JPS641258A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS641258A
JPS641258A JP62156961A JP15696187A JPS641258A JP S641258 A JPS641258 A JP S641258A JP 62156961 A JP62156961 A JP 62156961A JP 15696187 A JP15696187 A JP 15696187A JP S641258 A JPS641258 A JP S641258A
Authority
JP
Japan
Prior art keywords
bump
bonding
ball bonding
wire
shorten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62156961A
Other languages
Japanese (ja)
Other versions
JPH011258A (en
Inventor
Shin Tada
Tadaharu Mukai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP62-156961A priority Critical patent/JPH011258A/en
Priority claimed from JP62-156961A external-priority patent/JPH011258A/en
Publication of JPS641258A publication Critical patent/JPS641258A/en
Publication of JPH011258A publication Critical patent/JPH011258A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To shorten steps required to form a bump by containing the step of forming a ball bonding on a surface electrode by a wire bonding method to form the bump.
CONSTITUTION: The surface of a semiconductor substrate 1 is protected by an insulator protective film 2, and aluminum electrodes 3 are partly exposed as a connection to an exterior. Then, a ball bonding 6a is formed through a capillary tool 7 on the electrode 3 by a wire bonding method, and then formed as a bump layer 6. Accordingly, the bump is formed merely by wire cutting with the capillary tool immediately after the bonding. Thus, a device necessary to form the bump is only the ball bonding device to largely shorten the steps, thereby reducing its cost.
COPYRIGHT: (C)1989,JPO&Japio
JP62-156961A 1987-06-23 Manufacturing method of semiconductor device Pending JPH011258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62-156961A JPH011258A (en) 1987-06-23 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62-156961A JPH011258A (en) 1987-06-23 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS641258A true JPS641258A (en) 1989-01-05
JPH011258A JPH011258A (en) 1989-01-05

Family

ID=

Similar Documents

Publication Publication Date Title
JPS5459080A (en) Semiconductor device
JPS5226182A (en) Manufacturing method of semi-conductor unit
JPS641258A (en) Manufacture of semiconductor device
JPS5516415A (en) Diode
JPS5513904A (en) Semiconductor device and its manufacturing method
JPS52131484A (en) Semiconductor device
JPS54133877A (en) Semiconductor device
JPS55108786A (en) Luminous diode
JPS56105670A (en) Semiconductor device
JPS54157479A (en) Electrode terminal forming method to wiring connecting semiconductor elements
JPS5265666A (en) Semiconductor device
JPS54113247A (en) Semiconductor device
JPS5585036A (en) Bonding method
JPS54107258A (en) Semiconductor device
JPS5411690A (en) Semiconductor laser unit
JPS5516448A (en) Diode
JPS54111760A (en) Electrode construction for semiconductor device
JPS5358764A (en) Bonding method of flip chip
JPS5390862A (en) Manufacture of semiconductor device
JPS5577138A (en) Production of semiconductor chip
JPS5322366A (en) Electronic part
JPS6428827A (en) Manufacture of semiconductor device
JPS538058A (en) Production of semiconductor device
JPS5552242A (en) Semiconductor device
JPS51112266A (en) Semiconductor device production method