HUE036296T2 - Hõvezetõ szilikon kompozíció és elektronikai eszköz - Google Patents

Hõvezetõ szilikon kompozíció és elektronikai eszköz

Info

Publication number
HUE036296T2
HUE036296T2 HUE09754594A HUE09754594A HUE036296T2 HU E036296 T2 HUE036296 T2 HU E036296T2 HU E09754594 A HUE09754594 A HU E09754594A HU E09754594 A HUE09754594 A HU E09754594A HU E036296 T2 HUE036296 T2 HU E036296T2
Authority
HU
Hungary
Prior art keywords
electronic device
silicone composition
conductive silicone
conductive
composition
Prior art date
Application number
HUE09754594A
Other languages
English (en)
Hungarian (hu)
Inventor
Narumasa Domae
Tomoko Kato
Kazumi Nakayoshi
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of HUE036296T2 publication Critical patent/HUE036296T2/hu

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HUE09754594A 2008-05-27 2009-05-12 Hõvezetõ szilikon kompozíció és elektronikai eszköz HUE036296T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008138777A JP5507059B2 (ja) 2008-05-27 2008-05-27 熱伝導性シリコーン組成物および電子装置

Publications (1)

Publication Number Publication Date
HUE036296T2 true HUE036296T2 (hu) 2018-06-28

Family

ID=40873392

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE09754594A HUE036296T2 (hu) 2008-05-27 2009-05-12 Hõvezetõ szilikon kompozíció és elektronikai eszköz

Country Status (8)

Country Link
US (1) US8633276B2 (https=)
EP (1) EP2294138B1 (https=)
JP (1) JP5507059B2 (https=)
KR (1) KR101602732B1 (https=)
CN (1) CN102046728B (https=)
HU (1) HUE036296T2 (https=)
TW (1) TWI471379B (https=)
WO (1) WO2009145086A1 (https=)

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JP2012069783A (ja) * 2010-09-24 2012-04-05 Yokohama Rubber Co Ltd:The 熱伝導性シリコーン組成物およびこれを用いる実装基板
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JP5733087B2 (ja) 2011-07-29 2015-06-10 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5912600B2 (ja) * 2011-09-16 2016-04-27 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP5704049B2 (ja) * 2011-10-13 2015-04-22 信越化学工業株式会社 導電性回路形成方法
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JP5940325B2 (ja) * 2012-03-12 2016-06-29 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
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WO2014115456A1 (ja) 2013-01-22 2014-07-31 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性層及び半導体装置
JP5898139B2 (ja) 2013-05-24 2016-04-06 信越化学工業株式会社 熱伝導性シリコーン組成物
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CN111051434B (zh) * 2017-07-24 2022-03-29 陶氏东丽株式会社 多成分硬化型导热性硅酮凝胶组合物、导热性部件及散热构造体
CN111094458B (zh) * 2017-07-24 2022-03-29 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
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JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
JP6784657B2 (ja) 2017-11-10 2020-11-11 信越化学工業株式会社 消泡剤及び消泡剤の製造方法
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JP7651571B2 (ja) * 2019-12-05 2025-03-26 ダウ シリコーンズ コーポレーション 高熱伝導性の流動性シリコーン組成物
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Also Published As

Publication number Publication date
JP5507059B2 (ja) 2014-05-28
JP2009286855A (ja) 2009-12-10
EP2294138B1 (en) 2018-01-10
CN102046728B (zh) 2013-04-17
KR20110017864A (ko) 2011-02-22
EP2294138A1 (en) 2011-03-16
US20110188213A1 (en) 2011-08-04
TW201000559A (en) 2010-01-01
TWI471379B (zh) 2015-02-01
CN102046728A (zh) 2011-05-04
US8633276B2 (en) 2014-01-21
KR101602732B1 (ko) 2016-03-11
WO2009145086A1 (en) 2009-12-03

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