JP3460384B2 - Composite electronic component and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component used in electronic equipment having a digital circuit such as a personal computer and a mobile phone, and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional composite electronic component and a method for manufacturing the same will now be described with reference to the drawings of a network resistor which is a type of composite electronic component.

FIG. 4A is a top view of a conventional network resistor, and FIG. 4B is a sectional view taken along the line AA of FIG. 4A.

In the figure, reference numeral 1 is an insulating substrate made of ceramic or the like. Reference numeral 2 denotes a plurality of electrode terminals provided from the side portion to the side end portion of the insulating substrate 1. Reference numeral 3 is a resistance element which is a passive element provided on the upper surface of the insulating substrate 1 so as to be electrically connected to the plurality of electrode terminals 2. Reference numeral 5 is a first protective film provided so as to cover a part of the electrode terminal 2 and the resistance element 3. 6 is a seal printed on the first protective film 5 . Reference numeral 7 is a second protective film provided on the first protective film 5 via the marking 6, and the surface area of the second protective film 7 is substantially the same as the surface area of the first protective film 5. However, as shown in FIG. 4 (b), the second
The surface area of the protective film 7 is slightly larger.

The manufacturing method of the conventional network resistor configured as described above will be described below.

FIG. 5 is a process chart showing a method for manufacturing a network resistor, which is a type of conventional composite electronic component.

First, as shown in FIG. 5 (a), a silver-based conductor paste such as silver-palladium is screen-printed from a side portion to a side end portion of the insulating substrate 1 made of ceramic or the like,
A plurality of electrode terminals 2 are formed by firing at about 800 to 900 ° C.

Next, as shown in FIG. 5 (b), a ruthenium oxide-based resistor paste is screen-printed on the upper surface of the insulating substrate 1 so as to overlap a part of the electrode terminals 2, and about 800
The plurality of resistance elements 3 that are passive elements are formed by firing at ˜900 ° C. At this time, if necessary, a passivation film may be formed to cover the resistance element 3.

Next, as shown in FIG. 5C, a probe (not shown) for measuring a resistance value is brought into contact with the electrode terminal 2 ,
While measuring the resistance value of the resistance element 3, the resistance element 3 is laser-trimmed until the predetermined resistance value is obtained, and the resistance value is adjusted.

Next, as shown in FIG. 5 (d), a glass paste is screen-printed so as to cover a part of the electrode terminal 2 and the resistance element 3 and dried at about 100 to 150 ° C.
The protective film 5 is formed.

Next, as shown in FIG. 5 (e), a stamp 6 indicating the resistance value, the product number, etc. is printed on the first protective film 5,
Dry at about 100-150 ° C.

Next, as shown in FIG. 5F, a second protective film is formed by using a mask having a pattern similar to that of the first protective film 5.
Screen-print the glass paste that constitutes the protective film 7 ,
The first protective film 5, the imprint 6 and the second protective film 7 are dried and collectively baked at about 550 to 650 ° C.

In order to improve the electrical conductivity and solderability (mountability) of the network resistor formed as described above, the electrode terminal 2 is nickel-plated 8
And a solder plating 9 were applied to manufacture a conventional network resistor.

[0014]

However, in the above-described conventional structure and manufacturing method, the second protective film 7 formed on the first protective film 5 is misaligned during printing the glass paste, and the print pattern is bleeding. Alternatively, since the glass paste flows into the divided slits of the insulating substrate 1 and into the electrode terminals 2 due to the flow of the glass paste at the time of firing, the exposed area of the electrode terminals 2 becomes small, and the solder fillet necessary for mounting is appropriately formed. However, there was a problem of affecting the strength.

The present invention solves the above-mentioned conventional problems, and provides a composite electronic component and a method of manufacturing the same that suppress misalignment and bleeding of the second protective film during printing of the glass paste and have good mountability. The purpose is.

[0016]

In order to solve the above-mentioned problems, a composite electronic component of the present invention comprises an insulating substrate having a plurality of electrode terminals on its side surface and an electrical contact with the plurality of electrode terminals.
A plurality of passive elements provided so as to be connected to each other, a first protective film provided so as to cover a part of the electrode terminal and the passive element, and at least an upper surface of the first protective film .
A second protective film which is provided so as to substantially overlap the entire surface and has a smaller surface area than the first protective film ;
The second protective film protects the softening point of the glass paste from the first protective film.
It is higher than the softening point of the glass paste of the protective film.
It

The method of manufacturing the composite electronic component of the present invention
Is formed by printing and firing a conductor paste on the side surface of the insulating substrate to form a plurality of electrode terminals, and at least one of the resistor paste, the dielectric paste, and the magnetic paste so as to overlap a part of the plurality of electrode terminals. Printing and firing a paste containing one to form a plurality of passive elements,
The first protective film is formed by printing and baking a glass paste so as to cover a part and the passive element, and a surface area of the first protective film is smaller than almost the entire upper surface of the first protective film.
To form the first protective film so that
The glass paste having a softening point higher than the softening point is printed and fired to form the second protective film .

[0018]

With the above structure, the second protective film is misaligned at the time of printing the glass paste, the print pattern is bleeding,
Alternatively, it is possible to reduce the flow of the glass paste into the electrode terminal side portion.

Furthermore, since the glass paste having a higher softening point than the glass paste for the first protective film is used as the glass paste for the second protective film, it is difficult for the glass paste to flow during firing and the first protective film pattern. Stick out
It is possible to prevent the.

Further, in the above-mentioned manufacturing method, since the first protective film and the second protective film are separately fired, not only the surface of the protective film becomes flat as compared with batch firing, but also at the time of printing and firing. Bubbles generated in the glass paste are easily removed in each firing step, and pinholes can be reduced.

[0021]

EXAMPLES Example 1 Hereinafter, a composite electronic component and a method for manufacturing the same in one embodiment of the present invention will be described with reference to the drawings of a network resistor which is a kind of composite electronic component.

FIG. 1A shows a net according to an embodiment of the present invention.
Ttowaku resistors top view of FIG. 1 (b) is a B-B sectional view of FIG. 1 (a).

In the figure, 11 is an insulating substrate made of ceramic or the like. Reference numeral 12 denotes a plurality of electrode terminals made of a silver-based conductor paste such as silver-palladium and provided from the side portion to the side end portion of the insulating substrate 11. 13 is an electrode terminal 1
2 is a passive element provided on the upper surface of the insulating substrate 11 so as to be electrically connected to the element 2. Reference numeral 15 is a first protective film provided so as to cover a part of the electrode terminal 12 and the resistance element 13. Reference numeral 16 is a stamp printed on the upper surface of the first protective film 15. Reference numeral 17 denotes a second protective film provided on the upper surface of the first protective film 15 via the stamp 16, and a glass paste made of the same material as that of the first protective film 15 is used. The surface area of the second protective film 17 is smaller than the surface area of the first protective film 15. Reference numeral 18 denotes nickel plating provided on a part of the electrode terminal 12. Reference numeral 19 is a solder plating provided so as to cover the nickel plating 18.

FIG. 2 is an enlarged view of an electrode terminal which is a main part of the network resistor in one embodiment of the present invention.
Reference numeral 0 is a solder fillet formed by soldering.
As shown in FIG. 2, since the second protective film 17 smaller surface area than the first protective layer 15, portions of the electrode terminals 12
Therefore, the exposed area of the electrode terminal 12 can be sufficiently secured. Therefore, the required amount of the solder fillet 20 is formed, and the soldering strength is improved when the solder fillet 20 is mounted on the printed circuit board.

A method of manufacturing the network resistor having the above-described structure will be described below with reference to the drawings.

FIG. 3 is a process chart showing a method for manufacturing a network resistor according to an embodiment of the present invention.

First, as shown in FIG. 3A, from the side portion to the side end portion of the insulating substrate 11 made of ceramic or the like,
Screen-print a silver-based conductor paste such as silver-palladium, and burn at about 800-900 ° C to form a plurality of electrode terminals 1.
Form 2.

Next, as shown in FIG. 3B, the ruthenium oxide-based resistor paste is overlapped with a part of the electrode terminal 12 on the upper surface of the insulating substrate 11 so as to overlap with a part of the electrode terminal 12. Screen printing, about 800-900 ℃
By firing, a plurality of resistance elements 13 that are passive elements are formed. At this time, if necessary, a passivation film may be formed to cover the resistance element 13.

Next, as shown in FIG. 3C, the electrode terminal 1
2. Contact a probe for resistance measurement (not shown) to 2
While measuring the resistance value of the resistance element 13, the resistance element 13 is laser-trimmed until the predetermined resistance value is obtained, and the resistance value is adjusted.

Next, as shown in FIG. 3D, at least a part of the electrode terminal 12 and the resistance element 13 are covered,
After screen-printing a glass paste having a softening point of 555 ° C. and drying at about 100 to 150 ° C., a stamp 16 indicating a resistance value, a product number, etc. is printed on a part of the glass paste, and the temperature is about 100 to 150 ° C. To dry. Then, the glass paste and the imprint 16 are fired at 600 to 620 ° C. to form the first protective film 15 and the imprint 16.

Next, as shown in FIG. 3E, a glass paste is screen-printed on the first protective film 15 using a mask having a surface area smaller than the surface area of the first protective film 15, After drying at 100-150 ° C, 600-620
The second protective film 17 is formed by firing at a temperature of ℃ to manufacture a network resistor.

In this embodiment, the softening point of the glass paste of the first protective film 15 and the softening point of the glass paste of the second protective film 17 are the same, but the first protective film 15
If a black glass paste having a softening point of 555 ° C. is used for the second protective film and a transparent color glass paste having a softening point of 575 ° C. is used for the second protective film 17, the softening point of the glass paste of the second protective film 17 is Is higher, so the glass
Since it is possible to prevent the first flow and to use a different glass paste, the first protective film 15 can be formed in a blackish color and the second protective film 17 can be formed in a transparent color.
The marking 16 has the effect of being easy to read.

Further , in this embodiment, the network resistor, which is a kind of composite electronic component, has been described, but the invention is not limited to this, and other composite electronic component such as a chip type capacitor may be used.

In addition, although the method of manufacturing one composite electronic component has been described in the present embodiment, a plurality of composite electronic components are formed on the insulating substrate by the same steps as those in the above embodiment, and these composite electronic components are formed. The composite electronic component may be manufactured by dividing it into pieces.

[0035]

As described above, according to the present invention, by forming the surface area of the second protective film smaller than the surface area of the first protective film, the positional deviation of the second protective film during printing the glass paste, the substrate Bleed of print pattern on the slit,
It is possible to provide a composite electronic component capable of reducing the inflow of the glass paste into the side portions of the electrode terminals.

Further , since a required amount of solder fillet can be formed in the electrode terminal portion during soldering , the mountability is improved when mounting on a printed circuit board, and the insulating substrate on which a large number of elements are formed is divided. Even in some cases, split burrs and chips can be reduced, and a composite electronic component having a stable shape can be provided.

Further , since the manufacturing method in which the first protective film and the second protective film are separately fired, the surface of the protective film becomes flatter than that of the co-firing and bubbles generated in the protective film. It is possible to provide a method for manufacturing a composite electronic component in which bubbles generated in the protective film are suppressed and the exposure of the passive element in the pinhole portion is reduced because the bubbles easily come off.

[Brief description of drawings]

1A is a top view of a composite electronic component according to an embodiment of the present invention, FIG. 1B is a sectional view taken along line BB of FIG. 1A.

FIG. 2 is an enlarged view of an electrode terminal, which is the main part of the same.

[FIG. 3] The same process drawing

FIG. 4A is a top view of a composite electronic component in a conventional example. (B) AA sectional view of FIG.

[FIG. 5] Same process diagram

[Explanation of symbols]

11 Insulating substrate 12 electrode terminals 13 Resistance element 15 First protective film 17 Second protective film

Claims (2)

(57) [Claims] 1. An insulating substrate having a plurality of electrode terminals on a side surface thereof , a plurality of passive elements provided so as to be electrically connected to the plurality of electrode terminals, and a part of the electrode terminals.
And a first protective film provided so as to cover the passive element and at least almost the entire upper surface of the first protective film.
Provided such that, and with and a first small second surface area than the protective layer of the protective film, the protective second
The film has a softening point of the glass paste that is the glass of the first protective film.
A composite electronic component with a higher softening point than the paste . 2. A conductor paste is printed on the side surface of the insulating substrate.
A plurality of electrode terminals are formed by firing, and a paste containing at least one of a resistor paste, a dielectric paste, and a magnetic paste is printed and fired so as to overlap a part of the plurality of electrode terminals. Individual passive elements are formed, and a glass paste is printed and fired so as to cover a part of the electrode terminals and the passive elements to form a first protective film, and a top surface of the first protective film is almost formed. A gas that forms the first protective film so that it is smaller than the surface area of the first protective film as a whole.
A glass pellet with a softening point higher than that of the lath paste.
A method for manufacturing a composite electronic component, comprising forming a second protective film by printing and baking a paste .