JPS56114362A - Hybrid ic device - Google Patents

Hybrid ic device

Info

Publication number
JPS56114362A
JPS56114362A JP1746080A JP1746080A JPS56114362A JP S56114362 A JPS56114362 A JP S56114362A JP 1746080 A JP1746080 A JP 1746080A JP 1746080 A JP1746080 A JP 1746080A JP S56114362 A JPS56114362 A JP S56114362A
Authority
JP
Japan
Prior art keywords
parts
resin
molded
circuit
kinds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1746080A
Other languages
Japanese (ja)
Inventor
Takayoshi Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1746080A priority Critical patent/JPS56114362A/en
Publication of JPS56114362A publication Critical patent/JPS56114362A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To decrease the cost with the function of a circuit device being thoroughly satisfied by a method wherein when a plurality of substrates on which a circuit element is mounted are resin-molded in a case, kinds of the resins used are used properly according to the kinds of the circuit elements. CONSTITUTION:A first parts 2 comprising a ceramic substrate or print substrate on which the circuit element 3 is mounted and a second parts 4 are housed situated on the upper and lower sides in the case 1 made of epoxy resin or metal etc. Then, those parts are connected with each other to draw out a lead terminal 5 of an end of the first parts 2 and molded with the resin. At this time, for the first parts 2 which is an ordinary element, the low priced resin 21 such as epoxy and urethane is used and for the second parts 4 necessary to be kept in a soft state even after the hardening such as piezoelectric element, the resin 22 such as silicon gel and polyurethane in good environment-proof is used to thoroughly satisfy the functions and reduce the cost.
JP1746080A 1980-02-14 1980-02-14 Hybrid ic device Pending JPS56114362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1746080A JPS56114362A (en) 1980-02-14 1980-02-14 Hybrid ic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1746080A JPS56114362A (en) 1980-02-14 1980-02-14 Hybrid ic device

Publications (1)

Publication Number Publication Date
JPS56114362A true JPS56114362A (en) 1981-09-08

Family

ID=11944627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1746080A Pending JPS56114362A (en) 1980-02-14 1980-02-14 Hybrid ic device

Country Status (1)

Country Link
JP (1) JPS56114362A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619847U (en) * 1984-06-22 1986-01-21 株式会社 指月電機製作所 composite circuit parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619847U (en) * 1984-06-22 1986-01-21 株式会社 指月電機製作所 composite circuit parts

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