HK46786A - Semiconductor device and fabrication method thereof - Google Patents

Semiconductor device and fabrication method thereof

Info

Publication number
HK46786A
HK46786A HK467/86A HK46786A HK46786A HK 46786 A HK46786 A HK 46786A HK 467/86 A HK467/86 A HK 467/86A HK 46786 A HK46786 A HK 46786A HK 46786 A HK46786 A HK 46786A
Authority
HK
Hong Kong
Prior art keywords
oxide film
bonding pad
aluminum
semiconductor device
aluminum oxide
Prior art date
Application number
HK467/86A
Other languages
English (en)
Inventor
Tamotsu Usami
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56115081A external-priority patent/JPS5817628A/ja
Priority claimed from JP56115080A external-priority patent/JPS5817627A/ja
Priority claimed from JP56115082A external-priority patent/JPS5817629A/ja
Priority claimed from JP56122994A external-priority patent/JPS5825241A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK46786A publication Critical patent/HK46786A/xx

Links

Classifications

    • H10W70/465—
    • H10W72/019—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07553—
    • H10W72/522—
    • H10W72/531—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/553—
    • H10W72/555—
    • H10W72/59—
    • H10W72/884—
    • H10W72/932—
    • H10W72/934—
    • H10W72/952—
    • H10W72/983—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
HK467/86A 1981-07-24 1986-06-19 Semiconductor device and fabrication method thereof HK46786A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP56115081A JPS5817628A (ja) 1981-07-24 1981-07-24 半導体集積回路装置およびその製造方法
JP56115080A JPS5817627A (ja) 1981-07-24 1981-07-24 半導体集積回路装置およびその製造方法
JP56115082A JPS5817629A (ja) 1981-07-24 1981-07-24 半導体集積回路装置の製造方法
JP56122994A JPS5825241A (ja) 1981-08-07 1981-08-07 半導体集積回路装置およびその製造方法

Publications (1)

Publication Number Publication Date
HK46786A true HK46786A (en) 1986-06-27

Family

ID=27470225

Family Applications (3)

Application Number Title Priority Date Filing Date
HK467/86A HK46786A (en) 1981-07-24 1986-06-19 Semiconductor device and fabrication method thereof
HK458/86A HK45886A (en) 1981-07-24 1986-06-19 Semiconductor device and fabrication method thereof
HK466/86A HK46686A (en) 1981-07-24 1986-06-19 Semiconductor device and fabrication method thereof

Family Applications After (2)

Application Number Title Priority Date Filing Date
HK458/86A HK45886A (en) 1981-07-24 1986-06-19 Semiconductor device and fabrication method thereof
HK466/86A HK46686A (en) 1981-07-24 1986-06-19 Semiconductor device and fabrication method thereof

Country Status (6)

Country Link
DE (1) DE3227606A1 (Direct)
FR (1) FR2510307A1 (Direct)
GB (3) GB2105107B (Direct)
HK (3) HK46786A (Direct)
IT (1) IT1152455B (Direct)
MY (2) MY8600558A (Direct)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922852A (en) * 1986-10-30 1990-05-08 Nordson Corporation Apparatus for dispensing fluid materials
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
DE19736090B4 (de) * 1997-08-20 2005-04-14 Daimlerchrysler Ag Bauelement mit Schutzschicht und Verfahren zur Herstellung einer Schutzschicht für ein Bauelement
EP1188182B1 (en) * 1999-05-31 2012-08-22 Infineon Technologies AG A method of assembling a semiconductor device package
GB0018643D0 (en) * 2000-07-31 2000-09-13 Koninkl Philips Electronics Nv Semiconductor devices
CN101536184B (zh) 2006-11-13 2011-07-13 Nxp股份有限公司 焊盘结构和制造该焊盘结构的方法
CN110911353A (zh) * 2019-12-05 2020-03-24 上海华虹宏力半导体制造有限公司 形成导电互连线的方法
JP7305587B2 (ja) 2020-03-17 2023-07-10 株式会社東芝 半導体装置および検査装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1204619A (en) * 1915-04-23 1916-11-14 Enos C Verkler Garment-hanger.
US3741880A (en) * 1969-10-25 1973-06-26 Nippon Electric Co Method of forming electrical connections in a semiconductor integrated circuit
DE2243011C3 (de) * 1972-09-01 1982-04-01 Deutsche Itt Industries Gmbh, 7800 Freiburg Verfahren zum Herstellen eines Thermokompressionskontaktes
DE2403149A1 (de) * 1974-01-23 1975-07-24 Siemens Ag Halbleitervorrichtung
JPS5851425B2 (ja) * 1975-08-22 1983-11-16 株式会社日立製作所 ハンドウタイソウチ
JPS52117551A (en) * 1976-03-29 1977-10-03 Mitsubishi Electric Corp Semiconductor device
US4433004A (en) * 1979-07-11 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and a method for manufacturing the same
JPS5651843A (en) * 1979-10-04 1981-05-09 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
GB8402099D0 (en) 1984-02-29
MY8700228A (en) 1987-12-31
FR2510307B1 (Direct) 1984-11-30
GB2105107A (en) 1983-03-16
GB8402057D0 (en) 1984-02-29
GB2105107B (en) 1985-07-31
IT8222563A0 (it) 1982-07-23
GB2134709A (en) 1984-08-15
MY8600558A (en) 1986-12-31
HK46686A (en) 1986-06-27
IT1152455B (it) 1986-12-31
GB2135121B (en) 1985-08-07
GB2134709B (en) 1985-07-31
HK45886A (en) 1986-06-27
GB2135121A (en) 1984-08-22
FR2510307A1 (fr) 1983-01-28
DE3227606A1 (de) 1983-03-03

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