HK1245904A1 - 移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法 - Google Patents

移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法

Info

Publication number
HK1245904A1
HK1245904A1 HK18105331.7A HK18105331A HK1245904A1 HK 1245904 A1 HK1245904 A1 HK 1245904A1 HK 18105331 A HK18105331 A HK 18105331A HK 1245904 A1 HK1245904 A1 HK 1245904A1
Authority
HK
Hong Kong
Prior art keywords
flat
movable body
panel display
manufacturing
object exchange
Prior art date
Application number
HK18105331.7A
Other languages
English (en)
Inventor
青木保夫
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1245904A1 publication Critical patent/HK1245904A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK18105331.7A 2010-09-13 2013-05-23 移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法 HK1245904A1 (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38207710P 2010-09-13 2010-09-13
US38214110P 2010-09-13 2010-09-13
US38211410P 2010-09-13 2010-09-13
US38213010P 2010-09-13 2010-09-13
US13/228,115 US20120064461A1 (en) 2010-09-13 2011-09-08 Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Publications (1)

Publication Number Publication Date
HK1245904A1 true HK1245904A1 (zh) 2018-08-31

Family

ID=45807045

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18105331.7A HK1245904A1 (zh) 2010-09-13 2013-05-23 移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法

Country Status (7)

Country Link
US (1) US20120064461A1 (zh)
JP (5) JP5910980B2 (zh)
KR (3) KR101911727B1 (zh)
CN (4) CN103097959B (zh)
HK (1) HK1245904A1 (zh)
TW (4) TWI582538B (zh)
WO (1) WO2012036252A1 (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102483580B (zh) * 2009-08-20 2015-04-01 株式会社尼康 物体处理装置、曝光装置及曝光方法、以及元件制造方法
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
US20110042874A1 (en) * 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
US8598538B2 (en) * 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method
DE102012103533A1 (de) * 2012-04-20 2013-10-24 Köra-Packmat Maschinenbau GmbH Vorrichtung zum Fördern eines Substrats und System zum Bedrucken eines Substrats
JP6035670B2 (ja) * 2012-08-07 2016-11-30 株式会社ニコン 露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに露光装置
WO2014024483A1 (ja) * 2012-08-08 2014-02-13 株式会社ニコン 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2015147039A1 (ja) * 2014-03-26 2015-10-01 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6410208B2 (ja) * 2014-10-01 2018-10-24 日本電気硝子株式会社 形状測定装置
TWI735438B (zh) * 2015-03-30 2021-08-11 日商尼康股份有限公司 物體搬運裝置、曝光裝置、平板顯示器的製造方法、元件製造方法、物體搬運方法以及曝光方法
WO2018136197A1 (en) 2017-01-20 2018-07-26 Applied Materials, Inc. Resolution enhanced digital lithography with anti-blazed dmd
CN110520798B (zh) * 2017-03-31 2021-11-16 株式会社尼康 物体交换装置、物体处理装置、平板显示器的制造方法、元件制造方法、物体交换方法、以及物体处理方法
US10254659B1 (en) * 2017-09-27 2019-04-09 Wuhan China Star Optoelectronics Technology Co., Ltd Exposure apparatus and method for exposure of transparent substrate
CN111164513B (zh) * 2017-09-29 2022-08-16 株式会社尼康 基板搬运、曝光装置、方法、平板显示器及元件制造方法
KR102458992B1 (ko) * 2017-09-29 2022-10-25 가부시키가이샤 니콘 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법
CN111149060B (zh) * 2017-09-29 2022-08-30 株式会社尼康 基板搬运、曝光装置、方法、平板显示器及元件制造方法
CN109384062B (zh) 2018-09-19 2020-02-18 武汉华星光电技术有限公司 一种曝光机及其传送基板的方法
JP7222659B2 (ja) * 2018-10-29 2023-02-15 キヤノン株式会社 露光装置、および物品製造方法
JP7287058B2 (ja) * 2019-03-29 2023-06-06 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
JP7196734B2 (ja) * 2019-03-29 2022-12-27 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
JP7207096B2 (ja) * 2019-03-29 2023-01-18 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
CN111817497B (zh) * 2020-07-10 2022-01-21 深圳市汇顶科技股份有限公司 控制装置和运动机构
JP7433181B2 (ja) * 2020-09-23 2024-02-19 株式会社Ｓｃｒｅｅｎホールディングス 描画装置
JP7107352B2 (ja) * 2020-12-17 2022-07-27 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、基板搬送方法、及び露光方法
CN113108715B (zh) * 2021-04-13 2024-01-23 南京中安半导体设备有限责任公司 悬浮物的测量装置和气浮卡盘
US11899198B2 (en) 2022-05-23 2024-02-13 Applied Materials, Inc. Controlling light source wavelengths for selectable phase shifts between pixels in digital lithography systems

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62168024U (zh) * 1986-04-15 1987-10-24
KR100300618B1 (ko) 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
EP1159650B1 (en) * 1999-02-17 2008-11-19 Kodak Graphic Communications GmbH Flat bed platesetter system
JP2001215718A (ja) 1999-11-26 2001-08-10 Nikon Corp 露光装置及び露光方法
JP2002036373A (ja) * 2000-07-25 2002-02-05 Sanyo Electric Co Ltd 光造形装置
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
JP2003324028A (ja) * 2002-04-30 2003-11-14 Jfe Steel Kk 平面磁気素子の製造方法
JP2004001924A (ja) * 2002-05-30 2004-01-08 Nikon Corp 搬送装置及び露光装置
JP2004231331A (ja) * 2003-01-29 2004-08-19 Dainippon Printing Co Ltd 基板の搬送方法及び基板の搬送装置
EP1776300A4 (en) * 2004-04-14 2011-05-11 Coreflow Scient Solutions Ltd NON-CONTACT SUPPORT PLATFORMS FOR SETTING THE DISTANCE
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置
JP4581602B2 (ja) * 2004-09-29 2010-11-17 株式会社島津製作所 真空処理装置
JP4381949B2 (ja) * 2004-10-07 2009-12-09 大日本スクリーン製造株式会社 基板処理装置
JP4413789B2 (ja) * 2005-01-24 2010-02-10 東京エレクトロン株式会社 ステージ装置および塗布処理装置
JP4917780B2 (ja) * 2005-09-08 2012-04-18 住友化学株式会社 露光装置
JP4593536B2 (ja) * 2006-08-23 2010-12-08 大日本スクリーン製造株式会社 姿勢変換装置および基板搬送装置
JP2008159784A (ja) * 2006-12-22 2008-07-10 Sumitomo Heavy Ind Ltd ステージ装置
JP2008174361A (ja) * 2007-01-19 2008-07-31 Tokyo Electron Ltd 基板搬送装置
CN101611470B (zh) 2007-03-05 2012-04-18 株式会社尼康 移动体装置、图案形成装置及图案形成方法、设备制造方法、移动体装置的制造方法以及移动体驱动方法
US7607647B2 (en) 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
JP5150949B2 (ja) * 2007-06-18 2013-02-27 Ｎｓｋテクノロジー株式会社 近接スキャン露光装置及びその制御方法
KR101111934B1 (ko) * 2007-04-03 2012-04-06 닛본 세이고 가부시끼가이샤 노광 장치 및 노광 방법
US7806641B2 (en) * 2007-08-30 2010-10-05 Ascentool, Inc. Substrate processing system having improved substrate transport system
KR101431146B1 (ko) * 2008-05-09 2014-08-18 주식회사 디엠에스 약액도포장치
KR20100018950A (ko) 2008-08-08 2010-02-18 하명찬 타이어 가황기용 단열판
JP5164069B2 (ja) * 2008-08-28 2013-03-13 Ｎｓｋテクノロジー株式会社 スキャン露光装置およびスキャン露光方法
JP4954162B2 (ja) * 2008-08-29 2012-06-13 東京エレクトロン株式会社 処理システム
US20120031147A1 (en) * 2009-03-03 2012-02-09 Hitachi Via Mechanics, Ltd. Method and Apparatus for Machining Thin-Film Layer of Workpiece
JP4916035B2 (ja) * 2009-08-28 2012-04-11 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Also Published As

Publication number Publication date
TW201222165A (en) 2012-06-01
JP6835191B2 (ja) 2021-02-24
JP2019012846A (ja) 2019-01-24
KR102072079B1 (ko) 2020-01-31
CN107450280A (zh) 2017-12-08
KR20180117218A (ko) 2018-10-26
JP6624402B2 (ja) 2019-12-25
CN103097959B (zh) 2017-08-11
KR20200011614A (ko) 2020-02-03
CN109557771A (zh) 2019-04-02
US20120064461A1 (en) 2012-03-15
CN103097959A (zh) 2013-05-08
JP2012060134A (ja) 2012-03-22
TW201721301A (zh) 2017-06-16
KR101911727B1 (ko) 2018-10-30
TWI582538B (zh) 2017-05-11
TW202014808A (zh) 2020-04-16
CN107450280B (zh) 2019-05-31
JP6409897B2 (ja) 2018-10-24
JP2016136646A (ja) 2016-07-28
JP6292417B2 (ja) 2018-03-14
WO2012036252A1 (en) 2012-03-22
JP2020038392A (ja) 2020-03-12
JP5910980B2 (ja) 2016-04-27
KR20130108350A (ko) 2013-10-02
TWI715384B (zh) 2021-01-01
CN107315321B (zh) 2019-03-22
JP2017122939A (ja) 2017-07-13
KR102218118B1 (ko) 2021-02-19
TWI684833B (zh) 2020-02-11
TW201905604A (zh) 2019-02-01
CN109557771B (zh) 2021-12-07
TWI665528B (zh) 2019-07-11
CN107315321A (zh) 2017-11-03

Similar Documents

Publication Publication Date Title
HK1245904A1 (zh) 移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法
HK1222228A1 (zh) 移動體裝置、物體處理裝置、曝光裝置、平板顯示器的製造方法、及元件製造方法
HK1179356A1 (zh) 移動體裝置、物體處理裝置、曝光裝置、平板顯示器的製造方法、及元件製造方法
HK1249777A1 (zh) 移動體裝置、曝光裝置、平面顯示器的製造方法及元件製造方法
IL220933A (en) Lithographic system and method for device production
HK1215733A1 (zh) 曝光方法、曝光裝置以及器件製造方法
HK1206436A1 (zh) 曝光裝置、曝光方法、以及組件製造方法
IL225971A0 (en) Metrological method and system and method for producing a standard
HK1224024A1 (zh) 曝光裝置和器件製造方法
IL226055A0 (en) Metrological method and apparatus, and method for creating a lithographic system and apparatus
HK1224023A1 (zh) 曝光設備及器件製造方法
EP2613340A4 (en) DEVICE MANUFACTURING APPARATUS, AND ASSOCIATED METHOD
EP2627072A4 (en) IMAGE DISPLAY DEVICE AND IMAGE DISPLAY PROCESS
EP2627076A4 (en) IMAGE DISPLAY DEVICE AND IMAGE DISPLAY PROCESS
IL210832A0 (en) Lithographic apparatus and device manufacturing method
SG10201508629SA (en) Lithography method and apparatus
EP2645352A4 (en) DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
HK1179750A1 (zh) 曝光裝置、物體的更換方法、曝光方法、以及元件製造方法
HK1169492A1 (zh) 曝光設備、曝光方法及器件製造方法
IL220021A0 (en) Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
HK1245416A1 (zh) 物體交換方法、物體交換系統、曝光裝置、平面顯示器的製造方法、及組件製造方法
IL232760A0 (en) A device and device for lithography and a method for their production
IL210697A0 (en) Lithographic apparatus and device manufacturing method
TWI561935B (en) Exposure apparatus and device manufacturing method
HK1205276A1 (zh) 曝光方法、平板顯示器的製造方法和器件製造方法