HK1153426A1 - 液體材料的塗布方法及其裝置 - Google Patents

液體材料的塗布方法及其裝置

Info

Publication number
HK1153426A1
HK1153426A1 HK11107495.2A HK11107495A HK1153426A1 HK 1153426 A1 HK1153426 A1 HK 1153426A1 HK 11107495 A HK11107495 A HK 11107495A HK 1153426 A1 HK1153426 A1 HK 1153426A1
Authority
HK
Hong Kong
Prior art keywords
liquid material
device therefor
applying liquid
applying
therefor
Prior art date
Application number
HK11107495.2A
Other languages
English (en)
Inventor
生島和正
Original Assignee
武藏工業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武藏工業株式會社 filed Critical 武藏工業株式會社
Publication of HK1153426A1 publication Critical patent/HK1153426A1/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/004Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
    • B05B12/006Pressure or flow rate sensors
    • B05B12/008Pressure or flow rate sensors integrated in or attached to a discharge apparatus, e.g. a spray gun
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/08Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape of pulsating nature, e.g. delivering liquid in successive separate quantities ; Fluidic oscillators
    • B05B1/083Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape of pulsating nature, e.g. delivering liquid in successive separate quantities ; Fluidic oscillators the pulsating mechanism comprising movable parts
    • HELECTRICITY
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27Manufacturing methods
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    • H01L2224/27312Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
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    • H01L2224/29099Material
    • H01L2224/2919Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/3205Shape
    • H01L2224/32052Shape in top view
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    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
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    • H01L2224/831Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83104Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus by applying pressure, e.g. by injection
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    • H01L2224/8319Arrangement of the layer connectors prior to mounting
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    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/921Connecting a surface with connectors of different types
    • H01L2224/9212Sequential connecting processes
    • H01L2224/92122Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12042LASER

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
HK11107495.2A 2008-02-18 2011-07-19 液體材料的塗布方法及其裝置 HK1153426A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008036628A JP5280702B2 (ja) 2008-02-18 2008-02-18 液体材料の塗布方法、その装置およびそのプログラム
PCT/JP2009/000649 WO2009104383A1 (ja) 2008-02-18 2009-02-18 液体材料の塗布方法、その装置およびそのプログラム

Publications (1)

Publication Number Publication Date
HK1153426A1 true HK1153426A1 (zh) 2012-03-30

Family

ID=40985272

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11107495.2A HK1153426A1 (zh) 2008-02-18 2011-07-19 液體材料的塗布方法及其裝置

Country Status (8)

Country Link
US (1) US8821959B2 (zh)
EP (1) EP2246125B1 (zh)
JP (1) JP5280702B2 (zh)
KR (1) KR101605434B1 (zh)
CN (1) CN102066008B (zh)
HK (1) HK1153426A1 (zh)
TW (1) TWI471177B (zh)
WO (1) WO2009104383A1 (zh)

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JP5441644B2 (ja) * 2009-12-01 2014-03-12 武蔵エンジニアリング株式会社 卓上型作業装置
JP5779353B2 (ja) 2011-01-19 2015-09-16 武蔵エンジニアリング株式会社 液体材料の塗布方法、塗布装置およびプログラム
US10814351B2 (en) * 2013-08-12 2020-10-27 The Boeing Company High-viscosity sealant application system
US10434525B1 (en) * 2016-02-09 2019-10-08 Steven C. Cooper Electrostatic liquid sprayer usage tracking and certification status control system
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6920923B2 (ja) 2017-08-25 2021-08-18 株式会社Screenホールディングス ポンプ装置および基板処理装置
CN108906508B (zh) * 2018-08-06 2020-11-27 Oppo(重庆)智能科技有限公司 胶量控制方法及胶量控制装置
JP6999526B2 (ja) 2018-09-21 2022-01-18 Ntn株式会社 液状材料塗布装置
JP7426198B2 (ja) * 2019-04-17 2024-02-01 株式会社ジャノメ 塗布装置
KR102132796B1 (ko) * 2020-01-14 2020-07-10 최상철 디스펜서 및 이에 사용되는 마이크로프리퀀시밸브
CN115990568B (zh) * 2022-11-29 2024-07-30 歌尔股份有限公司 喷胶控制方法、装置、设备及存储介质

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CN102066008B (zh) 2014-03-19
JP5280702B2 (ja) 2013-09-04
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US20110042478A1 (en) 2011-02-24
US8821959B2 (en) 2014-09-02
EP2246125B1 (en) 2019-05-22
TW200946242A (en) 2009-11-16
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TWI471177B (zh) 2015-02-01
WO2009104383A1 (ja) 2009-08-27

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