having dispersed particles |
WO2001006570A1 (de) | 1999-07-20 | 2001-01-25 | Infineon Technologies Ag | Nichtflüchtige halbleiterspeicherzelle und verfahren zur herstellung derselben |
JP2001035188A (ja) * | 1999-07-26 | 2001-02-09 | Fujitsu Ltd | 半導体装置の試験方法及び半導体装置 |
US6272038B1 (en) * | 2000-01-14 | 2001-08-07 | North Carolina State University | High-density non-volatile memory devices incorporating thiol-derivatized porphyrin trimers |
FR2808923A1 (fr) * | 2000-05-15 | 2001-11-16 | Commissariat Energie Atomique | Dispositif de memoire a blocage de coulomb, comprenant une pluralite de pieges a electrons, et procede de realisation d'un tel dispositif |
JP4656720B2 (ja) * | 2000-09-25 | 2011-03-23 | ルネサスエレクトロニクス株式会社 | 薄膜磁性体記憶装置 |
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US7576386B2 (en) | 2005-08-04 | 2009-08-18 | Macronix International Co., Ltd. | Non-volatile memory semiconductor device having an oxide-nitride-oxide (ONO) top dielectric layer |
US7763927B2 (en) * | 2005-12-15 | 2010-07-27 | Macronix International Co., Ltd. | Non-volatile memory device having a nitride-oxide dielectric layer |
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US7391652B2 (en) * | 2006-05-05 | 2008-06-24 | Macronix International Co., Ltd. | Method of programming and erasing a p-channel BE-SONOS NAND flash memory |
US7907450B2 (en) | 2006-05-08 | 2011-03-15 | Macronix International Co., Ltd. | Methods and apparatus for implementing bit-by-bit erase of a flash memory device |
US7948799B2 (en) | 2006-05-23 | 2011-05-24 | Macronix International Co., Ltd. | Structure and method of sub-gate NAND memory with bandgap engineered SONOS devices |
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DE7139683U (de) * | 1970-10-27 | 1972-09-21 | Tdk Electronics Co Ltd | Halbleiteranordnung |
US3878549A (en) * | 1970-10-27 | 1975-04-15 | Shumpei Yamazaki | Semiconductor memories |
JPH0582795A (ja) * | 1991-08-22 | 1993-04-02 | Rohm Co Ltd | 半導体記憶装置 |
JPH0555596A (ja) * | 1991-08-22 | 1993-03-05 | Rohm Co Ltd | 半導体不揮発性記憶装置 |
US5216262A (en) * | 1992-03-02 | 1993-06-01 | Raphael Tsu | Quantum well structures useful for semiconductor devices |
GB9226382D0 (en) | 1992-12-18 | 1993-02-10 | Hitachi Europ Ltd | Memory device |
JPH0669515A (ja) * | 1992-08-19 | 1994-03-11 | Fujitsu Ltd | 半導体記憶装置 |
DE69416619T2 (de) * | 1993-05-12 | 1999-09-30 | Zaidan Hojin Handotai Kenkyu Shinkokai, Sendai | Halbleiterspeicheranordnung und Verfahren zur Herstellung |
JP3613594B2 (ja) * | 1993-08-19 | 2005-01-26 | 株式会社ルネサステクノロジ | 半導体素子およびこれを用いた半導体記憶装置 |
JP2991931B2 (ja) * | 1994-07-12 | 1999-12-20 | 松下電器産業株式会社 | 半導体装置およびそれらの製造方法 |
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1997
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- 1997-10-28 US US08/958,845 patent/US5952692A/en not_active Expired - Lifetime
- 1997-10-29 AU AU43605/97A patent/AU736388B2/en not_active Ceased
- 1997-11-07 SG SG200101053A patent/SG101958A1/en unknown
- 1997-11-12 CA CA002220782A patent/CA2220782C/en not_active Expired - Fee Related
- 1997-11-14 RU RU97119733/28A patent/RU2216821C2/ru not_active IP Right Cessation
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CA2220782A1 (en) | 1998-05-15 |
SG101958A1 (en) | 2004-02-27 |
AU736388B2 (en) | 2001-07-26 |
RU2216821C2 (ru) | 2003-11-20 |
IL122052A0 (en) | 1998-03-10 |
AU4360597A (en) | 1998-05-21 |
US5952692A (en) | 1999-09-14 |
EP0843360A1 (en) | 1998-05-20 |
CA2220782C (en) | 2008-07-22 |
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