JPS6031249A - Substrate for hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To accurately and rapidly recognize a pattern by forming a special shape on a substrate, and using it as for recognizing the pattern. CONSTITUTION:A high resistance paste having, for example, 100kOMEGA or larger is printed and dried in a square of 1.5-2.0mm. on a portion 4, on which the circuit of a white ceramic substrate 1 is not formed, and conductive paste 6 of triangular shape is then printed and dried on the center. When a wire bonding is performed, four positions of a recognition mark formed after fixing on the substrate are pattern-recognized, and wire-bonded. Thus, since the resistor 5 has very high contrast due to gold or silver triangular mark 6, a recognition mistake can be eliminated. Since the accuracy of printing the recognition mark is high due to the same screen as the bonding pad, and the position of the substrate can be recognized by the accuracy within + or -10mum.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a hybrid integrated circuit board, and more particularly to a recognition mark for automatically detecting the position on the board when automating the manufacturing thereof. .

Conventional configuration and its problems In general, parts such as ICf and BU are directly pasted on the board,
When connecting with gold or aluminum wire, the bonding wire on the board side is extremely dense, so in fully automated wire bonding, the reference plane (two sides) or , a reference hole is created and bonding is performed using that surface or hole as a reference. Also, in special cases, a part of the circuit on the board is used and it is recognized in many turns. For example, as shown in the 11th step, the name of the conductor circuit 2 formed on the substrate 1 is
Some people use S3, recognize it, and implement it.

On the other hand, an error of about ±150 μm or more will occur in the reference hole and landing pad part, and errors will occur because the board is fixed mechanically. Cumulatively, these two errors are ±200μ
m or more, and there were cases where it came off from the bonding pad.

In the latter case, in the case of a typical thick film hybrid integrated circuit, a white ceramic substrate is used and the circuit is formed using Acr/PD conductors, but when the pattern is recognized in the part shown in Figure 1, the position accuracy is However, since there is not much difference in color tone between the conductor 2 and the substrate 1, it often occurs that the color cannot be recognized.

OBJECT OF THE INVENTION The present invention obviates such conventional drawbacks.
The present invention provides a hybrid integrated circuit board that allows accurate and rapid pattern recognition.

Structure of the Invention The substrate of the present invention has a special shape (triangular, round, etc.) that has a thick contrast with the color tone of the substrate in one or more parts of the substrate and has no similar pattern around the periphery.

This method forms rectangles (etc.) and uses them for pattern recognition, and provides a circuit board with positional accuracy and no erroneous recognition.

Description of examples An embodiment of the present invention will be described below with reference to the drawings.

A case where an IC chip is wire-bonded to a band on a substrate will be explained. As shown in FIG. 2, a high resistance paste (Ru02 series) of 100Ω or more is applied to a portion 4 of the white ceramic substrate 1 where no circuit is formed (particularly a diagonally distant location is desirable). 1.5~2.0m like
After printing on m squares and drying, a triangular conductor paste 6 (gold paste or A (1/1: ld paste, etc.)) is printed and dried in the center.

It is most desirable to form this triangular mark 6 using the same material 1 and the same screen as the wire bonding band forming conductor on the board.

Next, the optimum conditions for the paste used (86o~960°C
Bake for 1 hour). When wire bonding is performed using the substrate of the present invention, after fixing the substrate, pattern recognition is performed on the four recognition marks formed, and wire bonding is performed. If this method is followed, the resistor 6 is black and the triangular mark 6 is gold or silver, so there is a great contrast, and not only is there no recognition error, but the recognition mark is printed on the same screen as the bonding pad. Therefore, the accuracy is good, ±10
It is possible to recognize the position of the board with an accuracy of within μm, making it possible to perform high-precision wire bonding.

In the above embodiment, a method of forming a mark for position recognition with very high accuracy was described, but the recognition accuracy was ±10011 m.
However, if it can be used, the resistor 6 shown in the above embodiment
can be omitted.

That is, a triangular mark can be directly printed on position 4 of the white ceramic substrate 1 shown in FIG. 2 using a resistor base (RuO2 based) and fired, and used as a recognition mark. In this method, since the wire bond band and the identification mark are printed on different screens, the accuracy is slightly lower than in the previous embodiment due to screen alignment errors. However, the production cost is low.

In the above two embodiments, the case where a white ceramic substrate is used has been explained, but when a colored substrate (for example, a black substrate) is used, the position of the substrate can be recognized with high accuracy with the following configuration.

That is, a triangular mark for recognition is formed on the same screen as the wire bonding pad at a portion 4 of the substrate 1 shown in FIG. 2, and the conductor is printed, dried, and fired using the triangular mark. According to this embodiment, ±1oμm can be obtained without increasing manufacturing cost.
It is possible to form marks on a substrate that can be recognized as a pattern with accuracy within

In the above three embodiments, the configuration in which the recognition mark is made of a circuit-forming conductor or resistive paste has been described, but other than that, a recognition mark can also be made by printing and curing a colored pigment that has a high contrast with the substrate. That is, a recognition mark is formed on a white substrate using a black or blue epoxy resin, and the epoxy resin is cured before use. According to this method, recognition marks of any color can be formed and can be cured at low temperatures. In addition to white and black pattern recognition, the mark recognition method uses a color camera to recognize colors, which has a significant effect on improving the recognition rate.

Effects of the Invention As described above, according to the present invention, the defects caused by the positional deviation of the second wire bonding, which occurred in the conventional method, are eliminated, and the reliability of the hybrid integrated circuit itself can be improved to 1). . Furthermore, the recognition errors caused by the conventional method in which a part of the circuit conductor is used for recognition can be completely resolved. Although the embodiments have been described for wire bonding, it goes without saying that the present invention can be applied to other types of component mounting as well as to substrates other than ceramic substrates. It is unnecessary to explain that shapes other than those described in this embodiment can also be used for the trench recognition mark.

[Brief explanation of drawings]

Fig. 1 is a plan view showing a part of a conventional hybrid integrated circuit board, Fig. 2 is a plan view showing an embodiment of the hybrid integrated circuit board of the present invention, and Fig. 3a is an enlarged view of the same main part. Plan view, b shows a sectional view of the same part. 1...Ceramic substrate, 2...Circuit conductor, 3...Recognition part, 4...Recognition mark forming part, 6...Recognition Resistor for use, 6...
・Recognition mark.

Claims (1)

[Claims] (1) A hybrid integrated circuit board 0 in which a mark in one or more parts of the board is marked in a color different from that of the board, or in a predetermined shape with a large contrast. Print the paste and print the conductive paste in a predetermined shape in the center,
Substrate 0 for a hybrid integrated circuit according to claim 1, characterized in that the mark is formed by firing ('jI) Printing a conductor paste of a predetermined shape on a portion of the colored substrate not related to the circuit formation portion , firing to form a mark f: A board for a hybrid integrated circuit according to claim 1 characterized in (4) In the part of the white ceramic board where no circuit is formed,
Butter-7 sea &- in the specified shape using resistance paste
Juice + --hI--J-7>I-f-#I: 9Mr
I-1 The substrate for a hybrid integrated circuit according to item 1 of the scope of the invention.