HK1224024A1 - 曝光裝置和器件製造方法 - Google Patents
曝光裝置和器件製造方法Info
- Publication number
- HK1224024A1 HK1224024A1 HK16112343.1A HK16112343A HK1224024A1 HK 1224024 A1 HK1224024 A1 HK 1224024A1 HK 16112343 A HK16112343 A HK 16112343A HK 1224024 A1 HK1224024 A1 HK 1224024A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure apparatus
- device manufacturing
- manufacturing
- exposure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70133—Measurement of illumination distribution, in pupil plane or field plane
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Microscoopes, Condenser (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012248374 | 2012-11-12 | ||
US13/727,229 US9772564B2 (en) | 2012-11-12 | 2012-12-26 | Exposure apparatus and exposure method, and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1224024A1 true HK1224024A1 (zh) | 2017-08-11 |
Family
ID=50681426
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16101639.7A HK1213642A1 (zh) | 2012-11-12 | 2016-02-16 | 曝光裝置及曝光方法、以及元件製造方法 |
HK16112343.1A HK1224024A1 (zh) | 2012-11-12 | 2016-10-27 | 曝光裝置和器件製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16101639.7A HK1213642A1 (zh) | 2012-11-12 | 2016-02-16 | 曝光裝置及曝光方法、以及元件製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9772564B2 (zh) |
EP (2) | EP2917784A1 (zh) |
JP (2) | JP6423797B2 (zh) |
CN (2) | CN108919609A (zh) |
HK (2) | HK1213642A1 (zh) |
TW (3) | TWI624734B (zh) |
WO (1) | WO2014073120A1 (zh) |
Families Citing this family (18)
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---|---|---|---|---|
JP6161325B2 (ja) * | 2013-02-27 | 2017-07-12 | キヤノン株式会社 | アブソリュートエンコーダ |
JP6042564B2 (ja) * | 2013-12-06 | 2016-12-14 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 基板をアライメントする装置及び方法 |
JP2016050891A (ja) * | 2014-09-01 | 2016-04-11 | キヤノン株式会社 | X線撮像装置 |
EP3680717A1 (en) | 2015-02-23 | 2020-07-15 | Nikon Corporation | Substrate processing system and substrate processing method, and device manufacturing method |
KR20230107706A (ko) | 2015-02-23 | 2023-07-17 | 가부시키가이샤 니콘 | 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고디바이스 제조 방법 |
EP4300194A3 (en) * | 2015-02-23 | 2024-04-10 | Nikon Corporation | Measurement device, lithography system and exposure apparatus, and control method, overlay measurement method and device manufacturing method |
CN113204177A (zh) * | 2015-03-31 | 2021-08-03 | 株式会社尼康 | 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法 |
CN108475025B (zh) * | 2015-11-20 | 2021-02-26 | Asml荷兰有限公司 | 光刻设备和操作光刻设备的方法 |
JP6740370B2 (ja) | 2016-05-25 | 2020-08-12 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置 |
JP6748482B2 (ja) * | 2016-05-25 | 2020-09-02 | キヤノン株式会社 | 露光装置、および、物品の製造方法 |
EP3506012A4 (en) * | 2016-08-24 | 2020-04-15 | Nikon Corporation | MEASURING SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFACTURING METHOD |
CN113608413B (zh) | 2016-09-30 | 2024-05-28 | 株式会社尼康 | 测量系统及基板处理系统、及元件制造方法 |
CN110268334A (zh) * | 2017-02-03 | 2019-09-20 | Asml荷兰有限公司 | 曝光设备 |
JP6925921B2 (ja) * | 2017-09-26 | 2021-08-25 | 株式会社アドテックエンジニアリング | 露光装置及び露光方法 |
EP3557326A1 (de) * | 2018-04-17 | 2019-10-23 | Schneeberger Holding AG | Positioniervorrichtung zum positionieren eines objektes innerhalb einer ebene in wenigstens zwei freiheitsgraden |
CN108802882B (zh) * | 2018-06-05 | 2020-10-30 | 温州豪正实业有限公司 | 一种衍射光栅刻蚀机 |
EP3859448A1 (en) * | 2020-01-28 | 2021-08-04 | ASML Netherlands B.V. | Positioning device and method to use a positioning device |
CN114442433A (zh) * | 2020-11-02 | 2022-05-06 | 长鑫存储技术有限公司 | 承载组件及涂胶显影机 |
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US8599359B2 (en) * | 2008-12-19 | 2013-12-03 | Nikon Corporation | Exposure apparatus, exposure method, device manufacturing method, and carrier method |
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US20110096318A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110085150A1 (en) * | 2009-09-30 | 2011-04-14 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
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-
2012
- 2012-12-26 US US13/727,229 patent/US9772564B2/en active Active
- 2012-12-28 CN CN201810723808.0A patent/CN108919609A/zh active Pending
- 2012-12-28 WO PCT/JP2012/084312 patent/WO2014073120A1/en active Application Filing
- 2012-12-28 TW TW101150753A patent/TWI624734B/zh active
- 2012-12-28 TW TW107116808A patent/TW201832018A/zh unknown
- 2012-12-28 EP EP12818831.5A patent/EP2917784A1/en not_active Withdrawn
- 2012-12-28 TW TW106119444A patent/TWI628519B/zh active
- 2012-12-28 JP JP2015541306A patent/JP6423797B2/ja active Active
- 2012-12-28 EP EP16150167.1A patent/EP3029525A1/en not_active Withdrawn
- 2012-12-28 CN CN201280078120.2A patent/CN104919371B/zh active Active
-
2016
- 2016-02-16 HK HK16101639.7A patent/HK1213642A1/zh unknown
- 2016-10-27 HK HK16112343.1A patent/HK1224024A1/zh unknown
-
2017
- 2017-09-06 US US15/696,553 patent/US20170371249A1/en not_active Abandoned
-
2018
- 2018-09-03 JP JP2018164655A patent/JP2019008311A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TWI624734B (zh) | 2018-05-21 |
EP2917784A1 (en) | 2015-09-16 |
US20140132940A1 (en) | 2014-05-15 |
EP3029525A1 (en) | 2016-06-08 |
JP6423797B2 (ja) | 2018-11-14 |
TW201418896A (zh) | 2014-05-16 |
HK1213642A1 (zh) | 2016-07-08 |
CN108919609A (zh) | 2018-11-30 |
JP2019008311A (ja) | 2019-01-17 |
TWI628519B (zh) | 2018-07-01 |
TW201734672A (zh) | 2017-10-01 |
CN104919371A (zh) | 2015-09-16 |
US9772564B2 (en) | 2017-09-26 |
US20170371249A1 (en) | 2017-12-28 |
JP2015535615A (ja) | 2015-12-14 |
WO2014073120A1 (en) | 2014-05-15 |
TW201832018A (zh) | 2018-09-01 |
CN104919371B (zh) | 2018-07-31 |
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