HK1206047A1 - Novel sulfonium borate complex - Google Patents

Novel sulfonium borate complex

Info

Publication number
HK1206047A1
HK1206047A1 HK15106577.1A HK15106577A HK1206047A1 HK 1206047 A1 HK1206047 A1 HK 1206047A1 HK 15106577 A HK15106577 A HK 15106577A HK 1206047 A1 HK1206047 A1 HK 1206047A1
Authority
HK
Hong Kong
Prior art keywords
borate complex
sulfonium borate
novel sulfonium
novel
complex
Prior art date
Application number
HK15106577.1A
Other languages
English (en)
Chinese (zh)
Inventor
新家由久
山本潤
相崎亮太
林直樹
小西美佐夫
藤田泰浩
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1206047A1 publication Critical patent/HK1206047A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
    • C07F5/02—Boron compounds
    • C07F5/027—Organoboranes and organoborohydrides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
    • C07C381/12—Sulfonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK15106577.1A 2008-12-05 2015-07-10 Novel sulfonium borate complex HK1206047A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008310827A JP5444702B2 (ja) 2008-12-05 2008-12-05 新規なスルホニウムボレート錯体

Publications (1)

Publication Number Publication Date
HK1206047A1 true HK1206047A1 (en) 2015-12-31

Family

ID=42233295

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15106577.1A HK1206047A1 (en) 2008-12-05 2015-07-10 Novel sulfonium borate complex

Country Status (8)

Country Link
US (1) US8877878B2 (de)
EP (1) EP2354123B1 (de)
JP (1) JP5444702B2 (de)
KR (1) KR101689899B1 (de)
CN (3) CN102239144B (de)
HK (1) HK1206047A1 (de)
TW (1) TWI434851B (de)
WO (1) WO2010064648A1 (de)

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JP5284916B2 (ja) * 2009-09-16 2013-09-11 電気化学工業株式会社 合成樹脂シート、基板、回路基板とその製造方法
JP4784698B1 (ja) * 2010-05-06 2011-10-05 横浜ゴム株式会社 熱硬化性エポキシ樹脂組成物
TWI424041B (zh) * 2010-08-06 2014-01-21 Asahi Kasei E Materials Corp Anisotropic conductive film and a hardening agent
JP4952866B2 (ja) * 2010-09-29 2012-06-13 横浜ゴム株式会社 カチオン重合開始剤および熱硬化性エポキシ樹脂組成物
JP5779385B2 (ja) * 2011-04-15 2015-09-16 旭化成イーマテリアルズ株式会社 接続構造体の製造方法及び接続構造体
JP5727316B2 (ja) * 2011-07-06 2015-06-03 積水化学工業株式会社 スルホニウム化合物の製造方法、並びにスルホニウムボレート錯体の製造方法
JP5740376B2 (ja) * 2011-09-30 2015-06-24 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、該組成物を用いた感活性光線性又は感放射線性膜及びパターン形成方法、並びに電子デバイスの製造方法
KR101391696B1 (ko) 2011-11-23 2014-05-07 제일모직주식회사 이방 전도성 조성물 및 필름
CN104781304B (zh) * 2012-10-16 2016-12-28 横滨橡胶株式会社 阳离子聚合引发剂、硬化剂组合物以及环氧树脂组合物
KR20160056923A (ko) * 2013-09-18 2016-05-20 주식회사 다이셀 감광성 수지 조성물 및 그의 경화물, 및 광학 부품
CN105579436B (zh) * 2013-09-25 2020-12-22 旭化成株式会社 鎓盐和包含该鎓盐的组合物
JP2015108060A (ja) * 2013-12-04 2015-06-11 旭化成イーマテリアルズ株式会社 フィルム状接続材料、接続構造体の製造方法及び接続構造体
JP2014131997A (ja) * 2013-12-26 2014-07-17 Dexerials Corp 新規なスルホニウムボレート錯体
KR101665171B1 (ko) 2014-01-29 2016-10-11 제일모직주식회사 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
KR101712703B1 (ko) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
KR101706821B1 (ko) 2014-09-01 2017-02-14 삼성에스디아이 주식회사 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
CN107074759B (zh) * 2014-09-26 2021-12-14 东京应化工业株式会社 锍盐、光产酸剂及感光性组合物
JP6394240B2 (ja) * 2014-09-29 2018-09-26 東レ株式会社 繊維強化プラスチックの製造方法
JP2016108512A (ja) * 2014-12-10 2016-06-20 日本化薬株式会社 有機ｅｌ素子用樹脂組成物、面封止剤、及びこれを用いた有機ｅｌ装置
JP6442271B2 (ja) * 2014-12-22 2018-12-19 デクセリアルズ株式会社 化合物、熱硬化性樹脂組成物、及び熱硬化性シート
JPWO2016132413A1 (ja) * 2015-02-16 2017-11-24 サンアプロ株式会社 スルホニウムボレート塩、酸発生剤及び硬化性組成物
WO2018001671A1 (en) * 2016-06-28 2018-01-04 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Electrical insulation system based on epoxy resins for generators and motors
US10301553B2 (en) 2017-02-28 2019-05-28 Ecolab Usa Inc. Use of sulfonium salts as hydrogen sulfide inhibitors
US10900128B2 (en) 2018-08-29 2021-01-26 Championx Usa Inc. Use of sulfonium salts as corrosion inhibitors
CN115073339A (zh) * 2022-06-28 2022-09-20 保定乐凯新材料股份有限公司 一种新型二聚体类硼酸锍络合物、制备方法及其应用

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JP2797024B2 (ja) * 1989-10-13 1998-09-17 三新化学工業株式会社 スルホニウム化合物
JP2706833B2 (ja) * 1990-02-14 1998-01-28 三新化学工業株式会社 カチオン重合開始剤および重合性組成物
FR2688783A1 (fr) 1992-03-23 1993-09-24 Rhone Poulenc Chimie Nouveaux borates d'onium ou de complexe organometallique amorceurs cationiques de polymerisation.
US6147184A (en) 1992-03-23 2000-11-14 Rhone-Poulenc Chimie Onium borates/borates of organometallic complexes and cationic initiation of polymerization therewith
JP3937466B2 (ja) * 1995-12-28 2007-06-27 東洋インキ製造株式会社 感エネルギー線酸発生剤、感エネルギー線酸発生剤組成物および硬化性組成物
JPH10245378A (ja) 1997-02-28 1998-09-14 Nippon Kayaku Co Ltd 新規スルホニウム塩、それからなる光重合開始剤及びエネルギー線硬化性組成物
JP4215852B2 (ja) 1997-03-10 2009-01-28 株式会社日本触媒 テトラキス（フッ化アリール）ボレート誘導体の製造方法
JP4240733B2 (ja) * 2000-02-22 2009-03-18 三菱重工業株式会社 薄型ディスプレイパネルの隔壁用組成物
US6918984B2 (en) * 2002-06-24 2005-07-19 Loctite (R&D) Limited Photocurable adhesive compositions, reaction products of which have low halide ion content
JP2006096742A (ja) 2004-08-31 2006-04-13 Sanshin Chem Ind Co Ltd スルホニウム化合物
JP2008303167A (ja) * 2007-06-07 2008-12-18 Sony Chemical & Information Device Corp 新規なスルホニウムボレート錯体
JP5190665B2 (ja) * 2007-06-15 2013-04-24 デクセリアルズ株式会社 エポキシ系樹脂組成物

Also Published As

Publication number Publication date
CN105859763A (zh) 2016-08-17
CN102239144A (zh) 2011-11-09
US8877878B2 (en) 2014-11-04
TW201026711A (en) 2010-07-16
TWI434851B (zh) 2014-04-21
JP5444702B2 (ja) 2014-03-19
WO2010064648A1 (ja) 2010-06-10
JP2010132614A (ja) 2010-06-17
EP2354123A1 (de) 2011-08-10
KR20110091864A (ko) 2011-08-16
CN104277205A (zh) 2015-01-14
EP2354123A4 (de) 2013-02-13
EP2354123B1 (de) 2015-02-25
US20110192639A1 (en) 2011-08-11
KR101689899B1 (ko) 2016-12-26
CN104277205B (zh) 2017-01-11
CN102239144B (zh) 2016-06-08
CN105859763B (zh) 2019-03-08

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