HRP20170015T1 - Integrirani mram cache modul - Google Patents
Integrirani mram cache modul Download PDFInfo
- Publication number
- HRP20170015T1 HRP20170015T1 HRP20170015TT HRP20170015T HRP20170015T1 HR P20170015 T1 HRP20170015 T1 HR P20170015T1 HR P20170015T T HRP20170015T T HR P20170015TT HR P20170015 T HRP20170015 T HR P20170015T HR P20170015 T1 HRP20170015 T1 HR P20170015T1
- Authority
- HR
- Croatia
- Prior art keywords
- mram
- main memory
- memory
- integrated circuit
- module
- Prior art date
Links
- 238000000034 method Methods 0.000 claims 4
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1653—Address circuits or decoders
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/56—Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
- G11C2211/564—Miscellaneous aspects
- G11C2211/5643—Multilevel memory comprising cache storage devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Semiconductor Memories (AREA)
- Memory System Of A Hierarchy Structure (AREA)
Claims (15)
1. Integralni krug (200) koji sadrži: procesor (202a, 202b, 202c, 202d) magnetorezistivni (MRAM) memorijski modul sa slučajnim pristupom (218, 318) koji sadrži MRAM cache (208a, 208b, 308a, 308b) posljednje razine i MRAM glavnu memoriju (212, 312); naznačen time, što je procesor (202a, 202b, 202c, 202d) integriran na prvom čipu (216) dok je MRAM modul integriran na drugom čipu (218) sa sučeljem (214) između prvog čipa (216) i drugog čipa (218), gdje je sučelje (214) konfigurirano tako da poveže procesor (202a, 202b, 202c, 202d) i MRAM modul (218, 318).
2. Integralni krug prema Zahtjevu 1, naznačen time što MRAM modul dalje sadrži logiku memorijskog kontrolera.
3. Integralni krug prema Zahtjevu 1, naznačen time što je MRAM modul proizveden u vidu monolitnog paketa.
4. Integralni krug prema Zahtjevu 1, naznačen time što je MRAM modul proizveden kao veći broj paketa.
5. Integralni krug prema Zahtjevu 1, naznačen time što MRAM cache memorija posljednje razine i MRAM glavna memorija sadrže STT-MRAM (Spin Transfer Torque MRAM) bit ćelije.
6. Integralni krug prema Zahtjevu 1, naznačen time što je MRAM glavna memorija podijeljena u dva ili više stogova glavne memorije i gdje je MRAM cache memorija posljednje razina podijeljena u dva ili više stogova cache memorije posljednje razine, i gdje su dva ili više stogova cache memorije posljednje razine formirani u vidu ekstenzije dva ili više stogova glavne memorije.
7. Integralni krug prema Zahtjevu 1, naznačen time što je MRAM modul formiran u dvodimenzionalnoj (2D) arhitekturi koja sadrži MRAM glavnu memoriju u središnjem dijelu i MRAM cache memoriju posljednje razine formiranu na prvoj vanjskom rubu MRAM glavne memorije.
8. Integralni krug prema Zahtjevu 7, koji dalje sadrži logički sloj formiran u drugom vanjskom rubu MRAM glavne memorije.
9. Integralni krug prema Zahtjevu 1, naznačen time što je MRAM modul formiran u trodimenzionalnoj (3D) homogenoj arhitekturi koja sadrži MRAM glavnu memoriju formiranu u jednoj ili više ravnina glavne memorije i MRAM cache memoriju posljednje razine koja je integrirana u jednoj ili u više ravnina glavne memorije.
10. Integralni krug prema Zahtjevu 7, koji dalje sadrži logički sloj formiran u ravnini logičkog sloja koja je paralelna u odnosu na jednu ili više ravnina glavne memorije.
11. Integralni krug prema Zahtjevu 1, naznačen time što je MRAM modul formiran u trodimenzionalnoj (3D) heterogenoj arhitekturi koja sadrži MRAM glavnu memoriju formiranu u jednoj ili više ravnina glavne memorije, i gdje su MRAM cache memorija posljednje razine i logički sloj integrirani u heterogenoj ravnini paralelnoj u odnosu na jednu ili više ravnina glavne memorije.
12. Integralni krug prema Zahtjevu 1, integriran u uređaj, odabran iz grupe koja sadrži set-top uređaje, muzičke plejere, video plejere, jedinice za zabavu, navigacijske uređaje, komunikacijske uređaje, PDA uređaje, jedinice sa podacima na fiksnim lokacijama i računala.
13. Postupak formiranja integralnog kruga (200), gdje postupak sadrži:
integriranje procesora (202a, 202b, 202c, 202d); i
integriranje MRAM modula (218, 318) koji sadrži MRAM cache memoriju (208a, 208b, 308a, 308b) posljednje razine i MRAM glavnu memoriju (212, 312);
naznačen time, što se integriranje procesora (202a, 202b, 202c, 202d) vrši na prvom čipu (216) a MRAM modula (218, 318) koji sadrži MRAM cache memoriju (208a, 208b, 308a, 308b) posljednje razine i MRAM glavnu memoriju (212, 312) na drugom čipu; i formiranje sučelja (214) između prvog čipa (216) i drugog čipa (218), gdje sučelje (214) povezuje procesor (202a, 202b, 202c, 202d) i MRAM modul (218, 318).
14. Postupak prema Zahtjevu 13, koji dalje sadrži integriranje logike memorijskog kontrolera i cache kontrolera na drugom čipu.
15. Postupak prema Zahtjevu 13, naznačen time što MRAM cache memorija posljednje razine i MRAM glavna memorija sadrže STT-MRAM (Spin Transfer Torque MRAM) bit ćelije.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/721,092 US9378793B2 (en) | 2012-12-20 | 2012-12-20 | Integrated MRAM module |
EP13822034.8A EP2936493B1 (en) | 2012-12-20 | 2013-12-20 | Integrated mram cache module |
PCT/US2013/076994 WO2014100619A1 (en) | 2012-12-20 | 2013-12-20 | Integrated mram cache module |
Publications (1)
Publication Number | Publication Date |
---|---|
HRP20170015T1 true HRP20170015T1 (hr) | 2017-02-24 |
Family
ID=49998680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HRP20170015TT HRP20170015T1 (hr) | 2012-12-20 | 2017-01-05 | Integrirani mram cache modul |
Country Status (8)
Country | Link |
---|---|
US (1) | US9378793B2 (hr) |
EP (1) | EP2936493B1 (hr) |
JP (1) | JP6096929B2 (hr) |
CN (1) | CN104871248B (hr) |
HR (1) | HRP20170015T1 (hr) |
RS (1) | RS55452B1 (hr) |
SM (1) | SMT201700040B (hr) |
WO (1) | WO2014100619A1 (hr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150019920A (ko) * | 2013-08-16 | 2015-02-25 | 에스케이하이닉스 주식회사 | 전자 장치 및 그 제조 방법 |
JP5992592B1 (ja) | 2015-09-16 | 2016-09-14 | 株式会社東芝 | キャッシュメモリシステム |
CN105550127A (zh) * | 2015-12-08 | 2016-05-04 | 中电海康集团有限公司 | 一种基于stt-mram的读写缓存分离的ssd控制器 |
CN105527889A (zh) * | 2015-12-08 | 2016-04-27 | 中电海康集团有限公司 | 一种采用stt-mram作为单一存储器的微控制器 |
CN105551516A (zh) * | 2015-12-15 | 2016-05-04 | 中电海康集团有限公司 | 一种基于stt-mram构建的存储器 |
KR102353058B1 (ko) * | 2016-02-02 | 2022-01-20 | 삼성전자주식회사 | 시스템 온 칩 및 그것의 동작 방법 |
CN107301455B (zh) * | 2017-05-05 | 2020-11-03 | 中国科学院计算技术研究所 | 用于卷积神经网络的混合立方体存储系统及加速计算方法 |
JP7004453B2 (ja) * | 2017-08-11 | 2022-01-21 | 株式会社半導体エネルギー研究所 | グラフィックスプロセッシングユニット |
JP6829172B2 (ja) * | 2017-09-20 | 2021-02-10 | キオクシア株式会社 | 半導体記憶装置 |
US11968843B2 (en) * | 2018-06-28 | 2024-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Processing core and MRAM memory unit integrated on a single chip |
CN112748859B (zh) * | 2019-10-30 | 2023-03-21 | 上海磁宇信息科技有限公司 | Mram-nand控制器及其数据写入方法 |
CN117667829A (zh) * | 2022-08-24 | 2024-03-08 | 华为技术有限公司 | 一种片上系统 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5502667A (en) * | 1993-09-13 | 1996-03-26 | International Business Machines Corporation | Integrated multichip memory module structure |
US6289420B1 (en) * | 1999-05-06 | 2001-09-11 | Sun Microsystems, Inc. | System and method for increasing the snoop bandwidth to cache tags in a multiport cache memory subsystem |
US20040193782A1 (en) | 2003-03-26 | 2004-09-30 | David Bordui | Nonvolatile intelligent flash cache memory |
DE10317147A1 (de) | 2003-04-14 | 2004-10-28 | Nec Electronics (Europe) Gmbh | Sicheres Speichersystem mit Flash-Speichern und Cache-Speicher |
JP3896112B2 (ja) * | 2003-12-25 | 2007-03-22 | エルピーダメモリ株式会社 | 半導体集積回路装置 |
US20050177679A1 (en) | 2004-02-06 | 2005-08-11 | Alva Mauricio H. | Semiconductor memory device |
TWI285893B (en) | 2004-11-12 | 2007-08-21 | Ind Tech Res Inst | Hybrid MRAM memory array architecture |
JP2006323739A (ja) * | 2005-05-20 | 2006-11-30 | Renesas Technology Corp | メモリモジュール、メモリシステム、及び情報機器 |
JP2006338513A (ja) | 2005-06-03 | 2006-12-14 | Renesas Technology Corp | データ処理装置 |
US20060289970A1 (en) | 2005-06-28 | 2006-12-28 | Dietmar Gogl | Magnetic shielding of MRAM chips |
US7610445B1 (en) | 2005-07-18 | 2009-10-27 | Palm, Inc. | System and method for improving data integrity and memory performance using non-volatile media |
US7464225B2 (en) * | 2005-09-26 | 2008-12-09 | Rambus Inc. | Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology |
US20070290333A1 (en) * | 2006-06-16 | 2007-12-20 | Intel Corporation | Chip stack with a higher power chip on the outside of the stack |
US7616470B2 (en) * | 2006-06-16 | 2009-11-10 | International Business Machines Corporation | Method for achieving very high bandwidth between the levels of a cache hierarchy in 3-dimensional structures, and a 3-dimensional structure resulting therefrom |
US20080133864A1 (en) | 2006-12-01 | 2008-06-05 | Jonathan Randall Hinkle | Apparatus, system, and method for caching fully buffered memory |
US20090125706A1 (en) * | 2007-11-08 | 2009-05-14 | Hoover Russell D | Software Pipelining on a Network on Chip |
KR101401560B1 (ko) * | 2007-12-13 | 2014-06-03 | 삼성전자주식회사 | 반도체 메모리 시스템 및 그것의 마모도 관리 방법 |
JP2012014787A (ja) * | 2010-06-30 | 2012-01-19 | Sony Corp | 記憶装置 |
KR101713051B1 (ko) | 2010-11-29 | 2017-03-07 | 삼성전자주식회사 | 하이브리드 메모리 시스템, 및 그 관리 방법 |
CN105702277B (zh) | 2010-12-17 | 2018-05-08 | 艾沃思宾技术公司 | 存储器系统和存储器控制器 |
JP2012243251A (ja) * | 2011-05-24 | 2012-12-10 | Elpida Memory Inc | メモリシステム |
JP2013065150A (ja) * | 2011-09-16 | 2013-04-11 | Toshiba Corp | キャッシュメモリ装置、プロセッサ、および情報処理装置 |
US20130108889A1 (en) * | 2011-10-27 | 2013-05-02 | Agency For Science, Technology And Research | Magnetoresistance Device and Memory Device Including the Magnetoresistance Device |
US20130346695A1 (en) * | 2012-06-25 | 2013-12-26 | Advanced Micro Devices, Inc. | Integrated circuit with high reliability cache controller and method therefor |
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2012
- 2012-12-20 US US13/721,092 patent/US9378793B2/en active Active
-
2013
- 2013-12-20 WO PCT/US2013/076994 patent/WO2014100619A1/en active Application Filing
- 2013-12-20 RS RS20161172A patent/RS55452B1/sr unknown
- 2013-12-20 EP EP13822034.8A patent/EP2936493B1/en active Active
- 2013-12-20 CN CN201380066504.7A patent/CN104871248B/zh active Active
- 2013-12-20 JP JP2015549786A patent/JP6096929B2/ja active Active
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2017
- 2017-01-05 HR HRP20170015TT patent/HRP20170015T1/hr unknown
- 2017-01-19 SM SM201700040T patent/SMT201700040B/it unknown
Also Published As
Publication number | Publication date |
---|---|
CN104871248A (zh) | 2015-08-26 |
JP2016502223A (ja) | 2016-01-21 |
US20140177325A1 (en) | 2014-06-26 |
EP2936493A1 (en) | 2015-10-28 |
WO2014100619A1 (en) | 2014-06-26 |
EP2936493B1 (en) | 2016-10-12 |
CN104871248B (zh) | 2017-10-20 |
SMT201700040B (it) | 2017-03-08 |
RS55452B1 (sr) | 2017-04-28 |
JP6096929B2 (ja) | 2017-03-15 |
US9378793B2 (en) | 2016-06-28 |
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