JPS5257780A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5257780A
JPS5257780A JP50133276A JP13327675A JPS5257780A JP S5257780 A JPS5257780 A JP S5257780A JP 50133276 A JP50133276 A JP 50133276A JP 13327675 A JP13327675 A JP 13327675A JP S5257780 A JPS5257780 A JP S5257780A
Authority
JP
Japan
Prior art keywords
wiring
providing
contact hole
electrode pad
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50133276A
Other languages
Japanese (ja)
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50133276A priority Critical patent/JPS5257780A/en
Publication of JPS5257780A publication Critical patent/JPS5257780A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To eliminate the laminate structure of a protecting layer and metal layer under bump and to prevent cracking occuring in a protecting layer by providing a contact hole directly beneath an electrode pad without connecting the electrode pad directly to the wiring on a semiconductor element and providing a conducting line from the contact hole up to the wiring to be connected to the pad by diffustion into wafer, etc.
COPYRIGHT: (C)1977,JPO&Japio
JP50133276A 1975-11-06 1975-11-06 Semiconductor device Pending JPS5257780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50133276A JPS5257780A (en) 1975-11-06 1975-11-06 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50133276A JPS5257780A (en) 1975-11-06 1975-11-06 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5257780A true JPS5257780A (en) 1977-05-12

Family

ID=15100836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50133276A Pending JPS5257780A (en) 1975-11-06 1975-11-06 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5257780A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458380A (en) * 1977-10-19 1979-05-11 Hitachi Ltd Zener diode

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940383A (en) * 1972-08-24 1974-04-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940383A (en) * 1972-08-24 1974-04-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5458380A (en) * 1977-10-19 1979-05-11 Hitachi Ltd Zener diode
JPS6125220B2 (en) * 1977-10-19 1986-06-14 Hitachi Ltd

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