JPS62216396A - Manufacture of resin cubicle with conductor pattern for electronic equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] A method of forming a conductive pattern on a flat housing material made of a heat-softening resin material and then molding the housing material into a desired housing shape by thermoforming. A resin casing with a conductor pattern can be easily manufactured using conventional techniques.

[Industrial Field of Application J] The present invention relates to resin casings for electronic devices such as telephones and portable radios, and particularly relates to a method for manufacturing casings with conductor patterns in which circuit conductors are directly formed on the casing.

For example, FIG. 3 of the drawings shows a conventional general telephone set. Reference numerals 1 and 2 indicate a telephone main body and a handset, respectively, and each of these includes a printed circuit board 12 and 22 on which circuit components 13 and 33 are mounted, and a resin casing 11 and 2.
It is constructed by incorporating it within. However, with this structure,
Since it incorporates a printed circuit board, it is disadvantageous for miniaturization, and the number of parts and assembly steps are large, making it difficult to reduce costs.

As a solution to this problem, as shown in FIG.
It has already been proposed to reduce the number of parts and assembly man-hours by forming circuit conductor patterns (not shown) on the inner surfaces of 1A and 21 and mounting circuit components (leadless chips and 7-chip components) directly on the housing. has been done. However, in the case of this structure, it is not easy to manufacture the casings +1A and 21A with conductor patterns, and they have not yet been put into practical use.

[Conventional technology]

As a method of manufacturing a case with a conductor pattern as described above,
Conventionally, a conventional resin housing 11 as shown in FIG.
A method has been devised in which a conductor pattern is formed on the inner surface of 21 by a conventional screen printing method or a method using photolithography technology.

[Problem that the invention seeks to solve]

However, the above method has a problem in that when the shape of the casing becomes complicated, it becomes extremely difficult to manufacture a screen printing plate or a mask for pattern exposure, print conductive paste, and perform pattern exposure, and it is not practical.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art as described above and to provide a method for manufacturing a resin casing with a conductor pattern suitable for practical use.

[Means for Solving Problems c] In order to solve the problems of the prior art described in section 2, the present invention provides the following steps: The present invention provides a method of forming this housing material into a predetermined housing shape by heat molding.

[For production]

In the above-mentioned method of the present invention, it is possible to easily form a conductor pattern on the flat housing material using the conventional screen printing method or photolithography method, and it is also possible to form the flat housing material into the housing shape. This can be easily accomplished by the conventionally used pressure forming method or vacuum forming method, and therefore can be easily carried out without particularly requiring any new technology.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 schematically shows the degree T when manufacturing the base portion (for convenience, indicated with the same reference numerals as the housing) of the conductor patterned housing 11A of the telephone main body 1 shown in FIG. 2 by the method of the present invention. The details will be explained below.

(1) First, a flat housing material 11B as shown in FIG. 1(A) is made of a heat-softening resin material such as nylon or epoxy.

(2) Next, as shown in FIG. 1(B), a conductor pattern IIc is formed on the surface of this flat housing material 11B (which becomes the inner surface during molding of the housing). This conductor pattern formation is
A conductor layer is formed by a conventional screen printing method, by electroless plating or further electrolytic plating on the entire surface of the housing material 11B, or by bonding a conductor/conductor foil, and on this conductor layer. It can be easily formed using a photolithography method or the like in which a resist pattern is formed and pattern exposure and etching are performed.

(3) Then, by molding the flat housing material 11B on which the conductor pattern IIC is formed while heating it by a conventionally commonly used pressure forming method or vacuum forming method,
A base portion 11A of the casing with a conductive pattern as shown in FIG. 1(C) is molded.

Thereafter, circuit components (chip components) are mounted on the conductor pattern IIC of the base portion 11A.

〔Effect of the invention〕

As described above, the method of the present invention involves forming a conductive pattern on a flat housing material in advance and molding it into the desired housing shape. It can be easily carried out using conventional techniques without being influenced by the final shape of the body, and is extremely practical.

[Brief explanation of drawings]

FIG. 1 is a process diagram showing an embodiment of the present invention, FIG. 2 is a schematic diagram of a telephone using a casing with a conductive pattern, and FIG. 3 is a schematic diagram of a telephone using a printed circuit board. 1... Telephone main body 2... Handset/receiver 11A, 21A... Resin casing 11 with conductor pattern
B...Flat housing material 11C...Conductor pattern 13.33...Circuit components

Claims (1)

[Scope of Claims] 1. (a) After forming a conductive pattern on the surface of a flat housing material made of a heat-softening resin material, (b) heat-molding the housing material into a desired housing shape. A method for manufacturing a resin casing with a conductive pattern, characterized by: