JPS619847U - composite circuit parts - Google Patents
composite circuit partsInfo
- Publication number
- JPS619847U JPS619847U JP9342384U JP9342384U JPS619847U JP S619847 U JPS619847 U JP S619847U JP 9342384 U JP9342384 U JP 9342384U JP 9342384 U JP9342384 U JP 9342384U JP S619847 U JPS619847 U JP S619847U
- Authority
- JP
- Japan
- Prior art keywords
- composite circuit
- substrates
- circuit parts
- substrate
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第1図はこの考案の複合回路部品を製造するのに用いる
基板の一例を示す正面図、第2図は製造過程を示す説明
図、第3図は回路部品の一例の平面図、第4図はその一
部を切欠した側面図、第5図はその回路図である。
1・・・第1基板、2・・・電極端子、3・・・ヒュー
ズホルダ、4・・・12基板、5.6・・・コンデンサ
、7・・・ダイオード、8・・・導線、9・・・樹脂コ
ーティング、10・・・樹脂ケース。[Brief Description of the Drawings] Figure 1 is a front view showing an example of a board used to manufacture the composite circuit component of this invention, Figure 2 is an explanatory diagram showing the manufacturing process, and Figure 3 is an example of the circuit component. FIG. 4 is a partially cutaway side view, and FIG. 5 is a circuit diagram thereof. DESCRIPTION OF SYMBOLS 1... First board, 2... Electrode terminal, 3... Fuse holder, 4... 12 board, 5.6... Capacitor, 7... Diode, 8... Conductor, 9 ...Resin coating, 10...Resin case.
Claims (1)
して両基板間を電気的に接続し、両基板のうち少なくと
もいずれか一方の基板には絶縁被覆を施すと共に、第1
基板と第2基板とを樹脂ケース内において上下に配置し
、電極子を外部に導出した状態で、樹脂モールドを施し
て成る複合回路部品。Necessary electrical components are mounted on each of the first and second substrates to electrically connect the two substrates, and at least one of the two substrates is coated with an insulating coating.
A composite circuit component in which a substrate and a second substrate are placed one above the other in a resin case, and resin molded with the electrodes exposed to the outside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9342384U JPS619847U (en) | 1984-06-22 | 1984-06-22 | composite circuit parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9342384U JPS619847U (en) | 1984-06-22 | 1984-06-22 | composite circuit parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS619847U true JPS619847U (en) | 1986-01-21 |
Family
ID=30651090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9342384U Pending JPS619847U (en) | 1984-06-22 | 1984-06-22 | composite circuit parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS619847U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62142830U (en) * | 1986-02-28 | 1987-09-09 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56114362A (en) * | 1980-02-14 | 1981-09-08 | Mitsubishi Electric Corp | Hybrid ic device |
-
1984
- 1984-06-22 JP JP9342384U patent/JPS619847U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56114362A (en) * | 1980-02-14 | 1981-09-08 | Mitsubishi Electric Corp | Hybrid ic device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62142830U (en) * | 1986-02-28 | 1987-09-09 |
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