HK1135195A1 - Exposure apparatus and method for manufacturing device - Google Patents

Exposure apparatus and method for manufacturing device

Info

Publication number
HK1135195A1
HK1135195A1 HK10101642.8A HK10101642A HK1135195A1 HK 1135195 A1 HK1135195 A1 HK 1135195A1 HK 10101642 A HK10101642 A HK 10101642A HK 1135195 A1 HK1135195 A1 HK 1135195A1
Authority
HK
Hong Kong
Prior art keywords
group
exposure apparatus
liquid
manufacturing device
optical system
Prior art date
Application number
HK10101642.8A
Other languages
English (en)
Inventor
Kazuya Ono
Yuichi Shibazaki
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34067374&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1135195(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of HK1135195A1 publication Critical patent/HK1135195A1/xx

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Microscoopes, Condenser (AREA)
  • Conveying And Assembling Of Building Elements In Situ (AREA)
  • Sewage (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
HK10101642.8A 2003-07-09 2010-02-12 Exposure apparatus and method for manufacturing device HK1135195A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003272615 2003-07-09
JP2003281182 2003-07-28

Publications (1)

Publication Number Publication Date
HK1135195A1 true HK1135195A1 (en) 2010-05-28

Family

ID=34067374

Family Applications (2)

Application Number Title Priority Date Filing Date
HK07101804.7A HK1097103A1 (en) 2003-07-09 2007-02-15 Exposure apparatus and method for manufacturing device
HK10101642.8A HK1135195A1 (en) 2003-07-09 2010-02-12 Exposure apparatus and method for manufacturing device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK07101804.7A HK1097103A1 (en) 2003-07-09 2007-02-15 Exposure apparatus and method for manufacturing device

Country Status (10)

Country Link
US (5) US7619715B2 (xx)
EP (1) EP1643543B1 (xx)
JP (2) JP4844123B2 (xx)
KR (1) KR20060026883A (xx)
CN (1) CN102944981A (xx)
AT (1) ATE489724T1 (xx)
DE (1) DE602004030247D1 (xx)
HK (2) HK1097103A1 (xx)
TW (1) TW200507063A (xx)
WO (1) WO2005006416A1 (xx)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102944981A (zh) * 2003-07-09 2013-02-27 株式会社尼康 曝光装置、器件制造方法
EP1503244A1 (en) 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
EP1679738A4 (en) * 2003-10-28 2008-08-06 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
US8072700B2 (en) 2003-10-29 2011-12-06 Carl Zeiss Smt Gmbh Optical apparatus for use in photolithography
EP3376523A1 (en) 2004-01-05 2018-09-19 Nikon Corporation Exposure apparatus, exposure method, and device producing method
WO2006009573A1 (en) * 2004-06-17 2006-01-26 Nikon Corporation Fluid pressure compensation for immersion lithography lens
JP4532545B2 (ja) 2004-06-29 2010-08-25 カール・ツァイス・エスエムティー・アーゲー 光学素子のための位置決めユニット及び調節デバイス
KR101285905B1 (ko) 2004-07-01 2013-07-12 가부시키가이샤 니콘 액침 리소그래피용 동적 유체 제어 시스템
KR101700547B1 (ko) * 2004-09-17 2017-01-26 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
CN102207600B (zh) * 2004-10-08 2015-11-18 卡尔蔡司Smt有限责任公司 光学投影系统
US7161654B2 (en) 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060147821A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4830303B2 (ja) * 2005-01-27 2011-12-07 Jsr株式会社 液浸露光用液体の製造方法およびリサイクル方法
US7944628B2 (en) 2005-03-09 2011-05-17 Carl Zeiss Smt Gmbh Optical element unit
KR20130014602A (ko) * 2005-06-02 2013-02-07 칼 짜이스 에스엠테 게엠베하 광학 결상 장치
WO2006133800A1 (en) 2005-06-14 2006-12-21 Carl Zeiss Smt Ag Lithography projection objective, and a method for correcting image defects of the same
JP4514225B2 (ja) * 2005-11-16 2010-07-28 キヤノン株式会社 露光装置及びデバイス製造方法
US9477158B2 (en) * 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG10201502625RA (en) * 2007-07-18 2015-05-28 Nikon Corp Measuring Method, Stage Apparatus, And Exposure Apparatus
JP5146956B2 (ja) * 2007-09-26 2013-02-20 日本電産サンキョー株式会社 レンズ駆動装置
NL1036167A1 (nl) * 2007-11-20 2009-05-25 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US20090153832A1 (en) * 2007-12-18 2009-06-18 Yosuke Tatsuzaki Apparatus and method for isolating vibrations in a lithography machine using two active control units
NL2006458A (en) * 2010-05-05 2011-11-08 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
EP2469340B1 (en) * 2010-12-21 2021-01-06 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20150013605A (ko) 2012-04-26 2015-02-05 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
WO2014013733A1 (ja) * 2012-07-18 2014-01-23 株式会社ニコン 支持装置、移動体装置、露光装置、及びデバイス製造方法
TW201435410A (zh) * 2013-03-07 2014-09-16 Hon Hai Prec Ind Co Ltd 光通訊模組組裝裝置
CN104049314A (zh) * 2013-03-11 2014-09-17 鸿富锦精密工业(深圳)有限公司 光通讯模组组装装置
KR102262464B1 (ko) * 2014-08-15 2021-06-09 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 방법
US10323713B2 (en) * 2014-10-08 2019-06-18 Herz Co., Ltd. Antivibration device
TWI720053B (zh) * 2016-11-09 2021-03-01 晶元光電股份有限公司 發光元件及其製造方法
CN115997104A (zh) * 2020-07-02 2023-04-21 株式会社岛津制作所 缺陷检查装置
JP2023013737A (ja) * 2021-07-16 2023-01-26 キヤノン株式会社 処理装置および物品製造方法

Family Cites Families (179)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
DD221563A1 (de) * 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
JPS6232613A (ja) * 1985-08-05 1987-02-12 Canon Inc 投影露光装置
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
US6304317B1 (en) 1993-07-15 2001-10-16 Nikon Corporation Projection apparatus and method
US5677757A (en) * 1994-03-29 1997-10-14 Nikon Corporation Projection exposure apparatus
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
IL130137A (en) 1996-11-28 2003-07-06 Nikon Corp Exposure apparatus and an exposure method
DE69735016T2 (de) 1996-12-24 2006-08-17 Asml Netherlands B.V. Lithographisches Gerät mit zwei Objekthaltern
JPH10255319A (ja) * 1997-03-12 1998-09-25 Hitachi Maxell Ltd 原盤露光装置及び方法
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) * 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
US6563565B2 (en) 1997-08-27 2003-05-13 Nikon Corporation Apparatus and method for projection exposure
WO1999027570A1 (fr) * 1997-11-25 1999-06-03 Nikon Corporation Dispositif d'exposition par projection
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
TW396395B (en) 1998-01-07 2000-07-01 Nikon Corp Exposure method and scanning-type aligner
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
JPH11288870A (ja) * 1998-04-03 1999-10-19 Nikon Corp 露光装置
JPH11345761A (ja) 1998-05-29 1999-12-14 Nikon Corp 走査型露光装置
WO2001022480A1 (fr) * 1999-09-20 2001-03-29 Nikon Corporation Mecanisme a attelages paralleles, systeme d'exposition et procede de fabrication, et procede de fabrication de dispositifs
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7187503B2 (en) * 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
DE10000193B4 (de) 2000-01-05 2007-05-03 Carl Zeiss Smt Ag Optisches System
JP2001267226A (ja) 2000-03-21 2001-09-28 Nikon Corp 駆動装置及び露光装置、並びにデバイス及びその製造方法
JP4945845B2 (ja) 2000-03-31 2012-06-06 株式会社ニコン 光学素子保持装置、鏡筒及び露光装置並びにマイクロデバイスの製造方法。
JP2002083766A (ja) * 2000-06-19 2002-03-22 Nikon Corp 投影光学系、該光学系の製造方法、及び前記光学系を備えた投影露光装置
US6583597B2 (en) 2000-07-07 2003-06-24 Nikon Corporation Stage apparatus including non-containing gas bearings and microlithography apparatus comprising same
US6639740B1 (en) 2000-08-10 2003-10-28 Nikon Corporation Catadioptric lens barrel structure having a plurality of split lens barrels and a support structure supporting the split lens barrels
KR100775796B1 (ko) 2000-08-18 2007-11-12 가부시키가이샤 니콘 광학소자 유지장치
JP2002170765A (ja) * 2000-12-04 2002-06-14 Nikon Corp ステージ装置及び露光装置
KR100866818B1 (ko) 2000-12-11 2008-11-04 가부시키가이샤 니콘 투영광학계 및 이 투영광학계를 구비한 노광장치
DE10062786A1 (de) 2000-12-15 2002-06-20 Zeiss Carl System zur Dämpfung von Schwingungen
US20020080339A1 (en) 2000-12-25 2002-06-27 Nikon Corporation Stage apparatus, vibration control method and exposure apparatus
US20020104453A1 (en) * 2001-02-02 2002-08-08 Martin Lee Air bearing assembly
DE10106605A1 (de) 2001-02-13 2002-08-22 Zeiss Carl System zur Beseitigung oder wenigstens Dämpfung von Schwingungen
JP2002305140A (ja) 2001-04-06 2002-10-18 Nikon Corp 露光装置及び基板処理システム
WO2002091078A1 (en) 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Methods and apparatus employing an index matching medium
JP3710724B2 (ja) 2001-05-14 2005-10-26 大日本スクリーン製造株式会社 結像光学装置
US6600547B2 (en) 2001-09-24 2003-07-29 Nikon Corporation Sliding seal
DE10225266A1 (de) * 2001-12-19 2003-07-03 Zeiss Carl Smt Ag Abbildungseinrichtung in einer Projektionsbelichtungsanlage
EP1321822A1 (en) 2001-12-21 2003-06-25 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE10229818A1 (de) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem
DE10210899A1 (de) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refraktives Projektionsobjektiv für Immersions-Lithographie
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
EP1488800A4 (en) * 2002-03-22 2006-05-31 Chugai Pharmaceutical Co Ltd MEDICINE FOR THE TREATMENT OF PROTOCOL DISEASES
US6707534B2 (en) 2002-05-10 2004-03-16 Anvik Corporation Maskless conformable lithography
EP1369745B1 (en) 2002-06-07 2013-02-27 ASML Netherlands B.V. Lihographic apparatus and device manufaturing method
CN100462844C (zh) 2002-08-23 2009-02-18 株式会社尼康 投影光学系统、微影方法、曝光装置及使用此装置的方法
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US7093375B2 (en) * 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US6988326B2 (en) * 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6954993B1 (en) * 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US6788477B2 (en) 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
JP3977324B2 (ja) 2002-11-12 2007-09-19 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置
CN101382738B (zh) 2002-11-12 2011-01-12 Asml荷兰有限公司 光刻投射装置
DE60335595D1 (de) 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN100568101C (zh) 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1420302A1 (en) * 2002-11-18 2004-05-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (de) 2002-11-18 2004-06-03 Infineon Technologies Ag Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren
DE10258718A1 (de) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives
US6992750B2 (en) 2002-12-10 2006-01-31 Canon Kabushiki Kaisha Exposure apparatus and method
ATE424026T1 (de) 2002-12-13 2009-03-15 Koninkl Philips Electronics Nv Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht
ATE335272T1 (de) 2002-12-19 2006-08-15 Koninkl Philips Electronics Nv Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts
JP4364805B2 (ja) 2002-12-19 2009-11-18 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 層上にスポットを照射する方法及び装置
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
US6781670B2 (en) 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
US7090964B2 (en) 2003-02-21 2006-08-15 Asml Holding N.V. Lithographic printing with polarized light
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
KR101177331B1 (ko) 2003-04-09 2012-08-30 가부시키가이샤 니콘 액침 리소그래피 유체 제어 시스템
WO2004093160A2 (en) 2003-04-10 2004-10-28 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
KR101469405B1 (ko) 2003-04-10 2014-12-10 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
KR20140139139A (ko) 2003-04-10 2014-12-04 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
JP4656057B2 (ja) 2003-04-10 2011-03-23 株式会社ニコン 液浸リソグラフィ装置用電気浸透素子
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
ATE449982T1 (de) 2003-04-11 2009-12-15 Nikon Corp Reinigungsverfahren für optik in immersionslithographie
SG2012031217A (en) 2003-04-11 2015-09-29 Nippon Kogaku Kk Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
SG194246A1 (en) 2003-04-17 2013-11-29 Nikon Corp Optical arrangement of autofocus elements for use with immersion lithography
JP4146755B2 (ja) 2003-05-09 2008-09-10 松下電器産業株式会社 パターン形成方法
JP4025683B2 (ja) 2003-05-09 2007-12-26 松下電器産業株式会社 パターン形成方法及び露光装置
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TWI282487B (en) 2003-05-23 2007-06-11 Canon Kk Projection optical system, exposure apparatus, and device manufacturing method
DE10324477A1 (de) * 2003-05-30 2004-12-30 Carl Zeiss Smt Ag Mikrolithographische Projektionsbelichtungsanlage
TWI442694B (zh) 2003-05-30 2014-06-21 Asml Netherlands Bv 微影裝置及元件製造方法
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684008B2 (en) 2003-06-11 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4054285B2 (ja) 2003-06-12 2008-02-27 松下電器産業株式会社 パターン形成方法
JP4084710B2 (ja) 2003-06-12 2008-04-30 松下電器産業株式会社 パターン形成方法
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP4084712B2 (ja) 2003-06-23 2008-04-30 松下電器産業株式会社 パターン形成方法
JP4029064B2 (ja) 2003-06-23 2008-01-09 松下電器産業株式会社 パターン形成方法
JP2005019616A (ja) 2003-06-25 2005-01-20 Canon Inc 液浸式露光装置
JP4343597B2 (ja) 2003-06-25 2009-10-14 キヤノン株式会社 露光装置及びデバイス製造方法
JP3862678B2 (ja) 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60308161T2 (de) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
EP1494074A1 (en) 2003-06-30 2005-01-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1639391A4 (en) 2003-07-01 2009-04-29 Nikon Corp USE OF FLUIDS SPECIFIED ISOTOPICALLY AS OPTICAL ELEMENTS
CN102944981A (zh) 2003-07-09 2013-02-27 株式会社尼康 曝光装置、器件制造方法
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
EP1503244A1 (en) 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US20050037769A1 (en) * 2003-08-12 2005-02-17 Iqbal Jami Alleviating an overload condition of a base station for mobile telecommunications
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
KR101523180B1 (ko) 2003-09-03 2015-05-26 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
JP2007525824A (ja) 2003-11-05 2007-09-06 ディーエスエム アイピー アセッツ ビー.ブイ. マイクロチップを製造するための方法および装置
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8854602B2 (en) 2003-11-24 2014-10-07 Asml Netherlands B.V. Holding device for an optical element in an objective
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
WO2005059617A2 (en) 2003-12-15 2005-06-30 Carl Zeiss Smt Ag Projection objective having a high aperture and a planar end surface
US7385764B2 (en) 2003-12-15 2008-06-10 Carl Zeiss Smt Ag Objectives as a microlithography projection objective with at least one liquid lens
WO2005106589A1 (en) 2004-05-04 2005-11-10 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus and immersion liquid therefore
US7460206B2 (en) * 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
WO2005059645A2 (en) 2003-12-19 2005-06-30 Carl Zeiss Smt Ag Microlithography projection objective with crystal elements
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050143803A1 (en) * 2003-12-24 2005-06-30 Medtronic Vascular, Inc. Protective sheath for drug coated stent
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (ja) 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4429023B2 (ja) 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
WO2005069055A2 (en) * 2004-01-14 2005-07-28 Carl Zeiss Smt Ag Catadioptric projection objective
CN101726863B (zh) 2004-01-16 2012-08-29 卡尔蔡司Smt有限责任公司 偏振调制光学元件
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
EP1706793B1 (en) 2004-01-20 2010-03-03 Carl Zeiss SMT AG Exposure apparatus and measuring device for a projection lens
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
US8852850B2 (en) 2004-02-03 2014-10-07 Rochester Institute Of Technology Method of photolithography using a fluid and a system thereof
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005076084A1 (en) 2004-02-09 2005-08-18 Carl Zeiss Smt Ag Projection objective for a microlithographic projection exposure apparatus
US20050177224A1 (en) * 2004-02-11 2005-08-11 Fogarty Thomas J. Vascular fixation device and method
JP2007522508A (ja) 2004-02-13 2007-08-09 カール・ツアイス・エスエムテイ・アーゲー マイクロリソグラフィック投影露光装置のための投影対物レンズ
EP1721201A1 (en) 2004-02-18 2006-11-15 Corning Incorporated Catadioptric imaging system for high numerical aperture imaging with deep ultraviolet light
US20050205108A1 (en) * 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
US7027125B2 (en) * 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
US7084960B2 (en) * 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7034917B2 (en) * 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) * 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) * 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005098504A1 (en) 2004-04-08 2005-10-20 Carl Zeiss Smt Ag Imaging system with mirror group
US7898642B2 (en) * 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7271878B2 (en) * 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography
US7244665B2 (en) 2004-04-29 2007-07-17 Micron Technology, Inc. Wafer edge ring structures and methods of formation
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8054448B2 (en) 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7091502B2 (en) 2004-05-12 2006-08-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Apparatus and method for immersion lithography
KR20140138350A (ko) 2004-05-17 2014-12-03 칼 짜이스 에스엠티 게엠베하 중간이미지를 갖는 카타디옵트릭 투사 대물렌즈
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101199076B1 (ko) 2004-06-04 2012-11-07 칼 짜이스 에스엠티 게엠베하 강도 변동이 보상된 투사 시스템 및 이를 위한 보상 요소
WO2005119368A2 (en) 2004-06-04 2005-12-15 Carl Zeiss Smt Ag System for measuring the image quality of an optical imaging system

Also Published As

Publication number Publication date
TW200507063A (en) 2005-02-16
KR20060026883A (ko) 2006-03-24
EP1643543A4 (en) 2008-04-23
ATE489724T1 (de) 2010-12-15
JP4844123B2 (ja) 2011-12-28
JP5278382B2 (ja) 2013-09-04
US20080186465A1 (en) 2008-08-07
JP2010219558A (ja) 2010-09-30
US7619715B2 (en) 2009-11-17
US20100007865A1 (en) 2010-01-14
US8120751B2 (en) 2012-02-21
EP1643543B1 (en) 2010-11-24
US8228484B2 (en) 2012-07-24
US20060126045A1 (en) 2006-06-15
WO2005006416A1 (ja) 2005-01-20
DE602004030247D1 (de) 2011-01-05
US20100134771A1 (en) 2010-06-03
JPWO2005006416A1 (ja) 2006-08-24
US20060103944A1 (en) 2006-05-18
EP1643543A1 (en) 2006-04-05
HK1097103A1 (en) 2007-06-15
CN102944981A (zh) 2013-02-27

Similar Documents

Publication Publication Date Title
HK1135195A1 (en) Exposure apparatus and method for manufacturing device
TW200509205A (en) Exposure method and device-manufacturing method
EP1653501A4 (en) EXPOSURE DEVICE, COMPONENT MANUFACTURING METHOD AND CONTROL METHOD FOR AN EXPOSURE DEVICE
EP1646074A4 (en) EXPOSURE DEVICE AND METHOD OF MANUFACTURE
HK1090174A1 (en) Exposure apparatus, substrate carrying method, exposure method, and method for producing device
SG158744A1 (en) Exposure apparatus and method for producing device
EP1571701A4 (en) EXPOSURE DEVICE AND METHOD FOR MANUFACTURING COMPONENTS
EP1672682A4 (en) SUBSTRATE TRANSPORT DEVICE AND METHOD, EXPOSURE DEVICE AND METHOD AND COMPONENT MANUFACTURING METHOD
SG10201809095SA (en) Exposure apparatus, exposure method, and method for producing device
EP1624481A4 (en) EXPOSURE DEVICE AND METHOD FOR MANUFACTURING COMPONENTS
EP2284614A3 (en) Exposure apparatus, exposure method and device producing method
EP1571696A4 (en) EXPOSURE DEVICE AND METHOD OF MANUFACTURE
EP1670038A4 (en) OPTICAL ELEMENT AND EXPOSURE APPARATUS
EP1632991A4 (en) EXPOSURE METHOD, EXPOSURE DEVICE, AND METHOD OF MANUFACTURING THE DEVICE
EP1699072A4 (en) EXPOSURE DEVICE, EXPOSURE METHOD, COMPONENT MANUFACTURING METHOD AND OPTICAL COMPONENT
EP1571695A4 (en) EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE SAME
EP1612850A4 (en) EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE
WO2004011984A3 (en) Retainer, exposure apparatus, and semiconductor device fabrication method
AU2003298221A1 (en) Device and method for the optical measurement of an optical system, a container therefor, and a microlithography projection exposure machine
EP1783821A4 (en) EXPOSURE SYSTEM AND METHOD FOR PRODUCING THE DEVICE
EP1571694A4 (en) EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE
SG141385A1 (en) Lithographic apparatus and device manufacturing method
EP1679738A4 (en) EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
TW200700926A (en) Optical element, exposure apparatus, and device manufacturing method
EP1566697A3 (en) Lithographic apparatus and device manufacturing method

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170708