HK1136090A1 - Substrate inspection device and recovery tool - Google Patents

Substrate inspection device and recovery tool

Info

Publication number
HK1136090A1
HK1136090A1 HK10102700.5A HK10102700A HK1136090A1 HK 1136090 A1 HK1136090 A1 HK 1136090A1 HK 10102700 A HK10102700 A HK 10102700A HK 1136090 A1 HK1136090 A1 HK 1136090A1
Authority
HK
Hong Kong
Prior art keywords
inspection device
substrate inspection
recovery tool
recovery
tool
Prior art date
Application number
HK10102700.5A
Other languages
English (en)
Inventor
Yoshio Sakurai
Yutaka Ogawa
Original Assignee
Nas Giken Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nas Giken Inc filed Critical Nas Giken Inc
Publication of HK1136090A1 publication Critical patent/HK1136090A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N2001/028—Sampling from a surface, swabbing, vaporising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/38—Diluting, dispersing or mixing samples
    • G01N2001/383—Diluting, dispersing or mixing samples collecting and diluting in a flow of liquid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Sampling And Sample Adjustment (AREA)
HK10102700.5A 2004-01-29 2010-03-16 Substrate inspection device and recovery tool HK1136090A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004022267 2004-01-29

Publications (1)

Publication Number Publication Date
HK1136090A1 true HK1136090A1 (en) 2010-06-18

Family

ID=34823824

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10102700.5A HK1136090A1 (en) 2004-01-29 2010-03-16 Substrate inspection device and recovery tool

Country Status (7)

Country Link
US (1) US7685895B2 (fr)
EP (1) EP1710555A4 (fr)
JP (1) JP4664818B2 (fr)
KR (1) KR100906916B1 (fr)
CN (2) CN101540278B (fr)
HK (1) HK1136090A1 (fr)
WO (1) WO2005073692A1 (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100307108A1 (en) * 2007-01-17 2010-12-09 John Richard Sink Devices for Capping Vials Useful in System and Method for Dispensing Prescriptions
JP5133573B2 (ja) 2007-02-02 2013-01-30 東京エレクトロン株式会社 載置装置
US8444130B2 (en) * 2008-09-30 2013-05-21 Parata Systems, Llc Devices for capping vials useful in system and method for dispensing prescriptions
JP5563318B2 (ja) * 2009-03-02 2014-07-30 キヤノンアネルバ株式会社 基板支持装置、基板処理装置、基板支持方法、基板支持装置の制御プログラム及び記録媒体
DE102009026186A1 (de) * 2009-07-16 2011-01-27 Hseb Dresden Gmbh Vorrichtung und Verfahren zur Kanten- und Oberflächeninspektion
JP4897870B2 (ja) * 2009-12-18 2012-03-14 株式会社 イアス 基板分析用ノズル及び基板分析方法
CN102214591A (zh) * 2011-05-23 2011-10-12 叶伟清 晶圆端面采样方法
DE102012100825A1 (de) * 2011-12-01 2013-06-06 solar-semi GmbH Vorrichtung zum Bearbeiten eines Substrats und Verfahren hierzu
US10204820B2 (en) 2014-05-21 2019-02-12 Cost Effective Equipment Llc Multi-size adaptable spin chuck system
CN107567652A (zh) * 2015-03-12 2018-01-09 非视觉污染分析科学技术有限公司 基板污染物分析装置及基板污染物分析方法
KR101595885B1 (ko) * 2015-04-01 2016-02-19 주식회사 넥서스원 웨이퍼 검사 장비의 웨이퍼 지지장치
SG10202002713PA (en) * 2015-08-18 2020-05-28 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
SG10201606197XA (en) 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
JP2017083334A (ja) * 2015-10-29 2017-05-18 信越半導体株式会社 不純物の回収方法及び不純物の分析方法並びに液滴回収装置
CN108592976A (zh) * 2018-07-04 2018-09-28 常州天寅智造科技股份有限公司 一种用于玻璃和硅片的测量治具
CN108962813B (zh) * 2018-09-06 2023-07-18 重庆科技学院 一种可调式芯片卡具
KR102236398B1 (ko) 2020-09-22 2021-04-02 에스케이씨 주식회사 웨이퍼의 세정방법 및 불순물이 저감된 웨이퍼
CN114378751B (zh) 2020-10-20 2022-11-01 长鑫存储技术有限公司 晶圆用承载环的安装夹具
KR102226471B1 (ko) * 2020-10-30 2021-03-11 주식회사 위드텍 기판 검사기의 시료 용액 샘플링 방법 및 그 장치
CN113496927B (zh) * 2021-05-30 2022-06-24 山东华楷微电子装备有限公司 一种半导体硅片表面液体清理设备
CN114029775A (zh) * 2021-12-09 2022-02-11 济南昊中自动化有限公司 一种具有翻转功能的四工位回转台
CN114812334B (zh) * 2022-05-24 2023-07-25 浙江正鼎汽车零部件有限公司 一种汽车底盘上摆臂支架的检验装置
CN117451924B (zh) * 2023-12-26 2024-03-15 山东煜可医疗科技有限公司 一种药品检验用分析滴定装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US395446A (en) * 1889-01-01 Apparatus for transmitting power
US4564280A (en) * 1982-10-28 1986-01-14 Fujitsu Limited Method and apparatus for developing resist film including a movable nozzle arm
US4990459A (en) 1988-04-25 1991-02-05 Kabushiki Kaisha Toshiba Impurity measuring method
JPH08233709A (ja) 1988-04-25 1996-09-13 Toshiba Corp 不純物の測定方法
JP2604037B2 (ja) 1988-07-11 1997-04-23 株式会社東芝 半導体処理装置
US5395446A (en) * 1988-11-21 1995-03-07 Kabushiki Kaisha Toshiba Semiconductor treatment apparatus
JP2843600B2 (ja) 1989-04-14 1999-01-06 東芝セラミックス株式会社 ウェハ表面の不純物量の測定方法
JPH05283498A (ja) * 1991-11-12 1993-10-29 Matsushita Electric Ind Co Ltd 半導体基板表面不純物回収装置およびその使用方法
JP3179175B2 (ja) * 1992-03-12 2001-06-25 株式会社ピュアレックス 分析前処理方法
JP3278513B2 (ja) * 1993-12-09 2002-04-30 株式会社東芝 半導体基板の不純物分析方法
JP3051013B2 (ja) * 1993-12-21 2000-06-12 株式会社東芝 不純物分析方法
JP3356669B2 (ja) * 1997-12-04 2002-12-16 東芝マイクロエレクトロニクス株式会社 不純物回収装置
JP2000186988A (ja) * 1998-12-24 2000-07-04 Sony Corp Ｈｆ液滴濃縮装置
JP2000332072A (ja) * 1999-05-20 2000-11-30 Canon Inc 半導体基板の表面分析方法
JP2001284390A (ja) * 2000-03-30 2001-10-12 Shinkawa Ltd ボンディング装置用ボンドステージ駆動装置
JP4026376B2 (ja) * 2002-02-27 2007-12-26 三菱化学エンジニアリング株式会社 現像液の供給装置
JP4516328B2 (ja) * 2004-02-20 2010-08-04 有限会社Ｎａｓ技研 半導体ウエハー、液晶基板等の基板の表面に存在する不純物を測定するための液滴を回収する装置
JP2006108364A (ja) * 2004-10-05 2006-04-20 Toshiba Corp 液滴保持具及び不純物回収方法

Also Published As

Publication number Publication date
CN101540278B (zh) 2011-06-15
JP4664818B2 (ja) 2011-04-06
CN101540278A (zh) 2009-09-23
KR100906916B1 (ko) 2009-07-08
EP1710555A4 (fr) 2010-09-29
KR20070005930A (ko) 2007-01-10
EP1710555A1 (fr) 2006-10-11
US20090151480A1 (en) 2009-06-18
CN1879014A (zh) 2006-12-13
JPWO2005073692A1 (ja) 2007-09-13
US7685895B2 (en) 2010-03-30
WO2005073692A1 (fr) 2005-08-11

Similar Documents

Publication Publication Date Title
HK1136090A1 (en) Substrate inspection device and recovery tool
EP1840686A4 (fr) Dispositif de positionnement et son procede correspondant
EP1941820A4 (fr) Procede de retournement de bac et dispositif de celui-ci
EP1710696A4 (fr) Dispositif a semi-conducteurs et procede d'activation de celui-ci
EP1935027A4 (fr) Dispositif a semi-conducteurs et son procede de fabrication
EP1946374A4 (fr) Dispositif semi-conducteur et procédé pour le fabriquer
EP1962514A4 (fr) Procede de binarisation et dispositif associe
EP1966740A4 (fr) Dispositif a semi-conducteurs et son procede de fabrication
EP1932473A4 (fr) Dispositif et procédé de détection de toux
ZA200800106B (en) DTH-hammer drilling device and overburden drilling method
EP1848043A4 (fr) Dispositif electroluminescent a semiconducteur et son procede
EP1942354A4 (fr) Dispositif et procede de mesure
EP1929545A4 (fr) Dispositif electroluminescent a semi-conducteur et son procede de fabrication
EP1887624A4 (fr) Dispositif semi-conducteur et son procede de fabrication
EP1820894A4 (fr) Procédé et dispositif d'extension et de transport de toile
EP1933390A4 (fr) Dispositif semi-conducteur et procédé de fabrication idoine
GB2427272B (en) Immunochromatographic assay device and method
ZA200709770B (en) Method and device
EP1732128A4 (fr) Substrat pour dispositif a semiconducteur et dispositif a semiconducteur
TWI318006B (en) Semiconductor device and manufacturing method thereof
GB0524746D0 (en) Assay device and method
GB2430522B (en) Semiconductor device and writing method
EP1895582A4 (fr) Dispositif semi-conducteur et son procede de fabrication
EP1865466A4 (fr) Dispositif et procede de detection de fonctionnement
GB0909484D0 (en) Nano-base device and method