JPS5957495A - Printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a printed wiring board that can form a wiring pattern and simultaneously connect the pattern to a mounted component.

<Prior art> Generally, printed wiring boards installed in electronic devices are made by forming a wiring pattern made of a conductive material on a board made of an insulating material by photo-etching, then placing electronic components on this board, and soldering the terminals. A method of connecting and fixing the wire to the wiring pattern is adopted.

However, all of the conventional methods require a special process to connect the terminals of electronic components to the wiring pattern after forming the wiring pattern on the board, resulting in a large number of processes and are complicated. It had the disadvantage of being.

Therefore, an object of the present invention is to provide a novel wiring board in which a wiring pattern can be formed and, at the same time, the wiring pattern can be connected and fixed to a mounted electronic component.

<Example> The present invention will be explained in detail below based on the drawings.

FIGS. 1 to 3 are diagrams showing the manufacturing process of the substrate of the present invention.

In the figure, first, recesses 2.3 and the like into which electronic components are inserted are formed on the surface of an insulating substrate 1. The recess 2 is suitable for inserting a small chip-type electronic part 8 such as a resistor or capacitor with a wire terminal led out from the main body, and the terminal is connected to the board surface and the road surface as shown in the figure. It is formed in two stages.

On the other hand, the fourth part 3 is for inserting a chip component having terminals formed on the surface of the main body, and is simply formed in a concave shape, and its depth is determined so that the surface of the chip component and the surface of the board become the road surface. . Further, the opening shape d of these recesses 2.3 is provided in accordance with the shape of the electronic component to be inserted, and it is considered that the electronic component to be inserted can be determined based on this opening shape.

After forming the four parts 2.3 on the surface of the insulating substrate 1 in this way, adhesive 4 is injected into the recess using a dispenser (dispenser), and the electronic component 5.6 is inserted and fixed. (See Figure 2). As the adhesive 4, an epoxy or urethane adhesive is used.

Thereafter, a thermosetting or photocurable conductive ink is applied to the surface of the substrate on the side where the recess is formed using a silk screen or the like, and the electronic component 5.6 inserted into the through recess 2.3 shown in FIG. It is constructed by forming a wiring pattern 7 that is connected to the terminal as appropriate.

The thermosetting conductive ink is in the form of a paste made mainly of carbon, and hardens in about 10 minutes at a low temperature of 80° C. after being applied, so it does not have a negative effect on electronic components and substrates. On the other hand, photocurable conductive ink is a mixture of a viscous resin (ink) containing a photosensitive substance and metal powder such as silver. The resin is cured by the action, and has the advantage of curing without heating.

According to such a structure, conventionally, a wiring pattern is formed on a board, electronic components are mounted, and the terminals of the electronic components and the wiring pattern are connected and fixed by soldering or the like.

In contrast, according to the present invention, component terminals and wiring patterns can be connected by simply mounting electronic components on a board and forming wiring patterns, thereby reducing the number of complicated steps.

In the above embodiment, the electronic components are fixed in the recesses with adhesive, but the adhesive can be omitted if the recesses are formed so that the electronic components can be fitted or the strength of the wiring pattern is sufficiently increased. Figure 4 shows an example of the use of the substrate of the present invention, and as shown in the figure, the substrate 1 is also used as the back panel of a calculator. According to this configuration, the work of connecting the board to the panel can be omitted, the number of parts can be significantly reduced, and the panel structure can be simplified, making it possible to provide an extremely thin and inexpensive calculator. Note that 8 is a key rubber with contacts, and 9 is a display panel.

Effects> As described above, the printed wiring board of the present invention has a recess for mounting electronic components on the surface of the insulating substrate, and a heat-hardening layer on the surface of the board so as to connect to the electronic component terminal inserted into the recess. Since the wiring pattern is formed using a conductive ink such as a photocurable ink, the wiring pattern can be connected to the mounted component at the same time as the wiring pattern is formed. therefore,
In accordance with the present invention, FIGS. 1 to 3 are diagrams showing the manufacturing process of the substrate of the present invention, and FIG. 4 is a diagram showing an example of use of the same substrate.

1 is the board, 2 and 3 are the recesses, 4 is the adhesive, 5.6 is the electronic component, and 7 is the wiring pattern

Claims (1)

[Claims] 1 Form recesses for mounting electronic components on the surface of an insulating substrate, and form wiring patterns using conductive ink such as thermosetting or photocurable ink on the surface of the substrate so as to connect to the electronic component terminals inserted in these four areas. A printed wiring board characterized by comprising: