HK116497A - Solder ball feeder - Google Patents

Solder ball feeder

Info

Publication number
HK116497A
HK116497A HK116497A HK116497A HK116497A HK 116497 A HK116497 A HK 116497A HK 116497 A HK116497 A HK 116497A HK 116497 A HK116497 A HK 116497A HK 116497 A HK116497 A HK 116497A
Authority
HK
Hong Kong
Prior art keywords
solder ball
ball feeder
feeder
solder
ball
Prior art date
Application number
HK116497A
Other languages
English (en)
Inventor
Masatoshi Namekawa
Yoshiteru Ibuki
Norio Iguchi
Masatoshi Okuno
Original Assignee
Citizen Watch Co Ltd
Miyota Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd, Miyota Kk filed Critical Citizen Watch Co Ltd
Publication of HK116497A publication Critical patent/HK116497A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HK116497A 1993-05-31 1997-06-26 Solder ball feeder HK116497A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15431193 1993-05-31
PCT/JP1994/000337 WO1994028580A1 (fr) 1993-05-31 1994-03-02 Systeme d'alimentation en billes de soudure

Publications (1)

Publication Number Publication Date
HK116497A true HK116497A (en) 1997-09-05

Family

ID=15581347

Family Applications (1)

Application Number Title Priority Date Filing Date
HK116497A HK116497A (en) 1993-05-31 1997-06-26 Solder ball feeder

Country Status (8)

Country Link
US (1) US5467913A (ja)
JP (1) JP3303109B2 (ja)
KR (1) KR100343520B1 (ja)
GB (1) GB2284933B (ja)
HK (1) HK116497A (ja)
SG (1) SG42943A1 (ja)
TW (1) TW261558B (ja)
WO (1) WO1994028580A1 (ja)

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DE19544929C2 (de) * 1995-12-01 2001-02-15 Fraunhofer Ges Forschung Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip
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JP3932501B2 (ja) * 1998-12-01 2007-06-20 澁谷工業株式会社 ボールマウント装置
JP3024113B1 (ja) * 1999-01-27 2000-03-21 株式会社日鉄マイクロメタル 金属球配列方法及び配列装置
ATE341003T1 (de) 1999-02-16 2006-10-15 Applera Corp Vorrichtung zur handhabung von kügelchen
JP3283026B2 (ja) * 1999-04-30 2002-05-20 新光電気工業株式会社 ボール状端子の吸着装置及びボール状端子の搭載方法
JP4598240B2 (ja) * 1999-06-24 2010-12-15 アスリートＦａ株式会社 ボール搭載装置及びボール搭載方法
US6276598B1 (en) * 1999-07-13 2001-08-21 Asm Assembly Automation Ltd. Method and apparatus for ball placement
JP4143788B2 (ja) * 1999-08-04 2008-09-03 澁谷工業株式会社 ボールマウント装置及びマウント方法
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US6227437B1 (en) 1999-08-24 2001-05-08 Kulicke & Soffa Industries Inc. Solder ball delivery and reflow apparatus and method of using the same
US6386433B1 (en) 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
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KR100694462B1 (ko) * 2001-04-02 2007-03-12 앰코 테크놀로지 코리아 주식회사 반도체 자재의 신호인출단자 형성 장치 및 그 형성 방법
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US6607118B2 (en) 2001-04-30 2003-08-19 Asm Assembly Automation Limited Apparatus and method for ball release
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JP4126996B2 (ja) * 2002-03-13 2008-07-30 セイコーエプソン株式会社 デバイスの製造方法及びデバイス製造装置
JP4258759B2 (ja) * 2003-06-26 2009-04-30 澁谷工業株式会社 半田ボール搭載方法及び装置
US7297003B2 (en) 2003-07-16 2007-11-20 Gryphics, Inc. Fine pitch electrical interconnect assembly
US7537461B2 (en) * 2003-07-16 2009-05-26 Gryphics, Inc. Fine pitch electrical interconnect assembly
WO2005011060A2 (en) 2003-07-16 2005-02-03 Gryphics, Inc. Electrical interconnect assembly with interlocking contact system
US7186645B2 (en) * 2003-10-13 2007-03-06 Intel Corporation Selective plating of package terminals
JP4586583B2 (ja) * 2005-03-10 2010-11-24 ソニー株式会社 半導体装置の接合方法
JP4042914B2 (ja) * 2005-04-22 2008-02-06 Ｔｄｋ株式会社 半田付け装置及び半田分配装置
JP4956609B2 (ja) 2006-03-20 2012-06-20 グリフィクス インコーポレーティッド ファインピッチ電気接続アセンブリのための複合端子
US7494913B2 (en) * 2006-08-31 2009-02-24 Intel Corporation Microball placement solutions
JP4247919B2 (ja) * 2006-09-25 2009-04-02 Ｔｄｋ株式会社 導電性材料の供給装置及び供給方法
SG194412A1 (en) * 2006-11-22 2013-11-29 Rokko Ventures Pte Ltd An improved ball mounting apparatus and method
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JP2014011231A (ja) * 2012-06-28 2014-01-20 Hitachi Ltd ハンダボール印刷搭載装置
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USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
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US20160181222A1 (en) * 2014-12-23 2016-06-23 Mohit Sood Pickhead for solder ball placement on an integrated circuit package
JP6567290B2 (ja) * 2015-02-20 2019-08-28 Ａｉメカテック株式会社 基板処理装置、基板処理システム、及び基板処理方法
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US11440117B2 (en) * 2019-09-27 2022-09-13 Jian Zhang Multiple module chip manufacturing arrangement
JP7352321B2 (ja) * 2021-07-20 2023-09-28 株式会社新川 フラックス転写装置

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Also Published As

Publication number Publication date
WO1994028580A1 (fr) 1994-12-08
JP3303109B2 (ja) 2002-07-15
KR100343520B1 (ko) 2002-11-23
GB9424776D0 (en) 1995-03-01
US5467913A (en) 1995-11-21
TW261558B (ja) 1995-11-01
SG42943A1 (en) 1997-10-17
GB2284933B (en) 1996-12-04
GB2284933A (en) 1995-06-21

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20140301