JPH08330114A - Composite electronic component and its manufacture - Google Patents

Abstract

PURPOSE: To provide a composite electronic component which has sufficient soldering strength and mountability and also provide a method for manufacturing such a component by preventing the deviation in position or bleeding at the time of printing glass paste for forming a protective film. CONSTITUTION: This component is constituted of an insulating substrate 11, a plurality of electrode terminals 12 formed on the side faces of the insulating substrate 11, a plurality of resistance elements 13, passive elements, which are electrically connected to the electrode terminals 12, a first protective film 15 which covers a part of the electrode terminals 12 and the entire part of the passive elements 13, and a second protective film 17 which has a smaller surface area than the first one. Because of this structure, a composite electronic component with a good solderability and a method for manufacturing such a component can be provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component used in electronic equipment having a digital circuit such as a personal computer and a mobile phone, and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional composite electronic component and a method for manufacturing the same will now be described with reference to the drawings of a network resistor which is a type of composite electronic component.

FIG. 4A is a top view of a conventional network resistor, and FIG. 4B is a sectional view taken along the line AA of FIG. 4A.

In the figure, reference numeral 1 is an insulating substrate made of ceramic or the like. Reference numeral 2 denotes a plurality of electrode terminals provided from the side portion to the side end portion of the insulating substrate 1. Reference numeral 3 is a resistance element which is a passive element provided on the upper surface of the insulating substrate 1 so as to electrically connect the plurality of electrode terminals 2. Reference numeral 5 is a first protective film provided so as to cover a part of the electrode terminal 2 and the resistance element 3. 6 is a seal printed on the first protective film 4. Reference numeral 7 is a second protective film provided on the first protective film 5 via the marking 6. The surface area of the second protective film 7 is almost the same as the surface area of the first protective film 5, but as shown in FIG. The surface area is slightly larger.

The manufacturing method of the conventional network resistor configured as described above will be described below.

FIG. 5 is a process chart showing a method for manufacturing a network resistor, which is a type of conventional composite electronic component.

First, as shown in FIG. 5 (a), a silver-based conductor paste such as silver-palladium is screen-printed from a side portion to a side end portion of the insulating substrate 1 made of ceramic or the like,
A plurality of electrode terminals 2 are formed by firing at about 800 to 900 ° C.

Next, as shown in FIG. 5 (b), a ruthenium oxide-based resistor paste is screen-printed on the upper surface of the insulating substrate 1 so as to overlap a part of the electrode terminals 2, and about 800
The plurality of resistance elements 3 that are passive elements are formed by firing at ˜900 ° C. At this time, if necessary, a passivation film may be formed to cover the resistance element 3.

Next, as shown in FIG. 5 (c), a probe (not shown) for measuring a resistance value is brought into contact with the electrode terminal 2, and the resistance value of the resistance element 3 is measured. Laser trimming 4 is performed on the resistance element 3 until the value is obtained, and the resistance value is adjusted.

Next, as shown in FIG. 5 (d), a glass paste is screen-printed so as to cover a part of the electrode terminal 2 and the resistance element 3 and dried at about 100 to 150 ° C.
The protective film 5 is formed.

Next, as shown in FIG. 5 (e), a stamp 6 indicating the resistance value, the product number, etc. is printed on the first protective film 5,
Dry at about 100-150 ° C.

Next, as shown in FIG. 5 (f), a glass paste is screen-printed using a mask having a pattern similar to that of the first protective film 5 and dried, and the first protective film 5 and the imprint are imprinted. 6 and the second protective film 7 to about 800-900.
Bake together at ℃.

In order to improve the electrical conductivity and solderability (mountability) of the network resistor formed as described above, the electrode terminal 2 is nickel-plated 8
And a solder plating 9 were applied to manufacture a conventional network resistor.

[0014]

However, in the above-described conventional structure and manufacturing method, the second protective film 7 formed on the first protective film 5 is misaligned during printing the glass paste, and the print pattern is bleeding. Alternatively, since the glass paste flows into the divided slits of the insulating substrate 1 and into the electrode terminals 2 due to the flow of the glass paste at the time of firing, the exposed area of the electrode terminals 2 becomes small, and the solder fillet necessary for mounting is appropriately formed. However, there was a problem of affecting the strength.

The present invention solves the above-mentioned conventional problems, and provides a composite electronic component and a method of manufacturing the same that suppress misalignment and bleeding of the second protective film during printing of the glass paste and have good mountability. The purpose is.

[0016]

In order to solve the above-mentioned problems, the present invention is provided so as to be electrically connected to an insulating substrate having a plurality of electrode terminals on its side surface and the plurality of electrode terminals. A plurality of passive elements, a first protective film provided so as to cover a part of the electrode terminals and the passive element, and a surface area of at least the upper surface of the first protective film that is greater than the surface area of the first protective film. And a second protective film having a small size.

Further, a conductor paste is printed and fired on the side surface of the insulating substrate to form a plurality of electrode terminals, and a resistor paste, a dielectric paste or a magnetic material is formed so as to overlap a part of the plurality of electrode terminals. A paste containing at least one of the pastes is printed and fired to form a plurality of passive elements, and a glass paste is printed and fired so as to cover a part of the electrode terminals and the passive elements. A method for manufacturing a protective film is provided, in which a glass paste is printed and fired on the upper surface of the first protective film so as to have a surface area smaller than that of the first protective film to form a second protective film. is there.

[0018]

With this configuration, misalignment and printing pattern bleeding that occur when printing the second protective film glass paste,
Further, it is possible to reduce the inflow of the glass paste into the electrode terminal side portion.

Further, when a glass paste having a higher softening point than the glass paste for the first protective film is used as the glass paste for the second protective film, the glass paste does not easily flow during firing and sticks out of the first protective film pattern. Can be prevented.

Further, according to the above manufacturing method, the first
Since the protective film and the second protective film are separately fired, the surface of the protective film is not only flat as compared with batch firing, but bubbles generated in the glass paste during printing / firing are easily removed in each firing process. Therefore, pinholes can be reduced.

[0021]

【Example】

(Embodiment 1) Hereinafter, a composite electronic component and a method of manufacturing the same according to an embodiment of the present invention will be described with reference to the drawings of a network resistor which is a kind of composite electronic component.

FIG. 1 (a) is a top view of the network resistor of the present invention, and FIG. 1 (b) is a sectional view taken along line BB of FIG. 1 (a).

In the figure, 11 is an insulating substrate made of ceramic or the like. Reference numeral 12 denotes a plurality of electrode terminals made of a silver-based conductor paste such as silver-palladium and provided from the side portion to the side end portion of the insulating substrate 11. 13 is an electrode terminal 1
2 is a resistance element which is a passive element provided on the upper surface of the insulating substrate 11 so as to be electrically connected to the element 2. Reference numeral 15 is a first protective film provided so as to cover a part of the electrode terminal 12 and the resistance element 13. Reference numeral 16 is a stamp printed on the upper surface of the first protective film 15. Reference numeral 17 denotes a second protective film provided on the upper surface of the first protective film 15 through the stamp 16, and a glass paste made of the same material as that of the first protective film 15 is used. The surface area of the second protective film 17 is smaller than the surface area of the first protective film 15. Reference numeral 18 denotes nickel plating provided on a part of the electrode terminal 12. Reference numeral 19 is a solder plating provided so as to cover the nickel plating 18.

FIG. 2 is an enlarged view of an electrode terminal which is a main part of the network resistor in one embodiment of the present invention.
Reference numeral 0 is a solder fillet provided by solder plating. As shown in the figure, since the second protective film 17 has a smaller surface area than the first protective film 15, the second protective film 17 does not flow into the electrode terminal portion, so that the exposed area of the electrode terminal 12 can be sufficiently secured. Therefore, the required amount of the solder fillet 20 is formed, and the soldering strength is improved when the solder fillet 20 is mounted on the printed circuit board.

A method of manufacturing the network resistor having the above-described structure will be described below with reference to the drawings.

FIG. 3 is a process chart showing a method for manufacturing a network resistor according to an embodiment of the present invention.

First, as shown in FIG. 3A, from the side portion to the side end portion of the insulating substrate 11 made of ceramic or the like,
Screen-print a silver-based conductor paste such as silver-palladium, and burn at about 800-900 ° C to form a plurality of electrode terminals 1.
Form 2

Next, as shown in FIG. 3B, the ruthenium oxide-based resistor paste is overlapped with a part of the electrode terminal 12 on the upper surface of the insulating substrate 11 so as to overlap with a part of the electrode terminal 12. Screen printing, about 800-900 ℃
By firing, a plurality of resistance elements 13 that are passive elements are formed. At this time, if necessary, a passivation film may be formed to cover the resistance element 13.

Next, as shown in FIG. 3C, a probe (not shown) for measuring a resistance value is brought into contact with the electrode terminal 12,
While measuring the resistance value of the resistance element 13, the laser trimming 14 is performed on the resistance element 13 until the predetermined resistance value is obtained, and the resistance value is adjusted.

Next, as shown in FIG. 3D, at least a part of the electrode terminal 12 and the resistance element 13 are covered,
After screen-printing a glass paste having a softening point of 555 ° C. and drying at about 100 to 150 ° C., a stamp 16 indicating a resistance value, a product number, etc. is printed on a part of the glass paste, and the temperature is about 100 to 150 ° C. To dry. Then, the glass paste and the imprint 16 are fired at 600 to 620 ° C. to form the first protective film 15 and the imprint 16.

Next, as shown in FIG. 3E, a glass paste is screen-printed on the first protective film 15 using a mask having a surface area smaller than that of the first protective film 15. After drying at about 100-150 ° C, 600 ° C-6
The second protective film 17 is formed by baking at 20 ° C. to manufacture a network resistor.

In this embodiment, the softening point of the glass paste of the first protective film 15 and the softening point of the glass paste of the second protective film 17 are the same, but the first protective film 15
If a black glass paste having a softening point of 555 ° C. is used for the second protective film and a transparent glass paste having a softening point of 575 ° C. is used for the second protective film 17, the softening point of the glass paste of the second protective film 17 is Since it is higher, the flow of the glass paste during firing can be prevented, and when different glass pastes are used, the first protective film 15 has a black color,
Since the second protective film 17 can be formed in a transparent color, the marking 16 has the effect of being easy to read.

In this embodiment, the network resistor, which is a kind of composite electronic component, has been described, but the invention is not limited to this, and other composite electronic component such as a chip type capacitor may be used.

Although the method of manufacturing one composite electronic component has been described in the present embodiment, a plurality of composite electronic components are formed on the insulating substrate by the same process as in the above embodiment, and these are separated into individual pieces. The composite electronic component may be manufactured by dividing into.

[0035]

As described above, according to the present invention, by forming the surface area of the second protective film smaller than the surface area of the first protective film, the positional deviation of the second protective film during printing the glass paste, the substrate Bleed of print pattern on the slit,
It is possible to provide a composite electronic component capable of reducing the inflow of the glass paste into the side portions of the electrode terminals.

Further, the required amount of solder fillet can be formed in the electrode terminal portion, the mountability is improved when mounting on the printed circuit board, and even when the insulating substrate having a large number of elements is divided, It is possible to reduce split burrs and chips and provide a composite electronic component having a stable shape.

Further, since the first protective film and the second protective film are separately fired, the surface of the protective film is flatter than that of the co-firing, and bubbles generated in the protective film escape. Since it becomes easier, suppress bubbles generated in the protective film,
It is possible to provide a method for manufacturing a composite electronic component that reduces exposure of a passive element at a pinhole portion.

[Brief description of drawings]

FIG. 1A is a top view of a composite electronic component according to an embodiment of the present invention. FIG. 1B is a sectional view taken along line BB of FIG. 1A.

FIG. 2 is an enlarged view of an electrode terminal, which is the main part of the same.

[FIG. 3] The same process drawing

4A is a top view of a composite electronic component in a conventional example, and FIG. 4B is a sectional view taken along line AA of FIG. 4A.

[FIG. 5] Same process diagram

[Explanation of symbols]

 11 Insulating Substrate 12 Electrode Terminal 13 Resistance Element 15 First Protective Film 17 Second Protective Film

Claims (4)

[Claims] 1. An insulating substrate having a plurality of electrode terminals on a side surface, a plurality of passive elements provided so as to be electrically connected to the plurality of electrode terminals, a part of the electrode terminals and the A composite electronic component comprising: a first protective film provided so as to cover a passive element; and a second protective film having a surface area smaller than that of the first protective film on at least an upper surface of the first protective film. 2. The composite electronic component according to claim 1, wherein the glass softening point of the second protective film is higher than the softening point of the first protective film. 3. A conductor paste is printed on the side surface of the insulating substrate.
A plurality of electrode terminals are formed by firing, and a paste containing at least one of a resistor paste, a dielectric paste, and a magnetic paste is printed and fired so as to overlap a part of the plurality of electrode terminals. A plurality of passive elements are formed, and a glass paste is printed and baked to cover a part of the electrode terminals and the passive elements to form a first protective film, and an upper surface of the first protective film. A method of manufacturing a composite electronic component, comprising: forming a second protective film by printing and firing a glass paste so that the surface area of the first protective film is smaller than that of the first protective film. 4. The method for manufacturing a composite electronic component according to claim 3, wherein the second protective film is formed by using a glass paste having a softening point of the glass paste higher than that of the first protective film.