JPS60242694A - Thick film circuit board - Google Patents
Thick film circuit boardInfo
- Publication number
- JPS60242694A JPS60242694A JP15754784A JP15754784A JPS60242694A JP S60242694 A JPS60242694 A JP S60242694A JP 15754784 A JP15754784 A JP 15754784A JP 15754784 A JP15754784 A JP 15754784A JP S60242694 A JPS60242694 A JP S60242694A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- thick film
- film circuit
- insulating resin
- coat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、厚膜回路基板の絶縁性樹脂コートパターンに
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an insulating resin coating pattern for a thick film circuit board.
第１図〜第４図は従来技術を示し、第１図は厚膜回路基
板の要部平面図、第２図は第１図のＡ−Ａ断面図であシ
、第３図及び第４図は第１図の厚膜回路基板ｌこ電子部
品を塔載した電子回路装置である。ただし第３図、第４
図においては、第１図の保護被覆５にて隠ぺいした部分
は図示していない。第１図及び第２図に示す厚膜回路基
板はセラミック基板１上に端子導体２ａ〜２ｅから構成
される導体を印刷焼成して形成した後、抵抗体３を印刷
焼成して形成し、次に抵抗６を保護するガラスコート４
を印刷焼成して形成した後、半田レジスト機能を有する
熱硬化性樹脂による絶縁性樹脂コート５を印刷し加熱硬
化して形成する。第１図、第２図に示した回路基板に、
トランジスタ６やコンデンサ７等の電子部品を搭載接続
して、電子回路装置を形成する際に、端子導体２ａ〜２
ｅの位置が錯綜して、例えば第６図のごとくトランジス
タ６を端子導体２ａ〜２Ｃに塔載接続すべき所を第４図
のごとくトランジスタ６を端子導体２ｂ〜２ｄに塔載接
続してしまう欠点があった。1 to 4 show the prior art, in which FIG. 1 is a plan view of essential parts of a thick film circuit board, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIGS. The figure shows an electronic circuit device on which electronic components are mounted on the thick film circuit board of FIG. However, Figures 3 and 4
In the figure, the portion hidden by the protective coating 5 in FIG. 1 is not shown. The thick film circuit board shown in FIGS. 1 and 2 is formed by printing and firing a conductor consisting of terminal conductors 2a to 2e on a ceramic substrate 1, and then printing and firing a resistor 3. Glass coat 4 to protect resistance 6
After printing and baking, an insulating resin coat 5 made of a thermosetting resin having a solder resist function is printed and heated to harden. On the circuit board shown in Figures 1 and 2,
When mounting and connecting electronic components such as the transistor 6 and the capacitor 7 to form an electronic circuit device, the terminal conductors 2a to 2
The position of e is confusing, for example, where the transistor 6 should be connected to the terminal conductors 2a to 2C as shown in FIG. 6, the transistor 6 is connected to the terminal conductors 2b to 2d as shown in FIG. There were drawbacks.
〔発明の背景」
本発明の目的は、上記した従来技術の欠点をなくシ、厚
膜回路基板に電子部品を塔載する際搭載位置、方向が明
視化された厚膜回路基板を提供するにある。[Background of the Invention] An object of the present invention is to eliminate the drawbacks of the above-mentioned prior art and provide a thick film circuit board in which the mounting position and direction of electronic components can be clearly seen when mounting electronic components on the thick film circuit board. It is in.
本発明では、上記目的を実現するために、厚膜回路基板
をその最上層の印刷塗膜であるところの絶縁性樹脂コー
トを使用して、塔載する電子部品の電極端子に対応する
端子導体を一電子部品毎にまとめて露出する部分以外を
すべて被覆することによυ、かつまた上記絶縁性樹脂コ
ートの色相を該樹脂コートの下層構造の色相と相違させ
ることによシ、上記の電子部品の塔載位置及び塔載位置
を明視化するものである。In order to achieve the above object, the present invention uses an insulating resin coat, which is the top printed coating film, on a thick film circuit board to form terminal conductors corresponding to electrode terminals of electronic components mounted on the thick film circuit board. By covering all parts other than the exposed parts for each electronic component, and by making the hue of the insulating resin coat different from the hue of the underlying structure of the resin coat, the electronic This is to clearly visualize the tower mounting position and tower mounting position of parts.
そして、本発明の回路基板を用いれば、電子部品塔載ミ
スがいちじるしく減少する。By using the circuit board of the present invention, errors in mounting electronic components can be significantly reduced.
第５図は、本発明の一実施例の厚膜回路基板の要部平面
図であシ、第６図は第５図の厚膜回路基板に電子部品な
塔載接続した電子回路装置の要部平面図である。ただし
第６図においては、第５図の絶縁性樹脂コート５にて隠
ぺいした部分を図示していない。FIG. 5 is a plan view of essential parts of a thick film circuit board according to an embodiment of the present invention, and FIG. 6 is a main part of an electronic circuit device in which electronic components are mounted and connected to the thick film circuit board of FIG. FIG. However, in FIG. 6, the portion hidden by the insulating resin coat 5 in FIG. 5 is not shown.
第５図の厚膜回路基板は、白色のアルミナ基板（図示せ
ず）上に、Ａｇ−Ｐｄを主成分とするペーストを印刷し
、５ＤＯ〜１０００℃にて焼成して灰色の配線導体と端
子導体２ａ〜２ｅからなる導体を形成した後、Ｒｕ０＝
を主成分とするペーストを印刷し、５００〜１０００℃
にて焼成して黒色の抵抗体３を形成し、次にホウケイ酸
鉛を主成分とするペーストを印刷し、４５０〜６００℃
にて焼成して白色あるいは酸化クロム成分を添加して着
色した一色のガラスコー）４．４’を形成して、更にエ
ポキシ基を内含させた化学構造を有するシリコーン樹脂
を主成分とし、顔料にて青色に着色したペーストを印刷
し、１２０〜２５０℃にて加熱硬化して青色の絶縁性樹
脂コート５を形成する。第５図においてガラスコート４
は抵抗体３を保護するように形成するほか、端子導体２
ａ 、 ２ｂ 、 ２ｃを相互に区分するように設けて
いるので半田レジストとして機能する。同様にガラスコ
ート４′は端子導体２ｄ 、 ２ｅを相互に区分する半
田レジストとして機能する。″
また、絶縁性樹脂コート５は、ガラスコート４．４′を
保護し、端子導体２ａ 、 ２ｂ 、 ２ｃ及び端子導
体２ｄ 、 ２ｅをそれぞれまとめて露出することによ
シ、それぞれ第６図のトランジスタ６及びコンデンサ７
の塔載接続位置を明示し、また端子導体群２ａ 、 ２
ｂ 、 ２Ｃと２ｄ 、 ２ｅとの間を区分する半田レ
ジストとして機能するものであるＯ〔発明の効果〕
以上述べたごとく、本発明によれば、厚膜回路基板上に
おける電子部品の塔載位置及び方向が明視化されるため
、電子部品を塔載する作業工程において塔載位置の確認
が容易となシ、作業速度を高めることができて、また搭
載位置を誤まることに起因する不良の低減をはかること
ができる。The thick film circuit board shown in Fig. 5 is made by printing a paste mainly composed of Ag-Pd on a white alumina substrate (not shown) and baking it at 5DO to 1000°C to form gray wiring conductors and terminals. After forming the conductors 2a to 2e, Ru0=
Print a paste mainly composed of
A black resistor 3 is formed by firing at 450 to 600°C, followed by printing a paste containing lead borosilicate as the main component.
The main component is silicone resin, which has a chemical structure containing an epoxy group, and is made into a pigment. A blue insulating resin coat 5 is formed by printing a blue colored paste and curing it by heating at 120 to 250°C. In Figure 5, glass coat 4
is formed to protect the resistor 3, and also to protect the terminal conductor 2.
Since a, 2b, and 2c are provided so as to be separated from each other, they function as a solder resist. Similarly, the glass coat 4' functions as a solder resist that separates the terminal conductors 2d and 2e from each other. '' Furthermore, the insulating resin coat 5 protects the glass coat 4.4' and exposes the terminal conductors 2a, 2b, 2c and the terminal conductors 2d, 2e all together, thereby forming the transistor of FIG. 6 and capacitor 7
The terminal conductor group 2a, 2
O functions as a solder resist that separates between b, 2C and 2d, 2e [Effects of the Invention] As described above, according to the present invention, the mounting position of electronic components on a thick film circuit board can be adjusted. Since the position and direction are clearly visible, it is easy to confirm the mounting position during the work process of mounting electronic components, increasing the work speed, and eliminating defects caused by incorrect mounting positions. can be reduced.
第１図は従来技術による厚膜回路基板の要部平面図、第
２図は第１図のＡ−Ａ断面図、第３図、第４図は第１図
の厚膜回路基板を使用した電子回路装置の要部平面図、
第５図は本発明による厚膜回路基板の要部平面図、第６
図は第５図の厚膜回路基板を使用した電子回路装置の要
部平面図でおる。
１ セラミック基板、２ａ〜２ｅ・・・端子導体、３・
・・抵抗体、４ 、４’・・ガラスコート、５・・絶縁
性樹脂コート、６・ トランジスタ、７・・コンデンサ
。
代理人弁理士 高 橋 明 夫
グ ／ＩＡ
才２ 図
才 ３ 囚
７４ 図
才２囚Figure 1 is a plan view of essential parts of a conventional thick film circuit board, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figures 3 and 4 are diagrams showing the thick film circuit board used in Figure 1. A plan view of the main parts of the electronic circuit device,
FIG. 5 is a plan view of essential parts of the thick film circuit board according to the present invention, and FIG.
The figure is a plan view of essential parts of an electronic circuit device using the thick film circuit board of FIG. 1 Ceramic substrate, 2a to 2e...terminal conductor, 3.
...Resistor, 4, 4'...Glass coat, 5.Insulating resin coat, 6.Transistor, 7.Capacitor. Representative Patent Attorney Akio Takahashi / IA Sai 2 Zu Sai 3 Prisoners 74 Zu Sai 2 Prisoners
Claims (1)
を印刷焼成して形成した後、絶縁性樹脂コートを印刷硬
化して形成する厚膜回路基板ｌこおいて上記ガラスコー
トは、上記の一電子部品毎にまとめて露出される複数の
端子導体の間隙に設けられて複数の端子導体を相互に区
分するパターン形状を有し、上記絶縁性樹脂コートは、
電子部品接続用の端子導体を一電子部品毎にまとめて露
出するパターン形状を有し、かつ上記絶縁性樹脂コート
の色相は、上記セラミック基板導体配線、抵抗体及びガ
ラスコートのそれぞれの色相と相違してなることを特徴
とする厚膜回路基板。A thick film circuit board is formed by printing and baking conductor wiring, two resistors and a glass coat on a ceramic substrate, and then printing and curing an insulating resin coat. The insulating resin coat has a pattern shape that is provided in the gaps between the plurality of terminal conductors that are exposed together for each component and separates the plurality of terminal conductors from each other.
It has a pattern shape that exposes terminal conductors for connecting electronic components together for each electronic component, and the hue of the insulating resin coat is different from the hue of each of the ceramic substrate conductor wiring, the resistor, and the glass coat. A thick film circuit board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15754784A JPS60242694A (en) | 1984-07-30 | 1984-07-30 | Thick film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15754784A JPS60242694A (en) | 1984-07-30 | 1984-07-30 | Thick film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60242694A true JPS60242694A (en) | 1985-12-02 |
Family
ID=15652062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15754784A Pending JPS60242694A (en) | 1984-07-30 | 1984-07-30 | Thick film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60242694A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08274429A (en) * | 1995-03-29 | 1996-10-18 | Kyocera Corp | Wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212851B2 (en) * | 1972-09-26 | 1977-04-09 |
-
1984
- 1984-07-30 JP JP15754784A patent/JPS60242694A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212851B2 (en) * | 1972-09-26 | 1977-04-09 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08274429A (en) * | 1995-03-29 | 1996-10-18 | Kyocera Corp | Wiring board |
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