JPS54107258A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54107258A
JPS54107258A JP1342478A JP1342478A JPS54107258A JP S54107258 A JPS54107258 A JP S54107258A JP 1342478 A JP1342478 A JP 1342478A JP 1342478 A JP1342478 A JP 1342478A JP S54107258 A JPS54107258 A JP S54107258A
Authority
JP
Japan
Prior art keywords
film
wiring
mask
psg
chromium alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1342478A
Other languages
Japanese (ja)
Inventor
Tatsu Ito
Katsuo Sugawara
Toru Kawanobe
Yukiyoshi Harada
Mikio Hirano
Keiji Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1342478A priority Critical patent/JPS54107258A/en
Publication of JPS54107258A publication Critical patent/JPS54107258A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To obtain a passivation structure where cracks of a wiring protect film and the deterioration of etching-proof property is not generated at a bonding time, by using soft heat-proof resin and hard PSG.
CONSTITUTION: Field oxide film 2 is formed on Si substrate 1, and poly-Si wiring 8 is formed which will be connected to an active region. PSG film 4 which becomes an inter-layer insulating film is formed on wiring 8, and polyimide-system organic resin film 9 is formed, and windows are provided partially. Next, nickel chromium alloy film 10 and palladium film 11 which become a plating ground film are formed on all the surface, and gold bump 7 is formed by mask 12. After that, the gold bump is used as a mask to remove palladium and nickel chromium alloy films, thereby completing a semiconductor element.
COPYRIGHT: (C)1979,JPO&Japio
JP1342478A 1978-02-10 1978-02-10 Semiconductor device Pending JPS54107258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1342478A JPS54107258A (en) 1978-02-10 1978-02-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1342478A JPS54107258A (en) 1978-02-10 1978-02-10 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54107258A true JPS54107258A (en) 1979-08-22

Family

ID=11832744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1342478A Pending JPS54107258A (en) 1978-02-10 1978-02-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54107258A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56111232A (en) * 1980-02-07 1981-09-02 Fujitsu Ltd Preparation of semiconductor device
JPS6022368A (en) * 1983-07-18 1985-02-04 Toshiba Corp Semiconductor device
JPH02121333A (en) * 1988-10-31 1990-05-09 Toshiba Corp Semiconductor device and its manufacture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56111232A (en) * 1980-02-07 1981-09-02 Fujitsu Ltd Preparation of semiconductor device
JPS6022368A (en) * 1983-07-18 1985-02-04 Toshiba Corp Semiconductor device
JPH02121333A (en) * 1988-10-31 1990-05-09 Toshiba Corp Semiconductor device and its manufacture

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