TWI471177B - A method of coating a liquid material, a device thereof, and a memory medium having a memory - Google Patents
A method of coating a liquid material, a device thereof, and a memory medium having a memory Download PDFInfo
- Publication number
- TWI471177B TWI471177B TW98105085A TW98105085A TWI471177B TW I471177 B TWI471177 B TW I471177B TW 98105085 A TW98105085 A TW 98105085A TW 98105085 A TW98105085 A TW 98105085A TW I471177 B TWI471177 B TW I471177B
- Authority
- TW
- Taiwan
- Prior art keywords
- discharge
- coating
- amount
- liquid material
- correction
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims description 122
- 239000011248 coating agent Substances 0.000 title claims description 104
- 239000011344 liquid material Substances 0.000 title claims description 86
- 238000000034 method Methods 0.000 title claims description 21
- 238000012937 correction Methods 0.000 claims description 84
- 239000000758 substrate Substances 0.000 claims description 25
- 238000004364 calculation method Methods 0.000 claims description 20
- 238000007599 discharging Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims description 2
- 208000028659 discharge Diseases 0.000 description 143
- 230000008859 change Effects 0.000 description 36
- 230000007246 mechanism Effects 0.000 description 9
- 239000011345 viscous material Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 8
- 238000003860 storage Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
- B05B12/006—Pressure or flow rate sensors
- B05B12/008—Pressure or flow rate sensors integrated in or attached to a discharge apparatus, e.g. a spray gun
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/08—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape of pulsating nature, e.g. delivering liquid in successive separate quantities ; Fluidic oscillators
- B05B1/083—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape of pulsating nature, e.g. delivering liquid in successive separate quantities ; Fluidic oscillators the pulsating mechanism comprising movable parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32052—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83104—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus by applying pressure, e.g. by injection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
本發明係關於一種對工件塗佈規定塗佈量之液體材料的方法及裝置、暨程式,例如在半導體封裝的填底(under fill)步驟中,不必執行複雜之參數計算下修正液體材料之排出量的方法及裝置暨程式。
習知在液體材料之定量排出中,若經長時間排出,液體材料便會發生經時黏度變化,導致排出量發生變動的問題。
因此,申請人有提案一種液體定量排出裝置,其為對前端具有噴嘴的注射器內之液體材料施加調壓空氣經所需時間的氣動式排出裝置,其中,藉由調整排出時間而控制排出量(專利文獻1)。
近年,隨晶片的小型化、高密度安裝化、或者塗佈作業的多樣化,要求持續施行微量精密塗佈,必須將排出量之變動抑制更少。尤以填底步驟中,更要求微量之精密塗佈。
在填底步驟中,為了補強連接部103,便在半導體晶片101與基板102間利用毛細管現象填充作為液體材料之樹脂104(參照圖1)。因此,當隨時間經過使樹脂材料黏度提高,則從材料排出口的排出量便會減少,毛細管現象不夠充分,導致無法將適當量的材料填充於間隙中的問題。上述樹脂材料中黏度變化較劇烈時,例如亦會有經6小時後減少10%以上排出量之情況。
在填底步驟中實施排出量之修正的方法,例如在日本專利特開2004-344883號(專利文獻2)中有所開示。亦即,專利文獻2揭示一種使用噴射式分注器在基板上排出黏性材料的方法,其包括有:準備應排出黏性材料之總體積與排出總體積之黏性材料的長度;在重量計上以塗佈複數黏性材料液滴的方式產生動作;生成表示在重量計上經塗佈的複數黏性材料液滴之重量的回饋信號;及以總體積黏性材料沿長度排出的方式,求取分注器與基板間的最大相對速度。
再者,專利文獻2揭示一種方法更包含:求取複數黏性材料液滴的各體積;求取大致等於總體積所需要的液滴全數;求取沿長度大致均勻分配黏性材料液滴所需要的各液滴間距離;及為了將黏性材料液滴全數於長度大致均勻排出,而求取分注器與基板間之最大相對速度。
(專利文獻1)日本專利特開平4-200671號公報
(專利文獻2)日本專利特開2004-344883號公報
然而,專利文獻1所記載之液體定量排出裝置由於為一種在液體材料離開排出部前便接觸工件的排出方式,因而不同於液體材料離開排出部後才接觸到工件的排出方式,在排出結束後,藉由將排出部朝上方移動、或使排出部持續相對移動稍微大於塗佈長度,而使液體材料離開排出部。因此,當在排出部與工件間發生液體材料拉絲、或斷絲時,便會有排出部側之液體材料被工件拉引導致排出量過剩、或相反工件側之液體材料被排出部側拉引導致排出量不足等造成塗佈量出現變動的問題。
再者,在專利文獻2所記載的方法中,為了可於長度均勻地排出,便需要有求取液滴數與各液滴之間隔之步驟,在該步驟內計算求取各種參數,因而在計算時大多會出現誤差。
再者,為達更正確地均勻化,必須使每個液滴之大小一致,因此需要特別的手段。
再者,噴嘴(排出部)與基板間之最大相對速度變更,當黏度變大時便朝速度變慢的方向變化。當速度變慢,則塗佈時間拉長,導致有對生產性造成影響的問題。
因此,本發明目的在於解決上述問題,提供一種不需要複雜的參數計算且不會對排出部之移動速度造成影響的液體材料之塗佈方法、其裝置及其程式。
為了解決上述問題,本案發明者嘗試藉由將液體材料以脈衝狀排出並變更脈衝信號之頻率,而簡易修正排出量。然而,經由使脈衝信號之頻率為可變化方式進行實驗後,卻無法適當地修正排出量。尤其在噴射式分注器中,若活塞(柱塞)上下作動的頻率變慢、變快,便會有液體材料離開噴嘴前端、或分離為二個以上液滴的情況。發明者發現對於每種液體材料都具有為使每一滴從噴嘴前端分離之最佳脈衝信號頻率範圍,遂完成本發明。
第1發明的塗佈方法,係製作所希望之塗佈圖案,一邊使噴嘴與工件進行相對移動,一邊將液體材料從噴嘴排出,而對工件塗佈規定塗佈量之液體材料的塗佈方法;其特徵在於,其包括有:初期參數設定步驟,將傳送排出脈衝信號及暫停脈衝信號的次數規定為總脈衝數,且規定總脈衝數中為了達成塗佈量所必要的排出脈衝信號數,而將其餘規定為暫停脈衝信號;修正量算出步驟,以預設之修正週期,計測在修正週期時從噴嘴之排出量,並計算出排出量之修正量;及排出量修正步驟,根據在修正量算出步驟所計算出的修正量,調整排出脈衝信號數與暫停脈衝信號數。
第2發明係就第1發明中,上述排出量修正步驟在不變化上述排出脈衝信號與上述暫停脈衝信號之發送頻率下修正排出量。
第3發明係就第2發明中,上述頻率為數十赫茲~數百赫茲。
第4發明係就第1至3中任一發明中,上述修正量算出步驟係根據計測一定時間內排出的液體材料之重量而得之值、與該一定時間之理論值的差值,而計算出排出量之修正量。
第5發明係就第1至3中任一發明中,上述修正量算出步驟係根據計測一定時間所排出的液體材料之面積及/或高度而得之值、與該一定時間之理論值的差值,而計算出排出量之修正量。
第6發明係就第1至3中任一發明中,上述修正量算出步驟係根據計測經依上述塗佈圖案之塗佈形成在工件端部的液體材料之填角寬度而得之值、與該塗佈圖案之理論值的差值,而計算出排出量之修正量。
第7發明係就第4至6中任一發明中,設定判斷在上述修正量算出步驟以前之步驟中是否要施行修正的容許範圍,上述修正量算出步驟當上述差值超過上述容許範圍時,便計算出排出量之修正量。
第8發明係就第1至7中任一發明中,上述塗佈係藉由在液體材料離開噴嘴後才接觸工件的排出方式而進行。
第9發明係就第8發明中,上述塗佈係在基板與其上所載置的工件之間隙中利用毛細管現象填充規定之塗佈量的液體材料。
第10發明係就第9發明中,上述排出量修正步驟在增加暫停脈衝信號時便減少對於暫停脈衝信號數之排出脈衝信號數。
第11發明係就第1至10中任一發明中,上述修正週期係根據使用者所輸入作為修正週期之時間資訊、工件片數、或基板片數而被設定。
第12發明係就第1至11中任一發明中,上述排出量修正步驟係在不變化上述塗佈圖案之塗佈長度、及噴嘴與工件之相對移動速度下修正排出量。
第13發明的塗佈裝置係具備有:供應液體材料的液材供應部、具有將從液材供應部所供應之液體材料排出的排出口之排出部、計測從排出口所排出的液體材料量之計量部、使排出口與工件進行相對移動的驅動部、及對該等動作進行控制之控制部;其特徵在於,控制部係具有實施第1至12項中任一項發明之塗佈方法的程式。
第14發明為一種使塗佈裝置之控制部執行第1至12中任一發明之塗佈方法的程式,該塗佈裝置係具備有:供應液體材料的液材供應部、具有將液體材料排出之排出口的排出部、計測從排出口所排出的液體材料量之計量部、使排出口與工件進行相對移動的驅動部、及對該等動作進行控制之控制部的塗佈裝置。
根據本發明,在對塗佈圖案全長施行均勻塗佈不受約束可自由製作塗佈圖案。
再者,相較於針對每個液滴施行修正之情況,步驟較為簡便,不易發生計算誤差。
再者,因為不變更排出裝置之移動速度,因此不會對塗佈時間造成影響。
再者,因為可在不會變化塗佈長度及脈衝信號之頻率的情況下修正排出量,因此修正不會對工件上之塗佈品質造成影響。
本發明的最佳形態係經由:[1]製成塗佈圖案、[2]設定該塗佈圖案的初期參數(排出脈衝數與暫停脈衝數)、[3]設定隨時間經過等所變化的排出量之修正週期,而開始進行塗佈作業。在[4]塗佈作業的途中,由[3]所設定的修正週期而計算出修正量,並在[5]中判定是否需要修正排出量,視需要修正排出量。以下,詳述該等各項步驟。
考慮依工件形狀而定的塗佈量與塗佈長度等來製作塗佈圖案。此處,所謂「塗佈量」係指塗佈圖案所需要的液體材料量,所謂「塗佈長度」係指噴嘴與工件的相對移動量之總長。
塗佈圖案係由一次以上的排出脈衝601與0次以上的暫停脈衝602所構成。由排出脈衝601與暫停脈衝602構成的脈衝信號以既定頻率進行發送。頻率與射出數/秒原則上保持一致。頻率較佳為數十赫茲以上、更佳係設為數百赫茲。
以下參照圖2,對沿方形工件的晶片101一邊之線上進行塗佈之圖案製作進行說明。圖2中,塗佈區域141對應於排出脈衝601。塗佈區域141的排出量藉由設定排出脈衝601而控制,由此使塗佈區域141之長度便會有伸縮。此外,藉由設定暫停脈衝602,使非塗佈區域142伸縮。
另外,並不受限於沿晶片101一邊,亦可沿二邊、三邊或整個周圍。此外,工件並不受限於方形,亦可為圓形、多角形。
塗佈圖案全長、塗佈區域141與非塗佈區域142之數量依照期望之塗佈圖案所必要的液體材料5之重量或體積等而決定。塗佈區域141不受限於線狀,亦有點陣狀的情況,例如在填底步驟中,當晶片101較小的情況、或欲提升良率的情況下(欲減少因氣泡捲入所造成不良之情況),而會有在邊之中心附近以一點排出、或將噴嘴停止於一處而排出一定時間。
設定排出脈衝601之數目及暫停脈衝602之數目作為初期參數。在控制部中預先記憶有規定排出脈衝601之數目與暫停脈衝602之數目組合的設定表301。
表1所示係控制部所記憶的設定表301之一例。表1中,設定例A係指總脈衝數為100時的排出量之設定例,設定例B係指當總脈衝數為111時的排出量之設定例,設定例C係指當總脈衝數為125時的排出量之設定例。設定例A、B、C中,排出脈衝數係相當於排出量,藉由增減總脈衝數中之暫停脈衝數,而可調整排出量。
設定例A係規定當排出脈衝數為100時,針對1次排出脈衝以未設定暫停脈衝(0次暫停脈衝)之組合為基準使排出量變化的設定例。
設定例B係規定當排出脈衝數為100時,針對9次排出脈衝以設定1次暫停脈衝(11次暫停脈衝)之組合為基準使排出量變化的設定例。
設定例C係規定當排出脈衝數為100時,針對4次排出脈衝以設定1次暫停脈衝(25次暫停脈衝)之組合為基準使排出量變化的設定例。
另外,表1中,表示將在一個步驟中所設定之暫停脈衝數設為一次之組合例,當然藉由將一個步驟中所設定之暫停脈衝數增加為二次、三次,亦可以更細微之解析能力控制排出量。
在增加暫停脈衝數時、或在後述排出量之修正中增減暫停脈衝數之情況下,最好以使暫停脈衝之時序成等間隔方式設定初期參數。
另外,於填底步驟中,當將暫停脈衝數增加為二次、三次時,相較於使暫停脈衝數連續而增加間隙(非塗佈區域),減少對於暫停脈衝數之排出脈衝數而縮小間隙(非塗佈區域)就防止氣泡捲入的觀點而言較佳。
在設定初期參數時,最好不是從未含暫停脈衝的組合(即暫停脈衝數=0之組合)開始進行調整,而是從含有暫停脈衝的組合開始進行調整。換言之,在設定有一以上之暫停脈衝的參數中,可因應必須增加排出量之情況和必須減少的情況之二者。另外,在後述之修正中,將初期參數設定時之排出量設為100%來修正排出量。
設定作為修正排出量之週期的修正週期。作為修正週期,設定例如使用者輸入的時間資訊、晶片101或基板102的片數等。在設定既定時間之情況下,設定假設液體材料104之排出量變化從作業開始起便超過容許範圍的時間。在設定片數之情況下,便由處理一片晶片的時間或處理一片基板的時間(搬入→塗佈→搬出的時間)與上述既定時間,求得並設定處理片數。
在設定修正週期時,最好針對塗佈所使用的液體材料,由預先的試驗計算出塗佈圖案與適當重量及/或適當排出時間之關係,並將該等值反應在修正週期。雖亦有因溫度變化產生液體材料之黏度變化或因排出部阻塞與水頭差所造成的影響,但藉由設定該等參數,便可全盤適用於排出量之變化。
再者,作為液體材料之使用時間的極限值,亦可預先記憶根據製造商所規定之適用時間(pot life)而計算出的數值,亦可置於修正週期中。
在設定修正週期時,必須考慮因時間經過或溫度變化所發生液體材料之黏度變化,以下以僅因時間經過所產生之黏度變化為前提來進行說明。
另外,利用排出部之溫度調整而控制液體材料黏度的習知技術,當然亦可併用於本發明中。
依所設定的修正週期,計算出對應至液體材料黏度變化所引起排出量變化的修正量。
作為修正量之算出手法有:(A)測定排出一定時間時的重量,根據與適當重量之差計算出修正量的手法;(B)測定直到達到適當重量為止所需要的排出時間,根據與之前排出時間之差,計算出修正量的手法。於本發明中可採用任何手法,以下根據(A)的手法,說明具體修正量之算出步驟。
首先,使噴嘴朝重量計上方移動,並在固定位置處排出液體材料104。對重量計的排出係在所計算出的適當排出時間期間連續實施。適當排出時間係使用含有排出脈衝601與暫停脈衝602的初期設定參數,根據由對適當塗佈長度以適當塗佈速度進行排出而獲得的適當排出量計算出。
接著,讀取對重量計排出的液體材料104之重量G1
。從該計測重量G1
與適當重量G0
計算出變化率R(=(G1
-G0
)/G0
×100),藉此可知該修正週期中的目前排出量Vt
。當變化率R為負時,因為適當排出時間中的排出量Vt
會少於適當重量,因此便從控制部所記憶設定表301中,選擇經加權因應該變化率R的排出量增加部分之設定,設定經修正後之排出脈衝601與暫停脈衝602的數目。反之,當變化率R為正時,因為適當排出時間中的排出量Vt
會多於適當重量,因此便從控制部所記憶之設定表301中,選擇經加權因應該變化率R的排出量減少部分之設定,設定經修正後之排出脈衝601與暫停脈衝602之數目。
當於上述[4]中判定必須要修正排出量時,便從控制部所記憶之設定表301中,選擇經加權對應變化率R的排出量增加或減少部分之設定,變更排出脈衝601與暫停脈衝602之數目設定,藉此進行修正。
此處,排出量之判定最好不是在重量差或變化率非為零之情況時經常實施修正,而是僅當所測得排出量(計測值)之差或變化率超過容許範圍(例如±5%)時才施行修正。設定容許範圍之修正較佳態樣,於本案申請人所提出申請的日本專利第3877038號有詳細記載。即,設定判斷是否執行修正的容許範圍,僅當差值或變化率超過上述所容許範圍的情況才修正塗佈圖案。
如上述,上述[4]及上述[5]的步驟係在依上述[3]所設定修正週期中、或基板種類(大小或形狀)變化等情況時才實施,藉此便可無關液體材料的經時黏度變化,可時常實現較佳之塗佈量。
以下,利用實施例說明本發明詳細內容,惟本發明並不受該等實施例任何限制。
本實施例的塗佈裝置401為例如填底步驟所使用的塗佈裝置,如圖3所示,其具備有:排出裝置501、XY驅動機構402、作為計量部的重量計403、搬送機構404、及控制該等動作之控制部502(圖3中未圖示)。
排出裝置501為噴射式,具有用以將液體材料104排出的噴嘴506。排出裝置501係安裝於XY驅動機構402上,可朝基板102上及重量計403上移動。
XY驅動機構402可在基板102上方一邊朝XY方向移動,一邊可進行將液體材料104塗佈為所希望圖案的動作。
在開始塗佈時,首先,將作為塗佈對象物的覆晶安裝基板102利用搬送機構404搬送至排出裝置501下方。
在將基板102搬運至噴嘴506下方而將基板102定位後才使排出裝置501開始塗佈。噴嘴506之塗佈動作軌跡(亦即基本的塗佈圖案),係預先記憶於控制部502內之記憶體等之中。
當塗佈結束後,基板102便由搬送機構404搬出於塗佈裝置401外。接著,搬入下個基板102,並重複施行塗佈作業。如此,搬入、塗佈及搬出便成為一個步驟,至對所希望片數基板的塗佈結束為止前,均重複施行塗佈作業。
在上述循環的途中,在預設的修正週期之時序,修正排出量。亦即,利用液體材料104之黏度變化,修正經變化之排出量。修正量之算出係藉由XY驅動機構402使噴嘴506移動至重量計403上方,由重量計403計測液體材料104之重量來進行。關於修正步驟的詳細內容將於後述。
排出裝置501係如圖4所示,具備有:上下可移動自如地內設之活塞504、通過壓縮氣體供應線507而經調壓之壓縮氣體加壓的儲存容器505、及與儲存容器505相連通的噴嘴506。
儲存容器505中所填充的液體材料104係對應至從控制部502經由脈衝信號供應線503所發送的脈衝信號(601、602),藉由使活塞504上下作動,而從噴嘴506中以液滴狀排出。從噴嘴506所排出的液體材料104係朝定位在噴嘴506下方的基板102與重量計403等點狀塗佈。此處,儲存容器505經從控制部502透過壓縮氣體供應線507供應之調壓的壓縮氣體所加壓。
排出裝置501對一次的脈衝信號601使活塞504進行一往復,從噴嘴506中排出一滴之液體材料104。亦即,一循環相當於一射出。
脈衝信號(601、602)係如圖5所示提供,當脈衝信號成ON狀態(601)時便使活塞上升而使噴嘴口開放,接著,當脈衝信號成OFF時便使活塞下降而使噴嘴口封閉。然後,活塞上升(噴嘴口開放)與活塞下降(噴嘴口封閉)為一循環,在一循環之動作下排出一滴液體材料。另一方面,當脈衝信號為OFF狀態(602)時,活塞便不會產生動作,而使噴嘴口封閉一循環。
另外,亦可調整一循環內的ON狀態時間(上升時間)與OFF狀態時間(下降時間)。
當沿工件邊緣施行塗佈時,控制部502在開始塗佈之同時,一邊使噴嘴506移動,一邊對排出裝置501以預設頻率發送脈衝信號(601、602),而連續地排出液體材料104。沿工件邊緣排出的液體材料104係在工件101與基板102的間隙中藉由毛細管現象填充。
對排出裝置501所發送的脈衝信號之頻率設定,係根據排出裝置501之機械響應特性與液體材料104之特性來進行。最佳頻率依排出量而異,大多使用例如約100~200赫茲。
若頻率有變更,則排出量等亦會有改變,但排出量對頻率變更的變化特性並非線性,依條件亦會有無法噴射的情況。所以,當在對同一塗佈圖案的塗佈作業中修正排出量時,最好不要變更一經設定的頻率。亦即,本實施例之特徵在於:藉由調整排出脈衝601與暫停脈衝602之比例而修正排出量,並非藉由變更脈衝信號之頻率而修正排出量。
圖6所示係說明本實施例之修正步驟的流程圖。
首先,就包括排出脈衝601與暫停脈衝602的複數脈衝,施行從適當塗佈長度與適當塗佈速度所求得之經適當排出時間部分發送的排出(STEP11)。接著,計測所排出的液體材料104之重量G1
(STEP12)。接著,將適當重量G0
與計測重量G1
相比較(STEP13),由重量差是否有超過容許範圍而判定是否需修正(STEP14)。
若在STEP14中判斷需要修正時,便從適當重量G0
與計測重量G1
計算出變化率R(=(G1
-G0
)/G0
×100)(STEP15),判斷變化率R之正負(STEP16)。
若變化率R為負時,因為排出量較少於適當重量,因而從控制部中所記憶的表中選擇經加權因應該變化率的排出量增加部分之設定,再度設定排出脈衝601與暫停脈衝602之數值(STEP17)。
若變化率R為正時,因為排出量較多於適當重量,因而從控制部中所記憶的表中選擇經加權因應該變化率的排出量減少部分之設定,再度設定排出脈衝601與暫停脈衝602之數值(STEP18)。
作為上述修正步驟之變化例,容許範圍亦可並非以重量差而是以變化率設定來判定修正之有無。此情況下,未施行STEP14,而是在STEP15與STEP16間施行判定。
根據上述本實施例的裝置,藉由預先記憶由預先運算所規定的調整比率(設定表),而可不用考慮液體材料之性質等下進行調整。又,在修正時不變更塗佈長度,藉此可將填角(Fillet)形狀(寬度等)保持成安定狀態。
在實施例1的塗佈裝置中,計量部由重量計403構成,並計測液體材料104的重量,但本實施例的塗佈裝置,為了計測液體材料104之量而使用不同態樣的計量部。
本實施例中,如圖7所示,從排出裝置501朝基板102等適當面排出液體材料104經一定時間,而形成液體材料的面。將其利用CCD攝影機等攝影裝置801從上方進行拍攝,並從影像計測液體材料之面積。根據該測得之面積、初期參數設定當初之排出量、及上述一定時間的排出量之理論值(適當排出量),計算出變化率R,而計算出排出量之修正值。
另外,上述攝影裝置801可在排出裝置501旁邊一體設置,亦可獨立於排出裝置501而設置於XY驅動機構402。
本實施例之塗佈裝置就並非由面積計測一定時間的排出量而是由體積進行計測之處,不同於實施例2的塗佈裝置。即,本實施例之塗佈裝置為如圖8所示,對於在基板102等適當面經點狀塗佈的液體材料104之小滴高度,使用雷射位移計901加以計測,並與前述使用攝影裝置801所求得之面積組合,而計測液體材料的體積。就根據該測得體積、初期參數設定當初之排出量、及上述一定時間排出量之理論值(適當排出量),計算出變化率R,並計算出排出量之修正值之處,係與實施例2相同。此時,亦可將液體材料104之密度列入考慮而計算出重量,並將其視為計測值而施行修正。
另外,上述雷射位移計901可在排出裝置501旁邊一體設置,亦可獨立於排出裝置501而設置於XY驅動機構402。
本實施例之塗佈裝置就具備有攝影裝置801之處與實施例2及3之塗佈裝置一致,但就根據填角1001之寬度W1及/或W2算出修正量之處則不同。亦即,本實施例的塗佈裝置,係採用以在填底步驟之實際生產中,液體材料104從工件101所滲出量之填角1001寬度收斂於一定範圍內為前提的修正手法。
填角1001之寬度W1及/或W2之計測為如圖9所示,經由透過攝影裝置801拍攝經塗佈後之工件101,並從該影像中,將液體材料104從工件101中滲出的量作為填角1001方式而施行。從所測得的填角1001之影像計測寬度W1及/或W2,並計算該時點之排出量,再根據該測得之排出量與初期參數設定當初之排出量(理論值),計算出變化率R,而計算出排出量之修正值。
本發明可在將液體材料排出之各種裝置中實施。本發明係可在例如使閥體碰撞閥座,而使液體材料從噴嘴前端飛散排出的噴射式、使柱塞式柱塞進行移動,接著急遽停止,而同樣地從噴嘴前端飛散排出的柱塞噴射式、連續噴射方式或按需方式的噴墨式等裝置中實施。
再者,本發明在塗佈規定塗佈量之液體材料的各種塗佈裝置中均可實施。本發明可在例如液晶面板製造步驟中之密封塗佈裝置和液晶滴下裝置、或對印刷電路基板之焊錫膏塗佈裝置等中實施。
101...晶片(工件)
102...基板
103...連接部
104...樹脂(液體材料)
141...塗佈區域
142...非塗佈區域
301...設定表
401...塗佈裝置
402...XY驅動機構
403...重量計
404...搬送機構
501...排出裝置
502...控制部
503...脈衝信號供應線
504...活塞
505...儲存容器
506...噴嘴
507...壓縮氣體供應線
601...排出脈衝
602...暫停脈衝
801...攝影裝置
901...雷射位移計
1001...填角
S...面積
H...高度
W1、W2...寬度
圖1為說明填底步驟的側視圖。
圖2為塗佈圖案例的說明圖。
圖3為實施例的裝置概略立體圖。
圖4為實施例的排出裝置重要部分剖視圖。
圖5為說明對實施例排出裝置所發送之脈衝信號的說明圖。
圖6為表示實施例之修正步驟的流程圖。
圖7為實施例2的計量部說明圖。
圖8為實施例3的計量部說明圖。
圖9為實施例4的計量部說明圖。
501...排出裝置
502...控制部
503...脈衝信號供應線
504...活塞
505...儲存容器
506...噴嘴
507...壓縮氣體供應線
601...排出脈衝
602...暫停脈衝
Claims (14)
- 一種塗佈方法,係製作所希望之塗佈圖案,一邊使噴嘴與工件進行相對移動,一邊將液體材料從噴嘴排出,而對工件塗佈規定塗佈量之液體材料的塗佈方法;其特徵在於,其包括有:初期參數設定步驟,將傳送排出脈衝信號及暫停脈衝信號的次數規定為總脈衝數,且規定總脈衝數中為了達成塗佈量所必要的排出脈衝信號數,而將其餘規定為暫停脈衝信號;修正量算出步驟,以預設之修正週期,計測在修正週期時從噴嘴之排出量,並計算出排出量之修正量;及排出量修正步驟,根據在修正量算出步驟所計算出的修正量,調整排出脈衝信號數與暫停脈衝信號數。
- 如申請專利範圍第1項之塗佈方法,其中,上述排出量修正步驟在不變化上述排出脈衝信號與上述暫停脈衝信號之發送頻率下修正排出量。
- 如申請專利範圍第2項之塗佈方法,其中,上述頻率為數十赫茲(Hertz)~數百赫茲。
- 如申請專利範圍第1或2項之塗佈方法,其中,上述修正量算出步驟係根據計測一定時間內排出的液體材料之重量而得之值、與該一定時間之理論值的差值,而計算出排出量之修正量。
- 如申請專利範圍第1或2項之塗佈方法,其中,上述修正量算出步驟係根據計測一定時間所排出的液體材料之面積及/或高度而得之值、與該一定時間之理論值的差值,而計算出排出量之修正量。
- 如申請專利範圍第1或2項之塗佈方法,其中,上述修正量算出步驟係根據計測經依上述塗佈圖案之塗佈形成在工件端部的液體材料之填角(fillet)寬度而得之值、與該塗佈圖案之理論值的差值,而計算出排出量之修正量。
- 如申請專利範圍第4項之塗佈方法,其中,設定判斷在上述修正量算出步驟以前之步驟中是否要施行修正的容許範圍,上述修正量算出步驟當上述差值超過上述容許範圍時,便計算出排出量之修正量。
- 如申請專利範圍第1或2項之塗佈方法,其中,上述塗佈係藉由在液體材料離開噴嘴後才接觸工件的排出方式而進行。
- 如申請專利範圍第8項之塗佈方法,其中,上述塗佈係在基板與其上所載置的工件之間隙中利用毛細管現象填充規定之塗佈量的液體材料。
- 如申請專利範圍第9項之塗佈方法,其中,上述排出量修正步驟在增加暫停脈衝信號時,便減少對於暫停脈衝信號數之排出脈衝信號數。
- 如申請專利範圍第1或2項之塗佈方法,其中,上述修正週期係根據使用者所輸入作為修正週期之時間資訊、工件片數、或基板片數而被設定。
- 如申請專利範圍第1或2項之塗佈方法,其中,上述排出量修正步驟係在不變化上述塗佈圖案之塗佈長度、及噴嘴與工件之相對移動速度下修正排出量。
- 一種塗佈裝置,係具備有:供應液體材料的液材供應部、具有將從液材供應部所供應之液體材料排出的排出口之排出部、計測從排出口所排出的液體材料量之計量部、使排出口與工件進行相對移動的驅動部、及對該等動作進行控制之控制部;其特徵在於,控制部係具有實施申請專利範圍第1或2項之塗佈方法的程式。
- 一種記憶媒體,係記憶有使塗佈裝置之控制部執行申請專利範圍第1或2項之塗佈方法的程式,該塗佈裝置係具備有:供應液體材料的液材供應部、具有將液體材料排出之排出口的排出部、計測從排出口所排出的液體材料量之計量部、使排出口與工件進行相對移動的驅動部、及對該等動作進行控制之控制部。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008036628A JP5280702B2 (ja) | 2008-02-18 | 2008-02-18 | 液体材料の塗布方法、その装置およびそのプログラム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200946242A TW200946242A (en) | 2009-11-16 |
TWI471177B true TWI471177B (zh) | 2015-02-01 |
Family
ID=40985272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98105085A TWI471177B (zh) | 2008-02-18 | 2009-02-18 | A method of coating a liquid material, a device thereof, and a memory medium having a memory |
Country Status (8)
Country | Link |
---|---|
US (1) | US8821959B2 (zh) |
EP (1) | EP2246125B1 (zh) |
JP (1) | JP5280702B2 (zh) |
KR (1) | KR101605434B1 (zh) |
CN (1) | CN102066008B (zh) |
HK (1) | HK1153426A1 (zh) |
TW (1) | TWI471177B (zh) |
WO (1) | WO2009104383A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101677487B1 (ko) * | 2009-06-15 | 2016-11-18 | 무사시 엔지니어링 가부시키가이샤 | 액체 재료의 도포 방법, 그 장치 및 그 프로그램이 기억된 기억 매체 |
JP5441644B2 (ja) | 2009-12-01 | 2014-03-12 | 武蔵エンジニアリング株式会社 | 卓上型作業装置 |
JP5779353B2 (ja) | 2011-01-19 | 2015-09-16 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、塗布装置およびプログラム |
US10814351B2 (en) * | 2013-08-12 | 2020-10-27 | The Boeing Company | High-viscosity sealant application system |
US10434525B1 (en) * | 2016-02-09 | 2019-10-08 | Steven C. Cooper | Electrostatic liquid sprayer usage tracking and certification status control system |
JP6778426B2 (ja) * | 2016-09-20 | 2020-11-04 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
JP6920923B2 (ja) | 2017-08-25 | 2021-08-18 | 株式会社Screenホールディングス | ポンプ装置および基板処理装置 |
CN108906508B (zh) * | 2018-08-06 | 2020-11-27 | Oppo(重庆)智能科技有限公司 | 胶量控制方法及胶量控制装置 |
JP6999526B2 (ja) | 2018-09-21 | 2022-01-18 | Ntn株式会社 | 液状材料塗布装置 |
JP7426198B2 (ja) * | 2019-04-17 | 2024-02-01 | 株式会社ジャノメ | 塗布装置 |
KR102132796B1 (ko) * | 2020-01-14 | 2020-07-10 | 최상철 | 디스펜서 및 이에 사용되는 마이크로프리퀀시밸브 |
CN115990568B (zh) * | 2022-11-29 | 2024-07-30 | 歌尔股份有限公司 | 喷胶控制方法、装置、设备及存储介质 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1197829A (ja) * | 1997-09-24 | 1999-04-09 | Matsushita Electric Ind Co Ltd | 電子部品接着用ボンドの塗布量調整方法 |
JP3625552B2 (ja) * | 1995-12-07 | 2005-03-02 | 松下電器産業株式会社 | 接着剤塗布装置および接着剤塗布方法 |
TW200604017A (en) * | 2004-03-15 | 2006-02-01 | Spectra Inc | High frequency droplet ejection device and method |
TW200704456A (en) * | 2005-05-16 | 2007-02-01 | Seiko Epson Corp | Liquid ejection method, liquid ejection apparatus, and method for manufacturing electro-optic panel |
TWI277452B (en) * | 2005-12-22 | 2007-04-01 | Ind Tech Res Inst | Diagnostic system for gel dispensing condition and method thereof |
TW200727018A (en) * | 2005-11-21 | 2007-07-16 | Shibaura Mechatronics Corp | Spread-coating apparatus and which using it for the display panel and its fabricating method |
TW200727988A (en) * | 2005-11-11 | 2007-08-01 | Seiko Epson Corp | Discharge amount measurement method, pattern formation method, device, electro-optical device, and electronic instrument |
TW200736770A (en) * | 2006-02-24 | 2007-10-01 | Top Eng Co Ltd | Method for compensating for any of shortage and excess of sealant dispensed on a substrate |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0824870B2 (ja) | 1990-11-30 | 1996-03-13 | 武蔵エンジニアリング株式会社 | 液体定量吐出装置 |
GB9225873D0 (en) * | 1992-12-11 | 1993-02-03 | British United Shoe Machinery | Apparatus for dispensing viscous liquids |
JP3877038B2 (ja) | 1999-11-10 | 2007-02-07 | 武蔵エンジニアリング株式会社 | 液体の塗布方法および装置 |
JP2002303275A (ja) * | 2001-04-09 | 2002-10-18 | Iwashita Engineering Inc | 定量吐出器の吐出量補正方法 |
US20050001869A1 (en) * | 2003-05-23 | 2005-01-06 | Nordson Corporation | Viscous material noncontact jetting system |
JP4889967B2 (ja) * | 2005-07-01 | 2012-03-07 | 芝浦メカトロニクス株式会社 | 液状物質滴下装置及び液状物質滴下方法 |
JP4922724B2 (ja) * | 2005-10-20 | 2012-04-25 | 芝浦メカトロニクス株式会社 | 溶液の塗布装置 |
TWI311500B (en) * | 2005-10-20 | 2009-07-01 | Shibaura Mechatronics Corporatio | Apparatus for applying solution and method of measuring quantity of solution |
JP2007194403A (ja) * | 2006-01-19 | 2007-08-02 | Sony Corp | 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法 |
JP4995488B2 (ja) * | 2006-05-26 | 2012-08-08 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
JP5783670B2 (ja) * | 2009-08-11 | 2015-09-24 | 武蔵エンジニアリング株式会社 | 液体材料の塗布方法、塗布装置およびプログラム |
-
2008
- 2008-02-18 JP JP2008036628A patent/JP5280702B2/ja active Active
-
2009
- 2009-02-18 US US12/918,256 patent/US8821959B2/en active Active
- 2009-02-18 KR KR1020107020431A patent/KR101605434B1/ko active IP Right Grant
- 2009-02-18 WO PCT/JP2009/000649 patent/WO2009104383A1/ja active Application Filing
- 2009-02-18 CN CN200980105241.XA patent/CN102066008B/zh active Active
- 2009-02-18 EP EP09713491.0A patent/EP2246125B1/en active Active
- 2009-02-18 TW TW98105085A patent/TWI471177B/zh active
-
2011
- 2011-07-19 HK HK11107495.2A patent/HK1153426A1/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3625552B2 (ja) * | 1995-12-07 | 2005-03-02 | 松下電器産業株式会社 | 接着剤塗布装置および接着剤塗布方法 |
JPH1197829A (ja) * | 1997-09-24 | 1999-04-09 | Matsushita Electric Ind Co Ltd | 電子部品接着用ボンドの塗布量調整方法 |
TW200604017A (en) * | 2004-03-15 | 2006-02-01 | Spectra Inc | High frequency droplet ejection device and method |
TW200704456A (en) * | 2005-05-16 | 2007-02-01 | Seiko Epson Corp | Liquid ejection method, liquid ejection apparatus, and method for manufacturing electro-optic panel |
TW200727988A (en) * | 2005-11-11 | 2007-08-01 | Seiko Epson Corp | Discharge amount measurement method, pattern formation method, device, electro-optical device, and electronic instrument |
TW200727018A (en) * | 2005-11-21 | 2007-07-16 | Shibaura Mechatronics Corp | Spread-coating apparatus and which using it for the display panel and its fabricating method |
TWI277452B (en) * | 2005-12-22 | 2007-04-01 | Ind Tech Res Inst | Diagnostic system for gel dispensing condition and method thereof |
TW200736770A (en) * | 2006-02-24 | 2007-10-01 | Top Eng Co Ltd | Method for compensating for any of shortage and excess of sealant dispensed on a substrate |
Also Published As
Publication number | Publication date |
---|---|
HK1153426A1 (zh) | 2012-03-30 |
KR101605434B1 (ko) | 2016-03-22 |
KR20100124763A (ko) | 2010-11-29 |
TW200946242A (en) | 2009-11-16 |
CN102066008B (zh) | 2014-03-19 |
US20110042478A1 (en) | 2011-02-24 |
US8821959B2 (en) | 2014-09-02 |
EP2246125B1 (en) | 2019-05-22 |
EP2246125A1 (en) | 2010-11-03 |
CN102066008A (zh) | 2011-05-18 |
JP2009190012A (ja) | 2009-08-27 |
EP2246125A4 (en) | 2016-03-02 |
JP5280702B2 (ja) | 2013-09-04 |
WO2009104383A1 (ja) | 2009-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI471177B (zh) | A method of coating a liquid material, a device thereof, and a memory medium having a memory | |
TWI537061B (zh) | A coating method for a liquid material, a coating apparatus, and a memory medium having a memory program | |
TWI497613B (zh) | A coating method for a liquid material, a coating apparatus, and a memory medium having a memory program | |
US9144820B2 (en) | Ejection amount correction method and coating apparatus | |
TWI522179B (zh) | Liquid material filling method, the device and the memory of the program memory media | |
TWI433242B (zh) | 液體材料之填充方法、裝置及程式之媒體 | |
JP2004344883A (ja) | 非接触式粘性材料噴射システム | |
JP4871093B2 (ja) | 液体材料の充填方法、装置およびプログラム | |
KR101411449B1 (ko) | 액체 재료의 충전 방법, 장치 및 프로그램을 기록한 기록 매체 |