HK1245904A1 - 移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法 - Google Patents

移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法

Info

Publication number
HK1245904A1
HK1245904A1 HK18105331.7A HK18105331A HK1245904A1 HK 1245904 A1 HK1245904 A1 HK 1245904A1 HK 18105331 A HK18105331 A HK 18105331A HK 1245904 A1 HK1245904 A1 HK 1245904A1
Authority
HK
Hong Kong
Prior art keywords
flat
movable body
panel display
manufacturing
object exchange
Prior art date
Application number
HK18105331.7A
Other languages
English (en)
Inventor
青木保夫
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1245904A1 publication Critical patent/HK1245904A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK18105331.7A 2010-09-13 2013-05-23 移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法 HK1245904A1 (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38207710P 2010-09-13 2010-09-13
US38213010P 2010-09-13 2010-09-13
US38214110P 2010-09-13 2010-09-13
US38211410P 2010-09-13 2010-09-13
US13/228,115 US20120064461A1 (en) 2010-09-13 2011-09-08 Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method

Publications (1)

Publication Number Publication Date
HK1245904A1 true HK1245904A1 (zh) 2018-08-31

Family

ID=45807045

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18105331.7A HK1245904A1 (zh) 2010-09-13 2013-05-23 移動體裝置、曝光裝置、元件製造方法、平板顯示器的製造方法、及物體交換方法

Country Status (7)

Country Link
US (1) US20120064461A1 (zh)
JP (5) JP5910980B2 (zh)
KR (3) KR102218118B1 (zh)
CN (4) CN109557771B (zh)
HK (1) HK1245904A1 (zh)
TW (4) TWI715384B (zh)
WO (1) WO2012036252A1 (zh)

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JP7207096B2 (ja) * 2019-03-29 2023-01-18 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
JP7196734B2 (ja) * 2019-03-29 2022-12-27 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
JP7287058B2 (ja) * 2019-03-29 2023-06-06 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、及び露光方法
CN111817497B (zh) * 2020-07-10 2022-01-21 深圳市汇顶科技股份有限公司 控制装置和运动机构
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JP7107352B2 (ja) * 2020-12-17 2022-07-27 株式会社ニコン 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、基板搬送方法、及び露光方法
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Also Published As

Publication number Publication date
KR102218118B1 (ko) 2021-02-19
JP2019012846A (ja) 2019-01-24
CN107315321A (zh) 2017-11-03
TW202014808A (zh) 2020-04-16
CN107450280B (zh) 2019-05-31
TW201222165A (en) 2012-06-01
CN103097959A (zh) 2013-05-08
JP2012060134A (ja) 2012-03-22
JP2017122939A (ja) 2017-07-13
KR101911727B1 (ko) 2018-10-30
KR20130108350A (ko) 2013-10-02
CN103097959B (zh) 2017-08-11
TWI684833B (zh) 2020-02-11
JP6835191B2 (ja) 2021-02-24
CN107450280A (zh) 2017-12-08
TW201721301A (zh) 2017-06-16
TW201905604A (zh) 2019-02-01
WO2012036252A1 (en) 2012-03-22
KR20180117218A (ko) 2018-10-26
US20120064461A1 (en) 2012-03-15
JP6409897B2 (ja) 2018-10-24
JP2016136646A (ja) 2016-07-28
CN109557771A (zh) 2019-04-02
KR20200011614A (ko) 2020-02-03
CN107315321B (zh) 2019-03-22
JP5910980B2 (ja) 2016-04-27
CN109557771B (zh) 2021-12-07
TWI715384B (zh) 2021-01-01
KR102072079B1 (ko) 2020-01-31
TWI665528B (zh) 2019-07-11
TWI582538B (zh) 2017-05-11
JP6624402B2 (ja) 2019-12-25
JP2020038392A (ja) 2020-03-12
JP6292417B2 (ja) 2018-03-14

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