HK1171573A1 - 液體材料的塗布方法以及塗布裝置 - Google Patents

液體材料的塗布方法以及塗布裝置

Info

Publication number
HK1171573A1
HK1171573A1 HK12112373.8A HK12112373A HK1171573A1 HK 1171573 A1 HK1171573 A1 HK 1171573A1 HK 12112373 A HK12112373 A HK 12112373A HK 1171573 A1 HK1171573 A1 HK 1171573A1
Authority
HK
Hong Kong
Prior art keywords
liquid material
application device
applying liquid
applying
application
Prior art date
Application number
HK12112373.8A
Other languages
English (en)
Inventor
生島和正
Original Assignee
武藏工業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武藏工業株式會社 filed Critical 武藏工業株式會社
Publication of HK1171573A1 publication Critical patent/HK1171573A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Spray Control Apparatus (AREA)
HK12112373.8A 2009-08-11 2012-11-30 液體材料的塗布方法以及塗布裝置 HK1171573A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009186349A JP5783670B2 (ja) 2009-08-11 2009-08-11 液体材料の塗布方法、塗布装置およびプログラム
PCT/JP2010/063346 WO2011018988A1 (ja) 2009-08-11 2010-08-06 液体材料の塗布方法、塗布装置およびプログラム

Publications (1)

Publication Number Publication Date
HK1171573A1 true HK1171573A1 (zh) 2013-03-28

Family

ID=43586165

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12112373.8A HK1171573A1 (zh) 2009-08-11 2012-11-30 液體材料的塗布方法以及塗布裝置

Country Status (8)

Country Link
US (1) US8703601B2 (zh)
EP (1) EP2466630B1 (zh)
JP (1) JP5783670B2 (zh)
KR (1) KR101700255B1 (zh)
CN (1) CN102714165B (zh)
HK (1) HK1171573A1 (zh)
TW (1) TWI497613B (zh)
WO (1) WO2011018988A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5280702B2 (ja) * 2008-02-18 2013-09-04 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
JP5632838B2 (ja) * 2009-06-15 2014-11-26 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
JP6452147B2 (ja) * 2015-01-19 2019-01-16 武蔵エンジニアリング株式会社 液体材料吐出装置
JP2016131947A (ja) * 2015-01-21 2016-07-25 三菱電機株式会社 液剤塗布方法および電子装置の製造方法ならびに液剤塗布装置
US9653325B2 (en) * 2015-02-17 2017-05-16 Powertech Technology Inc. Underfill process and processing machine thereof
JP6684397B2 (ja) * 2015-04-02 2020-04-22 エムテックスマート株式会社 流体の噴出方法および流体の成膜方法
CN106094271A (zh) * 2016-06-22 2016-11-09 深圳市华星光电技术有限公司 一种显示面板切割方法
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6991475B2 (ja) * 2017-05-24 2022-01-12 協立化学産業株式会社 加工対象物切断方法
KR102323933B1 (ko) * 2017-05-25 2021-11-08 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법
JP6471258B2 (ja) * 2018-06-04 2019-02-13 武蔵エンジニアリング株式会社 液体材料塗布装置および液体材料塗布方法
CN108906508B (zh) * 2018-08-06 2020-11-27 Oppo（重庆）智能科技有限公司 胶量控制方法及胶量控制装置
JP7426198B2 (ja) * 2019-04-17 2024-02-01 株式会社ジャノメ 塗布装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2571024B2 (ja) * 1994-09-28 1997-01-16 日本電気株式会社 マルチチップモジュール
US6066509A (en) 1998-03-12 2000-05-23 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
JPH1050769A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージの製造装置および製造方法
JP3431406B2 (ja) * 1996-07-30 2003-07-28 株式会社東芝 半導体パッケージ装置
US7015592B2 (en) * 2004-03-19 2006-03-21 Intel Corporation Marking on underfill
JP4538002B2 (ja) * 2005-04-28 2010-09-08 芝浦メカトロニクス株式会社 溶液の塗布装置及び塗布方法
JP2007173621A (ja) * 2005-12-22 2007-07-05 Sharp Corp 基板に対する液膜材料の塗布方法
JP2007194403A (ja) * 2006-01-19 2007-08-02 Sony Corp 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法
JP4366611B2 (ja) 2006-09-13 2009-11-18 セイコーエプソン株式会社 半導体装置の製造方法
JP4868515B2 (ja) * 2006-11-01 2012-02-01 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP4871093B2 (ja) 2006-11-01 2012-02-08 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP5019900B2 (ja) * 2007-02-08 2012-09-05 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP4962413B2 (ja) * 2008-05-28 2012-06-27 セイコーエプソン株式会社 液状体吐出装置、及び液状体吐出方法

Also Published As

Publication number Publication date
KR101700255B1 (ko) 2017-02-13
KR20120054629A (ko) 2012-05-30
EP2466630A4 (en) 2014-02-26
US20120313276A1 (en) 2012-12-13
EP2466630B1 (en) 2019-10-02
JP2011036800A (ja) 2011-02-24
CN102714165B (zh) 2015-04-15
EP2466630A1 (en) 2012-06-20
JP5783670B2 (ja) 2015-09-24
TW201119752A (en) 2011-06-16
WO2011018988A1 (ja) 2011-02-17
CN102714165A (zh) 2012-10-03
TWI497613B (zh) 2015-08-21
US8703601B2 (en) 2014-04-22

Similar Documents

Publication Publication Date Title
HK1171573A1 (zh) 液體材料的塗布方法以及塗布裝置
HK1153426A1 (zh) 液體材料的塗布方法及其裝置
HK1193058A1 (zh) 流體塗抹裝置和方法
HK1205967A1 (zh) 流體施加設備及方法
HK1189193A1 (zh) 液體材料的塗布方法及塗布裝置
HK1140721A1 (en) Liquid material discharge device and liquid material discharge method
HUE040261T2 (hu) Berendezés és eljárás anyagok terményekre történõ felhordására
EP2465614A4 (en) APPLICATION DEVICE AND LIQUID APPLICATION METHOD
ZA201303117B (en) Device and method for dispensing liquids
HK1145474A1 (en) Liquid material applicator and application method
EP2339837A4 (en) DISPLAY DEVICE AND CONTROL METHOD THEREFOR
EP2348303A4 (en) LIQUID INSPECTION PROCESS AND DEVICE
HK1137162A1 (zh) 粘性液體材料的排出方法及裝置
EP2437015A4 (en) METHOD AND DEVICE FOR DRYING MATERIALS
EP2444147A4 (en) SUBSTANCE MIXING DEVICE AND SUBSTANCE MIXING METHOD
HK1136088A1 (en) Method and apparatus for applying liquid material
EP2237639A4 (en) DEVICE AND METHOD FOR HEATING MATERIAL
IL211426A0 (en) Liquid heating apparatus and liquid heating method
EP2511898A4 (en) DISPLAY DEVICE AND CONTROL METHOD THEREFOR
EP2444164A4 (en) PROCESS FOR APPLYING LIQUID MATERIAL AND DEVICE AND PROGRAM THEREFOR
HK1175363A1 (zh) 經皮給藥的分配裝置和方法
EP2349849A4 (en) METHOD AND DEVICE FOR SUPPRESSING CONTAINERS
EP2469206A4 (en) METHOD AND DEVICE FOR DRYING CAPILLARY POROUS MASS GOODS
ZA201106893B (en) Application apparatus and method
PL2186573T3 (pl) Urządzenie do termonebulizacji cieczy oraz sposób termonebulizacji cieczy