IL102831A - Device and method for plasma treatment of screens - Google Patents
Device and method for plasma treatment of screensInfo
- Publication number
- IL102831A IL102831A IL10283192A IL10283192A IL102831A IL 102831 A IL102831 A IL 102831A IL 10283192 A IL10283192 A IL 10283192A IL 10283192 A IL10283192 A IL 10283192A IL 102831 A IL102831 A IL 102831A
- Authority
- IL
- Israel
- Prior art keywords
- plasma
- substrate
- shield
- chamber
- facing surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/48—Generating plasma using an arc
- H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/47—Generating plasma using corona discharges
- H05H1/473—Cylindrical electrodes, e.g. rotary drums
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Treatment Of Fiber Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Physical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Electrotherapy Devices (AREA)
- Chemically Coating (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/767,146 US5224441A (en) | 1991-09-27 | 1991-09-27 | Apparatus for rapid plasma treatments and method |
Publications (2)
Publication Number | Publication Date |
---|---|
IL102831A0 IL102831A0 (en) | 1993-01-31 |
IL102831A true IL102831A (en) | 1996-11-14 |
Family
ID=25078620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL10283192A IL102831A (en) | 1991-09-27 | 1992-08-17 | Device and method for plasma treatment of screens |
Country Status (21)
Country | Link |
---|---|
US (2) | US5224441A (da) |
EP (1) | EP0605534B1 (da) |
JP (1) | JP3155278B2 (da) |
KR (1) | KR100294932B1 (da) |
CN (2) | CN1036079C (da) |
AT (1) | ATE148507T1 (da) |
AU (1) | AU666675B2 (da) |
CA (1) | CA2119561C (da) |
DE (1) | DE69217233T2 (da) |
DK (1) | DK0605534T3 (da) |
ES (1) | ES2096768T3 (da) |
FI (1) | FI941439A (da) |
ID (1) | ID1054B (da) |
IL (1) | IL102831A (da) |
MX (1) | MX9205420A (da) |
MY (1) | MY110816A (da) |
NO (1) | NO941075D0 (da) |
NZ (1) | NZ244055A (da) |
PT (1) | PT100880B (da) |
WO (1) | WO1993006258A1 (da) |
ZA (1) | ZA926102B (da) |
Families Citing this family (132)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3101330B2 (ja) * | 1991-01-23 | 2000-10-23 | キヤノン株式会社 | マイクロ波プラズマcvd法による大面積の機能性堆積膜を連続的に形成する方法及び装置 |
US5670224A (en) * | 1992-11-13 | 1997-09-23 | Energy Conversion Devices, Inc. | Modified silicon oxide barrier coatings produced by microwave CVD deposition on polymeric substrates |
JPH06280026A (ja) * | 1993-03-24 | 1994-10-04 | Semiconductor Energy Lab Co Ltd | 成膜装置及び成膜方法 |
FR2703073B1 (fr) * | 1993-03-26 | 1995-05-05 | Lorraine Laminage | Procédé et dispositif pour le revêtement en continu d'un matériau métallique en défilement par un dépôt de polymère à gradient de composition, et produit obtenu par ce procédé. |
FR2704558B1 (fr) * | 1993-04-29 | 1995-06-23 | Air Liquide | Procede et dispositif pour creer un depot d'oxyde de silicium sur un substrat solide en defilement. |
US6835523B1 (en) | 1993-05-09 | 2004-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for fabricating coating and method of fabricating the coating |
CH685755A5 (de) * | 1993-06-03 | 1995-09-29 | Tetra Pak Suisse Sa | Verfahren zur Herstellung eines Schichtstoffes. |
US6183816B1 (en) | 1993-07-20 | 2001-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating the coating |
US5534066A (en) * | 1993-10-29 | 1996-07-09 | International Business Machines Corporation | Fluid delivery apparatus having an infrared feedline sensor |
US5803976A (en) * | 1993-11-09 | 1998-09-08 | Imperial Chemical Industries Plc | Vacuum web coating |
CH687614A5 (de) * | 1994-02-04 | 1997-01-15 | Tetra Pak Suisse Sa | Verfahren zum Versehen einer Verpackung mit hervorragenden Sperreigenschaften in bezug auf Gase. |
CH687601A5 (de) * | 1994-02-04 | 1997-01-15 | Tetra Pak Suisse Sa | Verfahren zur Herstellung von im Innern sterilen Verpackungen mit hervorragenden Sperreigenschaften. |
DE4404690A1 (de) * | 1994-02-15 | 1995-08-17 | Leybold Ag | Verfahren zur Erzeugung von Sperrschichten für Gase und Dämpfe auf Kunststoff-Substraten |
WO1995031717A1 (en) * | 1994-05-13 | 1995-11-23 | Novel Experimental Technology | Coated plastic mold for electrophoresis gel |
US6146724A (en) * | 1994-06-06 | 2000-11-14 | The University Of Tennessee Research Corporation | One atmosphere uniform glow discharge plasma coating with gas barrier properties |
US5558843A (en) * | 1994-09-01 | 1996-09-24 | Eastman Kodak Company | Near atmospheric pressure treatment of polymers using helium discharges |
DE69533828T2 (de) * | 1994-09-19 | 2005-04-21 | Invitrogen Corp | Kunststoffgiessform fur elektrophoresegel |
DE19523444A1 (de) * | 1995-06-28 | 1997-01-02 | Antec Angewandte Neue Technolo | Verfahren zur Beschichtung von Kunststoffen oder ähnlichen weichen Werkstoffen |
US5728224A (en) * | 1995-09-13 | 1998-03-17 | Tetra Laval Holdings & Finance S.A. | Apparatus and method for manufacturing a packaging material using gaseous phase atmospheric photo chemical vapor deposition to apply a barrier layer to a moving web substrate |
DE19538176A1 (de) * | 1995-10-13 | 1997-04-17 | Arcotec Oberflaechentech Gmbh | Vorrichtung zur Behandlung flächiger Substrate mit einer Koronastation |
US5968324A (en) * | 1995-12-05 | 1999-10-19 | Applied Materials, Inc. | Method and apparatus for depositing antireflective coating |
TW303480B (en) | 1996-01-24 | 1997-04-21 | Applied Materials Inc | Magnetically confined plasma reactor for processing a semiconductor wafer |
US6116185A (en) * | 1996-05-01 | 2000-09-12 | Rietzel; James G. | Gas injector for plasma enhanced chemical vapor deposition |
US5743966A (en) * | 1996-05-31 | 1998-04-28 | The Boc Group, Inc. | Unwinding of plastic film in the presence of a plasma |
US6110540A (en) * | 1996-07-12 | 2000-08-29 | The Boc Group, Inc. | Plasma apparatus and method |
KR100296692B1 (ko) * | 1996-09-10 | 2001-10-24 | 사토 도리 | 플라즈마cvd장치 |
US6112695A (en) | 1996-10-08 | 2000-09-05 | Nano Scale Surface Systems, Inc. | Apparatus for plasma deposition of a thin film onto the interior surface of a container |
US5948166A (en) * | 1996-11-05 | 1999-09-07 | 3M Innovative Properties Company | Process and apparatus for depositing a carbon-rich coating on a moving substrate |
US5888594A (en) * | 1996-11-05 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Process for depositing a carbon-rich coating on a moving substrate |
US5829353A (en) * | 1997-06-18 | 1998-11-03 | Presstek, Inc. | Method of modulating lithographic affinity and printing members made thereby |
US6106659A (en) * | 1997-07-14 | 2000-08-22 | The University Of Tennessee Research Corporation | Treater systems and methods for generating moderate-to-high-pressure plasma discharges for treating materials and related treated materials |
US6083355A (en) * | 1997-07-14 | 2000-07-04 | The University Of Tennessee Research Corporation | Electrodes for plasma treater systems |
JP3906325B2 (ja) * | 1997-10-09 | 2007-04-18 | テトラ ラバル ホールデイングス アンド ファイナンス エス エイ | 気体及び芳香バリア特性を備える包装積層体 |
DE19802506A1 (de) * | 1998-01-23 | 1999-07-29 | Leybold Systems Gmbh | Metallhaltige Barriereschicht für Verpackungsmaterial und Verfahren zur Herstellung einer metallhaltigen Barriereschicht für Verpackungsmaterial |
US6660656B2 (en) | 1998-02-11 | 2003-12-09 | Applied Materials Inc. | Plasma processes for depositing low dielectric constant films |
US6287990B1 (en) | 1998-02-11 | 2001-09-11 | Applied Materials, Inc. | CVD plasma assisted low dielectric constant films |
US6593247B1 (en) | 1998-02-11 | 2003-07-15 | Applied Materials, Inc. | Method of depositing low k films using an oxidizing plasma |
US6303523B2 (en) | 1998-02-11 | 2001-10-16 | Applied Materials, Inc. | Plasma processes for depositing low dielectric constant films |
US6627532B1 (en) * | 1998-02-11 | 2003-09-30 | Applied Materials, Inc. | Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition |
US6054379A (en) * | 1998-02-11 | 2000-04-25 | Applied Materials, Inc. | Method of depositing a low k dielectric with organo silane |
US6667553B2 (en) | 1998-05-29 | 2003-12-23 | Dow Corning Corporation | H:SiOC coated substrates |
US6159871A (en) | 1998-05-29 | 2000-12-12 | Dow Corning Corporation | Method for producing hydrogenated silicon oxycarbide films having low dielectric constant |
US6082292A (en) * | 1999-01-05 | 2000-07-04 | Wisconsin Alumni Research Foundation | Sealing roller system for surface treatment gas reactors |
SE520491C2 (sv) * | 1999-04-07 | 2003-07-15 | Tetra Laval Holdings & Finance | Förpackningslaminat med barriäregenskaper mot gas och aromämnen |
DE19927540A1 (de) | 1999-06-16 | 2000-12-21 | Ct Therm Elek Sche Anlagen Gmb | Abgasreinigungssystem |
US6149985A (en) | 1999-07-07 | 2000-11-21 | Eastman Kodak Company | High-efficiency plasma treatment of imaging supports |
US6399489B1 (en) | 1999-11-01 | 2002-06-04 | Applied Materials, Inc. | Barrier layer deposition using HDP-CVD |
JP4841023B2 (ja) * | 2000-02-10 | 2011-12-21 | 株式会社半導体エネルギー研究所 | 成膜装置及び太陽電池の作製方法 |
US20020114937A1 (en) * | 2000-04-06 | 2002-08-22 | Albert Donald F. | Insulated barriers and methods for producing same |
US6863835B1 (en) | 2000-04-25 | 2005-03-08 | James D. Carducci | Magnetic barrier for plasma in chamber exhaust |
US6603121B2 (en) | 2000-05-19 | 2003-08-05 | Eastman Kodak Company | High-efficiency plasma treatment of paper |
JP4382265B2 (ja) * | 2000-07-12 | 2009-12-09 | 日本電気株式会社 | 酸化シリコン膜の形成方法及びその形成装置 |
US7025856B2 (en) * | 2001-02-02 | 2006-04-11 | The Regents Of The University Of California | Processing materials inside an atmospheric-pressure radiofrequency nonthermal plasma discharge |
US6802315B2 (en) | 2001-03-21 | 2004-10-12 | Hollingsorth & Vose Company | Vapor deposition treated electret filter media |
US6709721B2 (en) | 2001-03-28 | 2004-03-23 | Applied Materials Inc. | Purge heater design and process development for the improvement of low k film properties |
US7023128B2 (en) * | 2001-04-20 | 2006-04-04 | Applied Process Technologies, Inc. | Dipole ion source |
ATE536628T1 (de) | 2001-04-20 | 2011-12-15 | Gen Plasma Inc | Dipol-ionenquelle |
US7294283B2 (en) * | 2001-04-20 | 2007-11-13 | Applied Process Technologies, Inc. | Penning discharge plasma source |
JP2002322558A (ja) * | 2001-04-25 | 2002-11-08 | Konica Corp | 薄膜形成方法、光学フィルム、偏光板及び画像表示装置 |
US6926926B2 (en) * | 2001-09-10 | 2005-08-09 | Applied Materials, Inc. | Silicon carbide deposited by high density plasma chemical-vapor deposition with bias |
US6759327B2 (en) | 2001-10-09 | 2004-07-06 | Applied Materials Inc. | Method of depositing low k barrier layers |
US7091137B2 (en) * | 2001-12-14 | 2006-08-15 | Applied Materials | Bi-layer approach for a hermetic low dielectric constant layer for barrier applications |
US6890850B2 (en) | 2001-12-14 | 2005-05-10 | Applied Materials, Inc. | Method of depositing dielectric materials in damascene applications |
US6838393B2 (en) * | 2001-12-14 | 2005-01-04 | Applied Materials, Inc. | Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide |
US6878419B2 (en) * | 2001-12-14 | 2005-04-12 | 3M Innovative Properties Co. | Plasma treatment of porous materials |
EP1540714A4 (en) * | 2002-08-26 | 2007-11-14 | Sigma Lab Arizona Inc | BARRIER COATING PRODUCED BY LUMINESCENT DISCHARGE AT ATMOSPHERIC PRESSURE |
CH696013A5 (de) * | 2002-10-03 | 2006-11-15 | Tetra Laval Holdings & Finance | Vorrichtung zur Behandlung eines bandförmigen Materials in einem Plasma-unterstützten Prozess. |
CH707466B1 (de) * | 2002-10-03 | 2014-07-15 | Tetra Laval Holdings & Finance | Vorrichtung zur Durchführung eines Plasma-unterstützten Prozesses. |
US7749563B2 (en) * | 2002-10-07 | 2010-07-06 | Applied Materials, Inc. | Two-layer film for next generation damascene barrier application with good oxidation resistance |
US7208389B1 (en) * | 2003-03-31 | 2007-04-24 | Novellus Systems, Inc. | Method of porogen removal from porous low-k films using UV radiation |
WO2005028697A1 (en) | 2003-09-12 | 2005-03-31 | Applied Process Technologies, Inc. | Magnetic mirror plasma source and method using same |
JP4581366B2 (ja) * | 2003-10-03 | 2010-11-17 | コニカミノルタオプト株式会社 | 放電プラズマ処理方法 |
US20050172897A1 (en) * | 2004-02-09 | 2005-08-11 | Frank Jansen | Barrier layer process and arrangement |
US7030041B2 (en) | 2004-03-15 | 2006-04-18 | Applied Materials Inc. | Adhesion improvement for low k dielectrics |
US7229911B2 (en) | 2004-04-19 | 2007-06-12 | Applied Materials, Inc. | Adhesion improvement for low k dielectrics to conductive materials |
JP4608944B2 (ja) * | 2004-05-21 | 2011-01-12 | ソニー株式会社 | 成膜装置及び成膜方法 |
US20050277302A1 (en) * | 2004-05-28 | 2005-12-15 | Nguyen Son V | Advanced low dielectric constant barrier layers |
US7229041B2 (en) * | 2004-06-30 | 2007-06-12 | Ohio Central Steel Company | Lifting lid crusher |
US7288205B2 (en) | 2004-07-09 | 2007-10-30 | Applied Materials, Inc. | Hermetic low dielectric constant layer for barrier applications |
RU2007119783A (ru) * | 2004-10-29 | 2008-12-10 | Дау Глобал Текнолоджиз Инк. (Us) | Способ плазменно-химического осаждения из газовой фазы с улучшенной скоростью осаждения |
MX2007005123A (es) * | 2004-10-29 | 2007-06-25 | Dow Global Technologies Inc | Revestimientos resistentes a la abrasion a traves de deposicion de vapor quimica mejorada de plasma. |
US7166531B1 (en) | 2005-01-31 | 2007-01-23 | Novellus Systems, Inc. | VLSI fabrication processes for introducing pores into dielectric materials |
US8016894B2 (en) * | 2005-12-22 | 2011-09-13 | Apjet, Inc. | Side-specific treatment of textiles using plasmas |
JP4811108B2 (ja) * | 2006-05-10 | 2011-11-09 | 住友電気工業株式会社 | 被覆層の厚み計量機構およびそれを用いた被覆層形成装置 |
US7626135B2 (en) | 2006-05-10 | 2009-12-01 | Sub-One Technology, Inc. | Electrode systems and methods of using electrodes |
US7838793B2 (en) * | 2006-07-21 | 2010-11-23 | Sub-One Technology, Inc. | System and method for treating surfaces of components |
JP5093113B2 (ja) * | 2006-11-02 | 2012-12-05 | 旭硝子株式会社 | エチレン−テトラフルオロエチレン系共重合体成形品およびその製造方法 |
US20100178490A1 (en) * | 2007-03-28 | 2010-07-15 | Glenn Cerny | Roll-to-roll plasma enhanced chemical vapor deposition method of barrier layers comprising silicon and carbon |
MX2009010121A (es) | 2007-04-04 | 2009-10-12 | Tetra Laval Holdings & Finance | Unidad laminar de empaque, metodo para fabricar la unidad laminar de empaque y contenedor de empaque producido a partir de la misma. |
JP4870615B2 (ja) * | 2007-04-25 | 2012-02-08 | 株式会社アルバック | プラズマcvd成膜装置およびプラズマcvd成膜方法 |
JP4558810B2 (ja) * | 2008-02-29 | 2010-10-06 | 富士フイルム株式会社 | 成膜装置 |
JP4999737B2 (ja) * | 2008-03-14 | 2012-08-15 | 富士フイルム株式会社 | 成膜装置 |
JP5624033B2 (ja) * | 2008-06-30 | 2014-11-12 | スリーエム イノベイティブプロパティズカンパニー | 無機又は無機/有機ハイブリッドバリアフィルムの製造方法 |
JP5156552B2 (ja) * | 2008-09-08 | 2013-03-06 | 富士フイルム株式会社 | ガスバリアフィルムの製造方法 |
KR20120042748A (ko) | 2009-05-13 | 2012-05-03 | 씨브이 홀딩스 엘엘씨 | 코팅된 표면 검사를 위한 가스제거 방법 |
US7985188B2 (en) * | 2009-05-13 | 2011-07-26 | Cv Holdings Llc | Vessel, coating, inspection and processing apparatus |
US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
JP2013503974A (ja) * | 2009-09-05 | 2013-02-04 | ジェネラル・プラズマ・インコーポレーテッド | プラズマ化学気相成長装置 |
JP5270505B2 (ja) | 2009-10-05 | 2013-08-21 | 株式会社神戸製鋼所 | プラズマcvd装置 |
US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
JP6095678B2 (ja) | 2011-11-11 | 2017-03-15 | エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド | 薬剤パッケージ用の不動態化、pH保護又は滑性皮膜、被覆プロセス及び装置 |
EP2799589B1 (en) * | 2011-12-28 | 2021-04-07 | Dai Nippon Printing Co., Ltd. | Vapor deposition method having pretreatment that uses plasma |
JP5828770B2 (ja) | 2012-01-24 | 2015-12-09 | 株式会社神戸製鋼所 | 真空成膜装置 |
JP2013204053A (ja) * | 2012-03-27 | 2013-10-07 | Ulvac Japan Ltd | 成膜装置 |
EP2846755A1 (en) | 2012-05-09 | 2015-03-18 | SiO2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
CA2890066C (en) | 2012-11-01 | 2021-11-09 | Sio2 Medical Products, Inc. | Coating inspection method |
EP2920567B1 (en) | 2012-11-16 | 2020-08-19 | SiO2 Medical Products, Inc. | Method and apparatus for detecting rapid barrier coating integrity characteristics |
JP2014122419A (ja) * | 2012-11-20 | 2014-07-03 | Kobe Steel Ltd | プラズマcvd装置 |
US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
WO2014085346A1 (en) | 2012-11-30 | 2014-06-05 | Sio2 Medical Products, Inc. | Hollow body with inside coating |
GB2510389B (en) * | 2013-02-01 | 2016-08-03 | Camvac Ltd | Apparatus and method for defining a plasma |
US20140242367A1 (en) * | 2013-02-25 | 2014-08-28 | Au Optronics Corporation | Barrier film and methods of making same |
EP2961858B1 (en) | 2013-03-01 | 2022-09-07 | Si02 Medical Products, Inc. | Coated syringe. |
CA2904611C (en) | 2013-03-11 | 2021-11-23 | Sio2 Medical Products, Inc. | Coated packaging |
US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
EP2971227B1 (en) | 2013-03-15 | 2017-11-15 | Si02 Medical Products, Inc. | Coating method. |
US11066745B2 (en) | 2014-03-28 | 2021-07-20 | Sio2 Medical Products, Inc. | Antistatic coatings for plastic vessels |
CA2995225C (en) | 2015-08-18 | 2023-08-29 | Sio2 Medical Products, Inc. | Pharmaceutical and other packaging with low oxygen transmission rate |
DE102017204525A1 (de) | 2016-03-23 | 2017-09-28 | Basf Se | Verbundfolienlaminate für flexible Verpackungen |
KR102332691B1 (ko) * | 2017-08-07 | 2021-12-01 | 가스가 덴끼 가부시끼가이샤 | 표면개질장치 |
US11389825B2 (en) | 2017-08-23 | 2022-07-19 | Jiangsu Favored Nanotechnology Co., LTD | Methods for preparing nano-protective coating with a modulation structure |
CN107587119B (zh) * | 2017-08-23 | 2018-11-13 | 江苏菲沃泰纳米科技有限公司 | 一种复合结构高绝缘硬质纳米防护涂层的制备方法 |
US11185883B2 (en) | 2017-08-23 | 2021-11-30 | Jiangsu Favored Nanotechnology Co., LTD | Methods for preparing nano-protective coating |
CN107523808B (zh) * | 2017-08-23 | 2019-05-10 | 江苏菲沃泰纳米科技有限公司 | 一种有机硅纳米防护涂层的制备方法 |
CN107523809B (zh) * | 2017-08-23 | 2019-06-25 | 江苏菲沃泰纳米科技有限公司 | 一种有机硅硬质纳米防护涂层的制备方法 |
EP3700491A2 (en) | 2017-10-27 | 2020-09-02 | Corning Incorporated | Methods of treating a surface of a polymer material by atmospheric pressure plasma |
CN108315722A (zh) * | 2017-12-25 | 2018-07-24 | 兰州空间技术物理研究所 | 一种弧形电极等离子体增强化学气相沉积装置 |
CN108559974A (zh) * | 2017-12-25 | 2018-09-21 | 兰州空间技术物理研究所 | 一种基于弧形电极结构的pecvd镀膜设备 |
GB201815842D0 (en) * | 2018-09-28 | 2018-11-14 | Power Roll Ltd | Method of processing substrate for an energy storage device |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5642054B2 (da) * | 1973-07-25 | 1981-10-02 | ||
DE2900772C2 (de) * | 1979-01-10 | 1984-08-30 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Erzeugung von Schichten auf einer bandförmigen Trägerfolie |
JPS5730733A (en) * | 1980-07-30 | 1982-02-19 | Shin Etsu Chem Co Ltd | Device for continuous plasma treatment |
DE3175345D1 (en) * | 1980-08-21 | 1986-10-23 | Nat Res Dev | Coating insulating materials by glow discharge |
US4384918A (en) * | 1980-09-30 | 1983-05-24 | Fujitsu Limited | Method and apparatus for dry etching and electrostatic chucking device used therein |
US4741801A (en) * | 1981-07-17 | 1988-05-03 | Plasma Physics Corp. | Glow discharge method and apparatus and photoreceptor devices made therewith |
US4462333A (en) * | 1982-10-27 | 1984-07-31 | Energy Conversion Devices, Inc. | Process gas introduction, confinement and evacuation system for glow discharge deposition apparatus |
JPS5984516A (ja) * | 1982-11-08 | 1984-05-16 | Hitachi Ltd | 薄膜パタ−ンの連続形成装置 |
JPS59124038A (ja) * | 1982-12-29 | 1984-07-18 | Matsushita Electric Ind Co Ltd | 磁気記録媒体の製造方法 |
JPS59213735A (ja) * | 1983-05-18 | 1984-12-03 | Kuraray Co Ltd | プラズマ処理方法 |
US4557946A (en) * | 1983-06-03 | 1985-12-10 | Edward Sacher | Moisture impermeability or organosilicone films |
US4559112A (en) * | 1983-10-07 | 1985-12-17 | Nippon Telegraph & Telephone | Electrically conducting polymer film and method of manufacturing the same |
JPS60226533A (ja) * | 1984-04-25 | 1985-11-11 | Hitachi Ltd | 連続式プラズマ処理装置 |
JPH0244854B2 (ja) * | 1985-03-11 | 1990-10-05 | Hiraoka Shokusen | Shiitojobutsunopurazumashorisochi |
US4626447A (en) * | 1985-03-18 | 1986-12-02 | Energy Conversion Devices, Inc. | Plasma confining apparatus |
US4599678A (en) * | 1985-03-19 | 1986-07-08 | Wertheimer Michael R | Plasma-deposited capacitor dielectrics |
DE3521318A1 (de) * | 1985-06-14 | 1986-12-18 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum behandeln, insbesondere zum beschichten, von substraten mittels einer plasmaentladung |
JPH0734332B2 (ja) * | 1986-03-12 | 1995-04-12 | 株式会社ト−ビ | 透明導電性フイルムの製造方法 |
JPS62274080A (ja) * | 1986-05-21 | 1987-11-28 | Hitachi Ltd | プラズマ処理方法 |
US4842707A (en) * | 1986-06-23 | 1989-06-27 | Oki Electric Industry Co., Ltd. | Dry process apparatus |
US4900625A (en) * | 1987-03-03 | 1990-02-13 | Kanebo, Ltd. | Deep-colored fibers and a process for manufacturing the same |
US4920917A (en) * | 1987-03-18 | 1990-05-01 | Teijin Limited | Reactor for depositing a layer on a moving substrate |
US4968918A (en) * | 1987-07-06 | 1990-11-06 | Kanebo, Ltd. | Apparatus for plasma treatment |
US4847469A (en) * | 1987-07-15 | 1989-07-11 | The Boc Group, Inc. | Controlled flow vaporizer |
ZA884511B (en) * | 1987-07-15 | 1989-03-29 | Boc Group Inc | Method of plasma enhanced silicon oxide deposition |
WO1989003587A1 (en) * | 1987-10-14 | 1989-04-20 | The Furukawa Electric Co., Ltd. | Method and apparatus for thin film formation by plasma cvd |
JP2670623B2 (ja) * | 1988-09-19 | 1997-10-29 | アネルバ株式会社 | マイクロ波プラズマ処理装置 |
JPH02267267A (ja) * | 1989-04-06 | 1990-11-01 | Tonen Corp | フィルムへの薄膜形成方法およびその装置 |
JPH02281420A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Ind Co Ltd | 金属薄膜型磁気記録媒体の保護膜製造方法およびその装置 |
JPH0791645B2 (ja) * | 1989-04-28 | 1995-10-04 | 株式会社日立製作所 | 薄膜形成装置 |
DE3914065A1 (de) * | 1989-04-28 | 1990-10-31 | Leybold Ag | Vorrichtung zur durchfuehrung von plasma-aetzverfahren |
US5130170A (en) * | 1989-06-28 | 1992-07-14 | Canon Kabushiki Kaisha | Microwave pcvd method for continuously forming a large area functional deposited film using a curved moving substrate web with microwave energy with a directivity in one direction perpendicular to the direction of microwave propagation |
JP2587507B2 (ja) * | 1989-12-13 | 1997-03-05 | 松下電器産業株式会社 | 薄膜製造装置 |
JP2990608B2 (ja) * | 1989-12-13 | 1999-12-13 | 株式会社ブリヂストン | 表面処理方法 |
EP0527859B1 (en) * | 1990-05-10 | 1995-07-19 | Eastman Kodak Company | Apparatus for-plasma treatment of continuous material |
-
1991
- 1991-09-27 US US07/767,146 patent/US5224441A/en not_active Expired - Lifetime
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- 1992-08-13 ZA ZA926102A patent/ZA926102B/xx unknown
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- 1992-08-19 MY MYPI92001499A patent/MY110816A/en unknown
- 1992-08-21 NZ NZ244055A patent/NZ244055A/en unknown
- 1992-08-27 ID IDP463392A patent/ID1054B/id unknown
- 1992-09-11 DE DE69217233T patent/DE69217233T2/de not_active Expired - Lifetime
- 1992-09-11 CA CA002119561A patent/CA2119561C/en not_active Expired - Lifetime
- 1992-09-11 WO PCT/US1992/007681 patent/WO1993006258A1/en active IP Right Grant
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- 1992-09-11 DK DK92919953.7T patent/DK0605534T3/da active
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- 1992-09-11 KR KR1019940700987A patent/KR100294932B1/ko not_active IP Right Cessation
- 1992-09-11 AU AU25724/92A patent/AU666675B2/en not_active Ceased
- 1992-09-11 JP JP50611893A patent/JP3155278B2/ja not_active Expired - Fee Related
- 1992-09-18 PT PT100880A patent/PT100880B/pt not_active IP Right Cessation
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- 1992-09-26 CN CN92111259A patent/CN1036079C/zh not_active Expired - Fee Related
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1993
- 1993-10-25 US US08/142,641 patent/US5364665A/en not_active Expired - Lifetime
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- 1994-03-28 FI FI941439A patent/FI941439A/fi not_active Application Discontinuation
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ID1054B (id) | 1996-10-30 |
PT100880A (pt) | 1994-05-31 |
CA2119561A1 (en) | 1993-04-01 |
CN1036079C (zh) | 1997-10-08 |
CN1072734A (zh) | 1993-06-02 |
EP0605534A1 (en) | 1994-07-13 |
CN1054652C (zh) | 2000-07-19 |
JPH07502074A (ja) | 1995-03-02 |
FI941439A0 (fi) | 1994-03-28 |
MX9205420A (es) | 1993-03-01 |
DK0605534T3 (da) | 1997-02-17 |
FI941439A (fi) | 1994-03-28 |
US5224441A (en) | 1993-07-06 |
IL102831A0 (en) | 1993-01-31 |
US5364665A (en) | 1994-11-15 |
AU666675B2 (en) | 1996-02-22 |
DE69217233D1 (de) | 1997-03-13 |
PT100880B (pt) | 1999-07-30 |
ES2096768T3 (es) | 1997-03-16 |
DE69217233T2 (de) | 1997-05-22 |
CN1125267A (zh) | 1996-06-26 |
CA2119561C (en) | 2002-01-15 |
AU2572492A (en) | 1993-04-27 |
MY110816A (en) | 1999-05-31 |
WO1993006258A1 (en) | 1993-04-01 |
NO941075L (no) | 1994-03-24 |
NO941075D0 (no) | 1994-03-24 |
ATE148507T1 (de) | 1997-02-15 |
JP3155278B2 (ja) | 2001-04-09 |
EP0605534B1 (en) | 1997-01-29 |
ZA926102B (en) | 1993-03-02 |
KR100294932B1 (ko) | 2001-09-17 |
NZ244055A (en) | 1995-12-21 |
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