HK1117188A1 - Adhesive agent for connecting electrode and connecting method using the adhesive agent - Google Patents
Adhesive agent for connecting electrode and connecting method using the adhesive agentInfo
- Publication number
- HK1117188A1 HK1117188A1 HK08111905.3A HK08111905A HK1117188A1 HK 1117188 A1 HK1117188 A1 HK 1117188A1 HK 08111905 A HK08111905 A HK 08111905A HK 1117188 A1 HK1117188 A1 HK 1117188A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- adhesive agent
- electrode
- connecting electrode
- connecting method
- adhesive
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 2
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Adhesive Tapes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000061548 | 2000-03-07 | ||
JP2000090197A JP2001323246A (ja) | 2000-03-07 | 2000-03-29 | 電極接続用接着剤及びこれを用いた接着方法 |
HK02103139.4A HK1041496B (zh) | 2000-03-07 | 2002-04-26 | 電極連接用粘結劑及使用該粘結劑的連接方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1117188A1 true HK1117188A1 (en) | 2009-01-09 |
Family
ID=26586909
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08111905.3A HK1117188A1 (en) | 2000-03-07 | 2002-04-26 | Adhesive agent for connecting electrode and connecting method using the adhesive agent |
HK02103139.4A HK1041496B (zh) | 2000-03-07 | 2002-04-26 | 電極連接用粘結劑及使用該粘結劑的連接方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02103139.4A HK1041496B (zh) | 2000-03-07 | 2002-04-26 | 電極連接用粘結劑及使用該粘結劑的連接方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20030029559A1 (ja) |
JP (1) | JP2001323246A (ja) |
KR (2) | KR100547454B1 (ja) |
CN (3) | CN100398620C (ja) |
HK (2) | HK1117188A1 (ja) |
TW (1) | TW487935B (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6833629B2 (en) † | 2001-12-14 | 2004-12-21 | National Starch And Chemical Investment Holding Corporation | Dual cure B-stageable underfill for wafer level |
US20030129438A1 (en) * | 2001-12-14 | 2003-07-10 | Becker Kevin Harris | Dual cure B-stageable adhesive for die attach |
JP4238124B2 (ja) | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
JP4282417B2 (ja) | 2003-09-12 | 2009-06-24 | ソニーケミカル&インフォメーションデバイス株式会社 | 接続構造体 |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
JP2005203558A (ja) * | 2004-01-15 | 2005-07-28 | Seiko Epson Corp | 半導体装置及びその製造方法 |
JP2005320455A (ja) * | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
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-
2000
- 2000-03-29 JP JP2000090197A patent/JP2001323246A/ja not_active Withdrawn
-
2001
- 2001-02-27 TW TW090104453A patent/TW487935B/zh not_active IP Right Cessation
- 2001-03-01 US US09/795,140 patent/US20030029559A1/en not_active Abandoned
- 2001-03-06 CN CNB01116252XA patent/CN100398620C/zh not_active Expired - Fee Related
- 2001-03-06 CN CN2008100900921A patent/CN101250386B/zh not_active Expired - Fee Related
- 2001-03-06 CN CN200710305408XA patent/CN101230241B/zh not_active Expired - Fee Related
- 2001-03-07 KR KR1020010011646A patent/KR100547454B1/ko not_active IP Right Cessation
-
2002
- 2002-04-26 HK HK08111905.3A patent/HK1117188A1/xx not_active IP Right Cessation
- 2002-04-26 HK HK02103139.4A patent/HK1041496B/zh not_active IP Right Cessation
-
2005
- 2005-07-13 KR KR1020050063414A patent/KR100841584B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2001323246A (ja) | 2001-11-22 |
KR20050080116A (ko) | 2005-08-11 |
CN101230241B (zh) | 2011-09-21 |
KR20010088423A (ko) | 2001-09-26 |
KR100547454B1 (ko) | 2006-02-01 |
TW487935B (en) | 2002-05-21 |
US20030029559A1 (en) | 2003-02-13 |
CN101250386A (zh) | 2008-08-27 |
CN101250386B (zh) | 2011-01-26 |
CN101230241A (zh) | 2008-07-30 |
KR100841584B1 (ko) | 2008-06-26 |
CN100398620C (zh) | 2008-07-02 |
HK1041496A1 (en) | 2002-07-12 |
HK1041496B (zh) | 2009-05-22 |
CN1319636A (zh) | 2001-10-31 |
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