HK1189193A1 - 液體材料的塗布方法及塗布裝置 - Google Patents
液體材料的塗布方法及塗布裝置Info
- Publication number
- HK1189193A1 HK1189193A1 HK14102263.0A HK14102263A HK1189193A1 HK 1189193 A1 HK1189193 A1 HK 1189193A1 HK 14102263 A HK14102263 A HK 14102263A HK 1189193 A1 HK1189193 A1 HK 1189193A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- application
- liquid material
- application method
- application device
- liquid
- Prior art date
Links
- 239000011344 liquid material Substances 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
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- H01L2224/161—Disposition
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- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/758—Means for moving parts
- H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
- H01L2224/75804—Translational mechanism
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- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
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- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83102—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011008648A JP5779353B2 (ja) | 2011-01-19 | 2011-01-19 | 液体材料の塗布方法、塗布装置およびプログラム |
PCT/JP2012/050912 WO2012099147A1 (ja) | 2011-01-19 | 2012-01-18 | 液体材料の塗布方法、塗布装置およびプログラム |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1189193A1 true HK1189193A1 (zh) | 2014-05-30 |
Family
ID=46515770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14102263.0A HK1189193A1 (zh) | 2011-01-19 | 2014-03-06 | 液體材料的塗布方法及塗布裝置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10086573B2 (zh) |
EP (1) | EP2666545B1 (zh) |
JP (1) | JP5779353B2 (zh) |
KR (1) | KR101901217B1 (zh) |
CN (1) | CN103391820B (zh) |
HK (1) | HK1189193A1 (zh) |
TW (1) | TWI537061B (zh) |
WO (1) | WO2012099147A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6078298B2 (ja) * | 2012-11-01 | 2017-02-08 | 武蔵エンジニアリング株式会社 | 位置補正機能を有する作業装置および作業方法 |
US9057642B2 (en) * | 2012-12-03 | 2015-06-16 | Illinois Tool Works Inc. | Method and apparatus for calibrating a dispenser |
JP6183597B2 (ja) * | 2013-08-05 | 2017-08-23 | Tdk株式会社 | 液滴塗布装置 |
US10559864B2 (en) | 2014-02-13 | 2020-02-11 | Birmingham Technologies, Inc. | Nanofluid contact potential difference battery |
JP6538649B2 (ja) * | 2014-03-10 | 2019-07-03 | 武蔵エンジニアリング株式会社 | 塗布装置および塗布方法 |
JP6538465B2 (ja) * | 2015-07-24 | 2019-07-03 | 武蔵エンジニアリング株式会社 | 固体粒子を含有する液体材料の吐出装置および塗布装置並びに塗布方法 |
JP6541489B2 (ja) * | 2015-07-24 | 2019-07-10 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
JP6778426B2 (ja) * | 2016-09-20 | 2020-11-04 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
CN108906508B (zh) * | 2018-08-06 | 2020-11-27 | Oppo(重庆)智能科技有限公司 | 胶量控制方法及胶量控制装置 |
KR20210045625A (ko) | 2019-10-17 | 2021-04-27 | 주식회사 엘지화학 | 활물질 이중층을 형성하는 전극 슬러리 코팅 장치 및 방법 |
US11244816B2 (en) | 2019-02-25 | 2022-02-08 | Birmingham Technologies, Inc. | Method of manufacturing and operating nano-scale energy conversion device |
US11101421B2 (en) | 2019-02-25 | 2021-08-24 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
US10950706B2 (en) | 2019-02-25 | 2021-03-16 | Birmingham Technologies, Inc. | Nano-scale energy conversion device |
CN109847971A (zh) * | 2019-03-02 | 2019-06-07 | 西华大学 | 一种具有低流速和高精度的自动化涂料装置及方法 |
US11124864B2 (en) | 2019-05-20 | 2021-09-21 | Birmingham Technologies, Inc. | Method of fabricating nano-structures with engineered nano-scale electrospray depositions |
US11046578B2 (en) * | 2019-05-20 | 2021-06-29 | Birmingham Technologies, Inc. | Single-nozzle apparatus for engineered nano-scale electrospray depositions |
JP7467176B2 (ja) | 2020-03-16 | 2024-04-15 | 日本発條株式会社 | 接着剤の塗布方法および塗布装置 |
JP7315787B2 (ja) * | 2020-03-31 | 2023-07-26 | 株式会社Fuji | 印刷制御装置および印刷制御方法 |
US11649525B2 (en) | 2020-05-01 | 2023-05-16 | Birmingham Technologies, Inc. | Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method |
US11417506B1 (en) | 2020-10-15 | 2022-08-16 | Birmingham Technologies, Inc. | Apparatus including thermal energy harvesting thermionic device integrated with electronics, and related systems and methods |
US11616186B1 (en) | 2021-06-28 | 2023-03-28 | Birmingham Technologies, Inc. | Thermal-transfer apparatus including thermionic devices, and related methods |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3877038B2 (ja) | 1999-11-10 | 2007-02-07 | 武蔵エンジニアリング株式会社 | 液体の塗布方法および装置 |
JP2002303275A (ja) * | 2001-04-09 | 2002-10-18 | Iwashita Engineering Inc | 定量吐出器の吐出量補正方法 |
JP4032729B2 (ja) | 2001-12-19 | 2008-01-16 | 松下電器産業株式会社 | 流体塗布方法 |
SE0202247D0 (sv) | 2002-07-18 | 2002-07-18 | Mydata Automation Ab | Jetting device and method at a jetting device |
US20050001869A1 (en) * | 2003-05-23 | 2005-01-06 | Nordson Corporation | Viscous material noncontact jetting system |
KR101045754B1 (ko) | 2004-04-09 | 2011-06-30 | 파나소닉 주식회사 | 점성 유체 도포 장치 |
JP4382595B2 (ja) * | 2004-07-09 | 2009-12-16 | パナソニック株式会社 | 粘性流体供給装置及びその固化防止方法 |
JP4889967B2 (ja) * | 2005-07-01 | 2012-03-07 | 芝浦メカトロニクス株式会社 | 液状物質滴下装置及び液状物質滴下方法 |
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JP4871093B2 (ja) | 2006-11-01 | 2012-02-08 | 武蔵エンジニアリング株式会社 | 液体材料の充填方法、装置およびプログラム |
JP5280702B2 (ja) * | 2008-02-18 | 2013-09-04 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、その装置およびそのプログラム |
JP5632838B2 (ja) * | 2009-06-15 | 2014-11-26 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、その装置およびそのプログラム |
-
2011
- 2011-01-19 JP JP2011008648A patent/JP5779353B2/ja active Active
-
2012
- 2012-01-18 KR KR1020137021496A patent/KR101901217B1/ko active IP Right Grant
- 2012-01-18 EP EP12736584.9A patent/EP2666545B1/en active Active
- 2012-01-18 WO PCT/JP2012/050912 patent/WO2012099147A1/ja active Application Filing
- 2012-01-18 CN CN201280005931.XA patent/CN103391820B/zh active Active
- 2012-01-18 US US13/978,801 patent/US10086573B2/en active Active
- 2012-01-19 TW TW101102131A patent/TWI537061B/zh active
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2014
- 2014-03-06 HK HK14102263.0A patent/HK1189193A1/zh unknown
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Publication number | Publication date |
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CN103391820B (zh) | 2016-04-13 |
EP2666545B1 (en) | 2019-05-15 |
KR20140003542A (ko) | 2014-01-09 |
CN103391820A (zh) | 2013-11-13 |
US10086573B2 (en) | 2018-10-02 |
TW201240739A (en) | 2012-10-16 |
WO2012099147A1 (ja) | 2012-07-26 |
EP2666545A1 (en) | 2013-11-27 |
JP5779353B2 (ja) | 2015-09-16 |
US20130313745A1 (en) | 2013-11-28 |
EP2666545A4 (en) | 2016-03-02 |
KR101901217B1 (ko) | 2018-09-21 |
JP2012148235A (ja) | 2012-08-09 |
TWI537061B (zh) | 2016-06-11 |
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