JPS59159594A - Metal printed board and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal printed circuit board such as an aluminum printed circuit board and a method for manufacturing the same.

FIG. 1 is a plan view showing a part of a conventional aluminum printed circuit board, and FIG. 2 is a sectional view taken along the line AA in FIG.

In the figure, 1 is an aluminum thin plate, 2 is an insulating film provided on one side of the aluminum thin plate 1, 6 is a wiring made of copper formed on the insulating film 2, and 4 is a rectangular terminal part made of copper connected to a wiring slot. The wiring 6 and the terminal portion 4 constitute a conductor pattern.

Such aluminum printed circuit boards have good heat dissipation properties and can be easily deformed, so they have recently begun to be widely used.

FIG. 6 is a plan view showing a state in which electronic elements are attached to the aluminum printed circuit board shown in FIGS. 1 and 2, and FIG. 4 is a front sectional view of the same. In the figure, 5 is an electronic element, 6 is a plate-shaped terminal of the electronic element 5, and the plate-shaped terminal 6 is attached to the terminal portion 4 with solder.

As described above, in the conventional aluminum printed circuit board, an electronic element 5 having a plate-shaped terminal 6 can be attached, but an electronic element having a Riet wire cannot be attached thereto. Unfortunately, it is impossible to install electronic elements on the back side of the aluminum printed circuit board, that is, on the side where the insulating film 2 is not provided. Further, even if conductor patterns are formed on both sides, it is not possible to connect the two conductor patterns, and therefore the wiring 6 cannot be densely arranged.

This invention was made to solve the above-mentioned problems, and it is possible to attach an electronic device having a Riet wire.
It is an object of the present invention to provide a metal printed circuit board on which electronic elements can be attached to both sides and wiring density can be increased, and a method for manufacturing the same.

In order to achieve this purpose, in this invention, an insulating film is provided on both sides of a metal/thin plate, a conductor pattern is formed on the insulating film, a groove is provided on the conductor pattern, and a resin is filled in the water hole. A small hole is provided in the center of the resin, and a conductor layer is provided connected to the conductor pads on both sides and attached to the inner surface of the small hole. In order to manufacture such a metal printed circuit board, a through-hole hole position indicating means is used to create a hole in a thin metal plate using a press machine or a drilling device, and the water hole is filled with resin, and the through-hole position indicating means is used. A small hole is formed in the center of the resin using a drilling device, and the conductor foil is connected to the conductive foil strip or conductor batano formed on both sides of the thin metal plate by electroless plating, and the wire is attached to the inner surface of the small hole. A first mesogi layer is provided, and a second plating layer is provided on the first mesogi layer by electrolytic plating.

FIG. 5 is a plan view showing a part of the aluminum printed circuit board according to the present invention, and FIG. 6 is a front cross-sectional view showing the aluminum printed circuit board shown in FIG. 5 with an electronic element having a lead wire attached thereto. . In the figure, 7 is a circular terminal connected to the wiring 3, 8 is a terminal provided in the terminal 27, 9 is resin filled in the water hole 8, and 10 is provided in the center of the resin 9. The small holes 11 are connected to the terminal parts 7 formed on both sides of the thin aluminum plate 1, and the electroless copper plating layer 12 is attached to the inner surface of the small hole 10, and the electrolytic copper plating layer 12 is provided on the plating layer 11. , 13 is a through hole formed in the middle heat part of the critical 8, 14 is an electronic element, 15 is a lead wire of the electronic element 14, the lead wire 15 is inserted into the through hole 13, and the lead wire 15 is inserted into the solder 16. It is connected to the plating layer 12 on the terminal part Z.

In this aluminum printed circuit board, an electronic element 14 having a lead wire 15 can be attached, and it is also possible to attach the electronic element 14 to both sides. Since the conductor backs on both sides are connected to the agate via two layers 11 and 12, the wiring can be densely arranged.

In the above embodiments, an aluminum printed circuit board, that is, a printed circuit board in which the metal thin plate is the aluminum thin plate 1, has been described, but iron, copper, etc. may also be used as the metal thin plate, and if iron is used, it is inexpensive. It is possible to manufacture a metal printed circuit board, and if copper is used, it is possible to obtain a metal printed circuit board with very good heat dissipation. Further, in the above embodiment, the conductor layer is the plating layer 11.
．． 12, other conductor layers may be provided. Further, in the above embodiment, the electroless copper plating layer 11 and the electrolytic copper plating layer 12 are provided, but the plating metal is not limited thereto, and may be nickel or the like.

Further, as the resin 9, Evogin resin or the like can be used. Furthermore, the plating layer 11 is only in some of the small holes 10.
．． The manufacturing method of the aluminum printed circuit board shown in FIGS. 5 and 6 will be explained in detail with reference to FIG. 7.

First, a substrate as shown in FIG. 7(a) is prepared, in which an insulating film 2 is provided on both sides of an aluminum thin plate 1, and a copper foil 17 is formed on the insulating film 2. Next, NO (number
cal control) drawing or film manuscript.
, an NC tape having data on the center position of the through hole 13 is made. Next, a press mold is made using the NC tape, and the press mold is used to produce the shape shown in Fig. 7 (
By pressing the substrate shown in a), the result shown in FIG. 7 (
As shown in Fig. 7 (b), for υ where critical 8 is provided,
As shown in C), while printing, use a roller etc. to open the water hole 8.
The inside is filled with resin 9, and the resin 9 is cured by heat drying 4 or ultraviolet rays. Next, according to the instructions on the NC tape, the board was fixed to the specified drilling device of the NC drilling machine based on FIG. After that, if you drill a hole using the NC tape and the drilling machine as shown in Fig. 7 (
As shown in d), a small hole 1o is provided in the center of the resin 9. Next, as shown in the seventh +'Zl (e),
After roughening the inner surface of the small hole 1o, an electroless copper plating layer 11 having a thickness of 1 to 10/11+1 is provided on the inner surface of the small hole 1o, connected to the copper πi17 by electroless copper plating. Then, as shown in FIG. 7(f), a layer of 25 to 3 D 7n+ is deposited on the plating layer 11 by electrolytic copper plating.
A positive electrolytic copper plating layer 12 is provided. Next, after applying a dry film, exposing and developing, plating layer 11.12,
The copper foil 17 is selectively etched to form the wiring m6 and the terminal portion 7, as shown in FIG. 7(g). Finally, the external shape is processed using a mold, router, etc.

In this manufacturing method, focusing on the fact that the center line of the water hole 8 and the center line of the small hole 10 match, a press mold is made using NC tape, and the water hole 8 is formed using the press mold. In addition, since the small hole 10 is formed using the same NC tape with a drilling machine, the small hole 10 can be formed in the center of the water hole 8 with high precision and very easily. It's a trench, water hole 8.
Since all of the water holes 8 can be provided at once by using a press mold, it is possible to provide the water holes 8 in a short time.

In addition, in the above-mentioned embodiment, the water hole 8 is
However, the water hole 8 may be provided using an NC tape using a drilling device such as an NC drilling machine.

In the above embodiment, an NC tape is used as the through-hole position indicating means, but other through-hole position indicating means may be used. Further, in the above embodiment, the wiring 6 and the terminal part 7 were provided after the plating layers 11 and 12 were provided, but the wiring 5 and the terminal part 7 were provided before the water hole 8 was provided, the plating layer 11 was provided, etc. may be provided. Further, in the above embodiment, a dry film was used to form the wiring a6 and the terminal portion 7, but etching may be performed after printing the ink. Further, in the above embodiment, the copper foil 17 was used as the conductor foil, but other conductor foils may be used.

As explained above, in the metal printed circuit board according to the present invention, electronic elements having lead wires can be attached and several electronic elements can be written on both sides, so the range of applications of the metal printed circuit board is expanded. can do. Furthermore, since the wiring can be made denser, it is possible to make the device smaller. Furthermore, in the method for manufacturing a metal printed circuit board according to the present invention, since the water hole and the small hole are provided using the same Sulpol hole position indicating means, the small hole can be formed precisely and very easily in the center of the water hole. Can be done. As described above, the effects of this invention are remarkable.

[Brief explanation of the drawing]

Figure 1 is a plan view showing a part of a conventional aluminum printed circuit board, Figure 2 is a cross-sectional view taken along the line A-A in Figure 1, and Figure 6 is a plan view showing part of a conventional aluminum printed circuit board. 4 is a front sectional view of the same, FIG. 5 is a plan view of a part of the aluminum printed circuit board according to the present invention, and FIG. 6 is a plan view of the aluminum cylinder shown in FIG. 5. FIG. 7, a front cross-sectional view showing a state in which several electronic elements are mounted on a board, is an explanatory view of the method for manufacturing a metal printed circuit board according to the present invention. 1 Aluminum thin plate 2... Insulating film 6... Wiring 7/Terminal part
8・Water hole 9・・Resin 10 Small hole 11 Electroless copper plating layer 12 ・Electrolytic copper plating layer 1 ・Through hole 1
7... Copper foil agent Patent attorney Junnosuke Nakatoshi 1 Diagram? ? 4 Figure 8 P5 Figure 16 Figure 7 Procedural amendment (method) June 6, 1980 Commissioner of the Japan Patent Office Indication of the case Patent application No. 33830 of 1988 Title of the invention Metal printed circuit board and method for manufacturing the same Relationship with the case of the person making the amendment Name of the patent applicant Date of the OK Print Wiring Co., Ltd. attorney's amendment order May 2'S1, 1980 Target of amendment Drawing amendment. Contents Figure 7 (f) and (g) are corrected as shown in the attached drawings (however, only the parts that have been corrected in red). 7. Amendment to the procedure October 13, 1980 4.1 Commissioner of the License Agency Indication of the case 1982 Patent Application No. 33830 Title of the invention Metal printed circuit board and its manufacturing method amendment'
Relation to the case of the person filing the patent application Contents of the amendment by the patent applicant's representative The entire specification is corrected as shown in the attached appendix. Description 1, Name of the invention Metal printed circuit board and method for manufacturing the same 2, Claims (1) A thin metal plate, an insulating film provided on both sides of the thin metal plate, and wiring formed on the insulating film. A metal printed circuit board comprising a layer, a through hole provided in a button part of the wiring layer, a resin filled in the through hole, and a conductor layer in the center of the resin. 1 (2) Using the hole position indicating means, press the press device or
'A through hole is made in the thin metal plate using a drilling device of 1t, part 1.
Fill the through hole with resin, use the hole position indicating means to create a through hole in the center of the resin using a drilling device, and electroless plating to form a through hole in the thin metal hole.
1. A method for manufacturing a metal printed circuit board, comprising: providing a first plating layer with J-adhesion; and providing a second plating layer on the first plating layer by electrolytic plating. 6 Detailed Description of the Invention The present invention relates to a metal printed circuit board such as an aluminum printed circuit board and a method for manufacturing the same. FIG. 1 is a plan view showing a part of a conventional aluminum printed circuit board, and FIG. 2 is a sectional view taken along the line AA in FIG. In the figure, 1 is an aluminum thin plate, 2 is an insulating film provided on one side of the aluminum thin plate 1, a wiring layer made of copper is formed on the insulating film 2, and 4 is a button part of the wiring m6. Such aluminum printed circuit boards have good heat dissipation properties and can be easily deformed, so they have recently begun to be widely used. FIG. 6 is a plan view showing a state in which electronic elements are attached to the aluminum printed circuit board shown in FIGS. 1 and 2, and FIG. 4 is a front sectional view of the same. In the figure, 5 is an electronic element, 6 is a plate-shaped terminal of the electronic element 5, and the plate-shaped terminal 6 is attached to the button portion 4 with a solder. As described above, in the conventional aluminum printed circuit board, an electronic element 5 having a plate-shaped terminal 6 can be attached, but an electronic element having a lead wire cannot be attached thereto. No. 1, it is impossible to attach electronic elements to the back surface of the aluminum printed circuit board, that is, the surface on which the insulating film 2 is not provided. Furthermore, even if wiring layers are formed on both sides, it is not possible to connect both wiring layers, and therefore it is not possible to increase the wiring density. This invention was made to solve the above-mentioned problems, and it is possible to attach an electronic element having a lead wire.
To provide a metal printed circuit board on which electronic elements can be mounted on both sides and a method for manufacturing the same that can increase wiring density (il-object). Alternatively, an insulating film is provided on both sides of a thin metal plate, a wiring layer is formed on the second insulating film, a through hole is provided in the button part of the wiring layer, a resin is filled in the through hole, and the central part of the resin is formed. Through-hole holes are formed in the holes, and a conductor layer is provided that is connected to the above-mentioned button parts on both sides and attached to the inner surface of the above-mentioned through-hole holes.In addition, in order to manufacture such a metal printed circuit board, a press machine is used using a hole position indicating means. A through hole is made in the thin metal plate directly using a cutting or drilling device, the through hole is filled with resin, and a through hole is made in the center of the resin using the hole position indicating means using the drilling device. A first plating layer is provided on the inner surface of the through-hole hole, which is connected to the conductive foil strip or wiring layer 9727 formed on both sides of the thin metal plate via an insulating film by plating, and is applied to the inner surface of the through-hole hole described in 1. A second plating layer is provided on the first plating layer. FIG. 5 is a plan view showing a part of the aluminum printed circuit board according to the present invention, and FIG. It is a front sectional view showing a state in which an electronic element having a lead wire is attached. In the figure, 7 is a button portion of the wiring m6, 8 is a through hole provided in the button portion 7, and 9 is a hole filled in the through hole 8. A through-hole hole 11 provided in the center of the resin 9 is connected to the button part 7 of the wiring m6 formed on both sides of the aluminum thin plate 1, and the through-hole hole 10
12 is the electroless plating layer attached to the inner surface of the plating layer 11
The electrolytic copper plating layer provided above, 13 is a through hole 14 formed in the center of the through hole 8 is an electronic element, 15 is a lead wire of the electronic element 14, and the lead wire 15 is a through hole 13 formed in the center of the through hole 8.
The lead m15 is connected to the plating layer 12 of the 7527 section 7-hi by a conductor 16. In this aluminum printed circuit board, it is possible to attach the electronic element 14 having the lead wire 15, and it is also possible to attach the electronic element 14 to both sides. In addition, since the wiring layers 6 on both sides are connected by the plating layers 11 and 12, the wiring can be densely arranged. In the above embodiment, an aluminum printed circuit board, that is, a printed circuit board in which the metal thin plate is the aluminum thin plate 1, was explained, but iron, paulownia, etc. may also be used as the metal thin plate, and if iron is used, it is cheaper. A metal printed circuit board can be manufactured, and if copper is used, it is possible to obtain a metal printed circuit board with very good heat dissipation. Further, in the above embodiment, the conductor layer is the plating layer 1.
Although the case where the conductor layer is 1°12 has been described, other conductor layers may be provided. Further, in the embodiment mentioned above, the electroless copper plating layer 11. Although the electrolytic copper plating layer 12 is provided, the plating metal is not limited to this, and may be nickel or the like. Further, as the resin 9, an epoxy 7-based resin or the like can be used. Furthermore, only some through-hole holes 10 may be used. It is also possible to provide a layer ++, 12i. Next, with reference to FIG. 7, a method for manufacturing the aluminum printed circuit board shown in FIG. 51 and FIG. 6 will be explained in detail. First, a substrate as shown in FIG. 7(a) is prepared, in which an insulating film 2 is provided on both sides of an aluminum thin plate 1, and a copper foil 17 is formed on the insulating film 2. Next, NO (number
cal control) Create an NC tape with a take at the center position of the through hole 15 using the film original. Next, a press mold is made using the NC tape, and the press mold is used to produce the shape shown in Fig. 7 (
By pressing the substrate shown in a), the result shown in FIG. 7 (
As shown in b), a through hole 8 is provided. Next, as shown in FIG. 7(C), the through hole 8 is filled with resin 9 using a printing press or a roller, and the resin 9 is heated and dried using ultraviolet rays.
harden. Next, according to the instructions on the NC tape, the board based on Fig. 7(C) is fixed to a predetermined position on the NC Bonyl board for drilling holes, and a drill with a diameter smaller than the diameter of the through hole 8 is attached to the drilling machine. If holes are made using the hole board using the NC tape, a through hole 10 will be provided in the center of the resin 9, as shown in FIG. 7(d). Next, as shown in FIG. 7(e), the inner surface of the through-hole hole 10 is roughened, and then connected to the copper foil 17 by electroless copper plating and deposited on the inner surface of the through-hole hole 10 with a thickness of 1 to 1. An electroless copper plating layer 11 of 10 μm is provided. Next, as shown in No. 71M(f), an electrolytic copper plating layer 12 with a thickness of 25 to 30 μm is provided on the plating layer 11 by electrolytic copper plating. Next, apply dry film,
After exposure and development, the plating layers 11 and 12 and the silver foil 17 are selectively etched to form wiring lines J as shown in FIG. 7(g). Finally, the outer shape of the gold is processed using a router or the like. In this manufacturing method, focusing on the fact that the center line of the through hole 8 and the center line of the through hole hole 10 match, a press mold is made using NC tape, and the through hole 8 is formed using the press mold. , and because the same NC tape is used to form the p through hole 10 on a drilling machine, the through hole 10 can be formed in the center of the through hole 8 with high accuracy and very easily. Furthermore, since the through holes 8 are formed using a press mold, all the through holes 8 can be formed at once, so that the through holes 8 can be formed in a short time. In the above-mentioned embodiment, the through holes 8 were formed using a press machine, but the through holes 8 may also be formed using an NC tape using a drilling machine such as an NC hole machine. Further, in the above-mentioned embodiment, the hole position indicating means and NC tape were used, but other hole position indicating means may be used.Furthermore, in the above-mentioned embodiment, the plating layer 11.42 After that, the wiring layer 3 was provided, but before the through hole 8 was provided,
The wiring layer 3 may be provided before the plating layer 11 is provided. In the above embodiment, a dry film was used to form the wiring layer 3, but etching may be performed after printing the ink. Further, in the above embodiment, the copper foil 17 was used as the conductor foil, but other conductor foils may be used. As explained above, in the metal printed circuit board according to the present invention, electronic elements having lead wires can be attached, and electronic elements can be attached to both sides, so that the range of applications of the metal printed circuit board can be expanded. Can be done. Furthermore, since the wiring can be densely arranged, it is possible to make the device compact. Furthermore, in the method for manufacturing a metal printed circuit board according to the present invention, the same water level iii
'Since the through hole and the through hole are provided using the indicating means, the through hole can be provided precisely and very easily in the center of the through hole. As described above, the effects of this invention are remarkable. 4. Brief explanation of the drawings Figure 1 is a plan view showing a part of a conventional aluminum printed circuit board, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figure 6 is similar to Figures 1 and 2. FIG. 4 is a front sectional view, FIG. 5 is a plan view showing a part of the aluminum printed circuit board according to the present invention, and FIG. FIG. 5 is a front cross-sectional view showing a state in which electronic elements are attached to the aluminum printed circuit board, and FIG. 7 is an explanatory view of the method for manufacturing a metal printed circuit board according to the present invention. 1...Aluminum thin plate 2...Insulating film 6゛Wiring 7・Pattern part 8...Through hole 9・m fat
10... Through hole hole 11... Electroless copper plating layer 12... Electrolytic copper plating layer 16... Through hole 17...
...Copper foil agent Junnosuke Nakamura

Claims (2)

[Claims] (1) A thin metal plate, an insulating film provided on both sides of the thin metal plate, a conductive pattern formed on the insulating film, a water hole provided in the conductive pattern, and a water hole filled with the water hole. 1. A metal printed circuit board comprising: a small hole formed in the center of the resin; and a conductive layer connected to the conductive pattern on both sides and attached to the inner surface of the small hole. (2) A water hole is formed in a thin metal plate using a press device or a drilling device using a through-hole hole position indicating means, the water hole is filled with resin, and a hole is formed in the center of the resin by a drilling device using the through-hole hole position indicating means. A small hole is provided in the small hole, a first sawtooth layer is formed on both sides of the thin metal plate by electroless plating, and a first sawtooth layer is connected to the conductive pattern and attached to the inner surface of the small hole, and the first plating layer is formed by electrolytic plating. A method for manufacturing a metal printed circuit board, comprising providing a second plating layer on the layer.