HK1179750A1 - 曝光裝置、物體的更換方法、曝光方法、以及元件製造方法 - Google Patents

曝光裝置、物體的更換方法、曝光方法、以及元件製造方法

Info

Publication number
HK1179750A1
HK1179750A1 HK13106604.0A HK13106604A HK1179750A1 HK 1179750 A1 HK1179750 A1 HK 1179750A1 HK 13106604 A HK13106604 A HK 13106604A HK 1179750 A1 HK1179750 A1 HK 1179750A1
Authority
HK
Hong Kong
Prior art keywords
exposure
device manufacturing
exchange
exposure apparatus
exchange method
Prior art date
Application number
HK13106604.0A
Other languages
English (en)
Inventor
青木保夫
Original Assignee
株式會社尼康
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式會社尼康 filed Critical 株式會社尼康
Publication of HK1179750A1 publication Critical patent/HK1179750A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
HK13106604.0A 2010-04-01 2013-06-05 曝光裝置、物體的更換方法、曝光方法、以及元件製造方法 HK1179750A1 (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US31991710P 2010-04-01 2010-04-01
US31997610P 2010-04-01 2010-04-01
US13/042,931 US20110244396A1 (en) 2010-04-01 2011-03-08 Exposure apparatus, exchange method of object, exposure method, and device manufacturing method
PCT/JP2011/056318 WO2011122354A2 (en) 2010-04-01 2011-03-10 Exposure apparatus, exchange method of object, exposure method, and device manufacturing method

Publications (1)

Publication Number Publication Date
HK1179750A1 true HK1179750A1 (zh) 2013-10-04

Family

ID=44710079

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13106604.0A HK1179750A1 (zh) 2010-04-01 2013-06-05 曝光裝置、物體的更換方法、曝光方法、以及元件製造方法

Country Status (7)

Country Link
US (1) US20110244396A1 (zh)
JP (1) JP5776699B2 (zh)
KR (2) KR101939827B1 (zh)
CN (2) CN106019852B (zh)
HK (1) HK1179750A1 (zh)
TW (4) TWI667549B (zh)
WO (1) WO2011122354A2 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6095958B2 (ja) * 2011-12-27 2017-03-15 新光電気工業株式会社 発光装置
CN104051311B (zh) * 2014-07-08 2017-06-09 深圳市华星光电技术有限公司 基板传送装置及适用于湿制程的强酸或强碱刻蚀工艺
CN113204177A (zh) * 2015-03-31 2021-08-03 株式会社尼康 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
JP6440757B2 (ja) * 2017-03-16 2018-12-19 キヤノン株式会社 基板搬送システム、リソグラフィ装置、および物品の製造方法
WO2018180969A1 (ja) * 2017-03-31 2018-10-04 株式会社ニコン 物体交換装置、物体処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体交換方法、及び物体処理方法
JP6573131B2 (ja) * 2017-04-19 2019-09-11 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
TWI813718B (zh) * 2018-07-18 2023-09-01 日商東京威力科創股份有限公司 顯像處理裝置及顯像處理方法
CN109384062B (zh) * 2018-09-19 2020-02-18 武汉华星光电技术有限公司 一种曝光机及其传送基板的方法
CN110286563A (zh) * 2019-06-19 2019-09-27 深圳凯世光研股份有限公司 一种循环式扫描曝光机
WO2022056742A1 (en) * 2020-09-16 2022-03-24 Abb Schweiz Ag Gripper and method of operating the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0669018B2 (ja) * 1985-12-18 1994-08-31 日本電気株式会社 パタ−ン露光装置
US5729331A (en) 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
WO1997038357A1 (en) * 1996-04-11 1997-10-16 Mrs Technology, Inc. Lithography system using dual substrate stages
KR100638533B1 (ko) * 1998-02-09 2006-10-26 가부시키가이샤 니콘 기판지지장치, 기판반송장치 및 그 방법, 기판교환방법,그리고 노광장치 및 그 제조방법
JP2001343753A (ja) * 2000-05-31 2001-12-14 Orc Mfg Co Ltd 基板搬送機構および露光装置
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
JP2004001924A (ja) * 2002-05-30 2004-01-08 Nikon Corp 搬送装置及び露光装置
JP2005292645A (ja) * 2004-04-02 2005-10-20 Dainippon Printing Co Ltd 露光装置における基板の給排方法
US7538857B2 (en) * 2004-12-23 2009-05-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing a substrate handler
US7656506B2 (en) * 2004-12-23 2010-02-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing a substrate handler
JP4949439B2 (ja) * 2004-12-30 2012-06-06 エーエスエムエル ネザーランズ ビー．ブイ． 基板ハンドラ
JP4638755B2 (ja) * 2005-03-25 2011-02-23 大日本印刷株式会社 露光装置および露光方法
CN100514193C (zh) 2005-03-29 2009-07-15 株式会社尼康 曝光装置、曝光装置的制造方法以及微元件的制造方法
JP4606990B2 (ja) * 2005-10-07 2011-01-05 富士フイルム株式会社 デジタル露光装置
KR100865051B1 (ko) * 2006-05-31 2008-10-23 닛본 세이고 가부시끼가이샤 노광 장치 및 노광 방법
JP2008159784A (ja) * 2006-12-22 2008-07-10 Sumitomo Heavy Ind Ltd ステージ装置
WO2008129762A1 (ja) 2007-03-05 2008-10-30 Nikon Corporation 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法
JP5052438B2 (ja) * 2008-07-15 2012-10-17 株式会社日立ハイテクノロジーズ プロキシミティ露光装置、プロキシミティ露光装置の基板搬送方法、及び表示用パネル基板の製造方法
KR20100018950A (ko) 2008-08-08 2010-02-18 하명찬 타이어 가황기용 단열판
JP4871335B2 (ja) 2008-09-18 2012-02-08 Ｎｓｋテクノロジー株式会社 露光装置

Also Published As

Publication number Publication date
TW201202863A (en) 2012-01-16
TWI667549B (zh) 2019-08-01
KR102193252B1 (ko) 2020-12-22
US20110244396A1 (en) 2011-10-06
WO2011122354A3 (en) 2011-12-15
CN103119706B (zh) 2016-08-03
TWI541613B (zh) 2016-07-11
WO2011122354A2 (en) 2011-10-06
CN106019852A (zh) 2016-10-12
JP2013524259A (ja) 2013-06-17
KR101939827B1 (ko) 2019-01-24
KR20130093482A (ko) 2013-08-22
TW202020583A (zh) 2020-06-01
CN106019852B (zh) 2019-08-02
KR20190007110A (ko) 2019-01-21
TW201833689A (zh) 2018-09-16
TW201635044A (zh) 2016-10-01
TWI688831B (zh) 2020-03-21
CN103119706A (zh) 2013-05-22
JP5776699B2 (ja) 2015-09-09

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20210310