JPS58218164A - Thick film printed substrate - Google Patents

Thick film printed substrate

Info

Publication number
JPS58218164A
JPS58218164A JP9386682A JP9386682A JPS58218164A JP S58218164 A JPS58218164 A JP S58218164A JP 9386682 A JP9386682 A JP 9386682A JP 9386682 A JP9386682 A JP 9386682A JP S58218164 A JPS58218164 A JP S58218164A
Authority
JP
Japan
Prior art keywords
pattern
formed
conductive pattern
resistive
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9386682A
Inventor
Takeshi Ohara
Original Assignee
Nec Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Home Electronics Ltd filed Critical Nec Home Electronics Ltd
Priority to JP9386682A priority Critical patent/JPS58218164A/en
Publication of JPS58218164A publication Critical patent/JPS58218164A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01046Palladium [Pd]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns, inspection means or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

PURPOSE: To contrive improvement in positioning accuracy by a method wherein, after a base pattern having a large optical reflection contrast with a conductive pattern has been formed in advance, a conductive pattern is formed on said base pattern.
CONSTITUTION: A resistive pattern 11 is formed by drying up at low temperature after performing a screen printing on the paste containing powder in the state wherein fine grains of palladium oxide PdO are surrounded by a silver palladium Ag-Pd powder alloy and sintered at approximate temperatue of 750∼850°C, and said resistive pattern has a black color and also has a low-light-reflecting property. No.12 is a resistive pattern which is obtained by forming paste made by uniformly scattering the mixed powder of Pd-Ag powder and boron-silicate glass frit in an organic medium, a screen printing is performed in the same manner as in the case of resistance pattern 11 and then sintered at 500∼700°C. As the silver-white colored conductive pattern 12, having a high light-reflecting property, is formed on the resistive pattern of low light-reflecting property, the contrast between them is large, and they can be suitably utilized for the position-detection marking on the conductive pattern 12 and serves to improve the positional accuracy thereof.
COPYRIGHT: (C)1983,JPO&Japio
JP9386682A 1982-05-31 1982-05-31 Thick film printed substrate Pending JPS58218164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9386682A JPS58218164A (en) 1982-05-31 1982-05-31 Thick film printed substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9386682A JPS58218164A (en) 1982-05-31 1982-05-31 Thick film printed substrate

Publications (1)

Publication Number Publication Date
JPS58218164A true JPS58218164A (en) 1983-12-19

Family

ID=14094364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9386682A Pending JPS58218164A (en) 1982-05-31 1982-05-31 Thick film printed substrate

Country Status (1)

Country Link
JP (1) JPS58218164A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198491A (en) * 1984-10-17 1986-05-16 Le Materiel Biomedeikaru Automatic apparatus having several members to be displaced in mutual relation and driving thereof
JPS61190168U (en) * 1985-05-20 1986-11-27
JPS6265276U (en) * 1985-10-16 1987-04-23
EP0393206A1 (en) * 1988-10-14 1990-10-24 Matsushita Electric Industrial Co., Ltd. Image sensor and method of producing the same
US5266828A (en) * 1988-10-14 1993-11-30 Matsushita Electric Industrial Co., Ltd. Image sensors with an optical fiber array

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785240A (en) * 1980-11-17 1982-05-27 Fujitsu Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785240A (en) * 1980-11-17 1982-05-27 Fujitsu Ltd Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198491A (en) * 1984-10-17 1986-05-16 Le Materiel Biomedeikaru Automatic apparatus having several members to be displaced in mutual relation and driving thereof
JPH0531001B2 (en) * 1984-10-17 1993-05-11 Ru Materieru Biomedeikaru
JPS61190168U (en) * 1985-05-20 1986-11-27
JPH0410707Y2 (en) * 1985-05-20 1992-03-17
JPS6265276U (en) * 1985-10-16 1987-04-23
JPH0450145Y2 (en) * 1985-10-16 1992-11-26
EP0393206A1 (en) * 1988-10-14 1990-10-24 Matsushita Electric Industrial Co., Ltd. Image sensor and method of producing the same
US5266828A (en) * 1988-10-14 1993-11-30 Matsushita Electric Industrial Co., Ltd. Image sensors with an optical fiber array

Similar Documents

Publication Publication Date Title
KR920004210B1 (en) Dielectric composition
JPWO2010061519A1 (en) ESD protection device and manufacturing method thereof
US2641675A (en) Printed electrical conductor
KR0129855B1 (en) Pattern forming sheet and formed pattern fixing process
JPS56143430A (en) Photographic sensitive material with improved antistatic property
CN102026927A (en) Glass compositions used in conductors for photovoltaic cells
JP2003218373A (en) Solar battery and method and instrument for manufacturing the same
DE3628495A1 (en) Heater applied on a ceramic substrate
KR900008274B1 (en) Thick film resistor circuits
CA2069192A1 (en) Inks for the decoration and marking of objects, namely of ceramic objects
CN100550218C (en) The electrostatic defending member manufacturing method
JP3541070B2 (en) Automotive glass thick film conductor paste
JPH01302803A (en) Chip resistor and its manufacturing method
US4814107A (en) Nitrogen fireable resistor compositions
EP0024775A3 (en) A silver containing thick film conductor composition, a method for producing such a composition, a method of preparing a solar cell comprising screen printing said composition on an n-type layer of a semiconductor wafer and the solar cells thus obtained
EP0568853A1 (en) Photoenhanced diffusion patterning for organic polymer films
JPS6066145A (en) External atmosphere detecting device
GB1465931A (en) Electrical resistors
KR850002682A (en) Ceramic multilayer board and its manufacturing method
US4316942A (en) Thick film copper conductor circuits
EP1621525A3 (en) Thick-film conductor paste
US4409261A (en) Process for air firing oxidizable conductors
JPH0634341Y2 (en) Laminated structure of ceramic color layer and conductive layer
US4623482A (en) Copper conductive paint for porcelainized metal substrates
JP2003264101A (en) Bifacial mountable resistor