JPS5785240A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5785240A
JPS5785240A JP55161711A JP16171180A JPS5785240A JP S5785240 A JPS5785240 A JP S5785240A JP 55161711 A JP55161711 A JP 55161711A JP 16171180 A JP16171180 A JP 16171180A JP S5785240 A JPS5785240 A JP S5785240A
Authority
JP
Japan
Prior art keywords
thick film
position detection
detection marks
marks
film resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55161711A
Other languages
Japanese (ja)
Inventor
Masahito Nakajima
Tetsuo Hizuka
Yushi Inagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55161711A priority Critical patent/JPS5785240A/en
Publication of JPS5785240A publication Critical patent/JPS5785240A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To easily detect detection marks by a method wherein the circumference of position detection marks are formed as grounding film surfaces having different light reflection factor from that of the position detection marks and contrast is increased. CONSTITUTION:Semiconductor elements 3, 4 such as IC chips, a thick film resistor 5, wiring pads 6, and thick film wires 7 are provided on the surface of a ceramic substrate 1 and a hybrid integrated circuit is formed. Meanwhile, position detection marks 2 on the substrate 1 are formed on films 8 having remarkably different light reflection factor from that of the marks 2 such as a film consisting of black thick film resistor material. The films 8 are formed with the same process for the thick film resistor 5 by using the same material and mask for the thick film resistor 5. Next, when the wiring pads 6 and the thick film wires 7 are formed by using thick film paste composing gold as the main component, the position detection masks 2 are simultaneously formed by using the same material and the same mask.
JP55161711A 1980-11-17 1980-11-17 Semiconductor device Pending JPS5785240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55161711A JPS5785240A (en) 1980-11-17 1980-11-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55161711A JPS5785240A (en) 1980-11-17 1980-11-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5785240A true JPS5785240A (en) 1982-05-27

Family

ID=15740419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55161711A Pending JPS5785240A (en) 1980-11-17 1980-11-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5785240A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58218164A (en) * 1982-05-31 1983-12-19 Nec Home Electronics Ltd Thick film printed substrate
JPS59215736A (en) * 1983-05-24 1984-12-05 Toshiba Corp Setup of substrate and connection of bonding wire
JPS6031249A (en) * 1983-07-29 1985-02-18 Matsushita Electric Ind Co Ltd Substrate for hybrid integrated circuit
JPS60207341A (en) * 1984-03-31 1985-10-18 Rohm Co Ltd Mounting method for semiconductor chip
JPS63164291A (en) * 1986-12-25 1988-07-07 キヤノン株式会社 Flexible printed wiring
JPH03232300A (en) * 1990-08-31 1991-10-16 Matsushita Electric Ind Co Ltd Printed board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58218164A (en) * 1982-05-31 1983-12-19 Nec Home Electronics Ltd Thick film printed substrate
JPS59215736A (en) * 1983-05-24 1984-12-05 Toshiba Corp Setup of substrate and connection of bonding wire
JPS6031249A (en) * 1983-07-29 1985-02-18 Matsushita Electric Ind Co Ltd Substrate for hybrid integrated circuit
JPS60207341A (en) * 1984-03-31 1985-10-18 Rohm Co Ltd Mounting method for semiconductor chip
JPS63164291A (en) * 1986-12-25 1988-07-07 キヤノン株式会社 Flexible printed wiring
JPH03232300A (en) * 1990-08-31 1991-10-16 Matsushita Electric Ind Co Ltd Printed board

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