HK1041496B - 電極連接用粘結劑及使用該粘結劑的連接方法 - Google Patents
電極連接用粘結劑及使用該粘結劑的連接方法Info
- Publication number
- HK1041496B HK1041496B HK02103139.4A HK02103139A HK1041496B HK 1041496 B HK1041496 B HK 1041496B HK 02103139 A HK02103139 A HK 02103139A HK 1041496 B HK1041496 B HK 1041496B
- Authority
- HK
- Hong Kong
- Prior art keywords
- adhesive
- same
- connecting electrodes
- adhesion methods
- adhesion
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK08111905.3A HK1117188A1 (en) | 2000-03-07 | 2002-04-26 | Adhesive agent for connecting electrode and connecting method using the adhesive agent |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000061548 | 2000-03-07 | ||
JP2000090197A JP2001323246A (ja) | 2000-03-07 | 2000-03-29 | 電極接続用接着剤及びこれを用いた接着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
HK1041496A1 HK1041496A1 (en) | 2002-07-12 |
HK1041496B true HK1041496B (zh) | 2009-05-22 |
Family
ID=26586909
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02103139.4A HK1041496B (zh) | 2000-03-07 | 2002-04-26 | 電極連接用粘結劑及使用該粘結劑的連接方法 |
HK08111905.3A HK1117188A1 (en) | 2000-03-07 | 2002-04-26 | Adhesive agent for connecting electrode and connecting method using the adhesive agent |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08111905.3A HK1117188A1 (en) | 2000-03-07 | 2002-04-26 | Adhesive agent for connecting electrode and connecting method using the adhesive agent |
Country Status (6)
Country | Link |
---|---|
US (1) | US20030029559A1 (zh) |
JP (1) | JP2001323246A (zh) |
KR (2) | KR100547454B1 (zh) |
CN (3) | CN100398620C (zh) |
HK (2) | HK1041496B (zh) |
TW (1) | TW487935B (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030129438A1 (en) * | 2001-12-14 | 2003-07-10 | Becker Kevin Harris | Dual cure B-stageable adhesive for die attach |
US6833629B2 (en) † | 2001-12-14 | 2004-12-21 | National Starch And Chemical Investment Holding Corporation | Dual cure B-stageable underfill for wafer level |
JP4238124B2 (ja) | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
JP4282417B2 (ja) | 2003-09-12 | 2009-06-24 | ソニーケミカル&インフォメーションデバイス株式会社 | 接続構造体 |
JP2005194393A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
JP2005203558A (ja) * | 2004-01-15 | 2005-07-28 | Seiko Epson Corp | 半導体装置及びその製造方法 |
JP2005320455A (ja) * | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
JP4534716B2 (ja) * | 2004-10-26 | 2010-09-01 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造体及び接続方法 |
CN101194540B (zh) * | 2005-04-11 | 2010-06-16 | 3M创新有限公司 | 导电产品的连接方法和具有由该连接方法连接的部分的电气或电子元件 |
WO2006112383A1 (ja) * | 2005-04-14 | 2006-10-26 | Matsushita Electric Industrial Co., Ltd. | 電子回路装置およびその製造方法 |
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JP2001049228A (ja) * | 1999-08-12 | 2001-02-20 | Sony Chem Corp | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
-
2000
- 2000-03-29 JP JP2000090197A patent/JP2001323246A/ja not_active Withdrawn
-
2001
- 2001-02-27 TW TW090104453A patent/TW487935B/zh not_active IP Right Cessation
- 2001-03-01 US US09/795,140 patent/US20030029559A1/en not_active Abandoned
- 2001-03-06 CN CNB01116252XA patent/CN100398620C/zh not_active Expired - Fee Related
- 2001-03-06 CN CN2008100900921A patent/CN101250386B/zh not_active Expired - Fee Related
- 2001-03-06 CN CN200710305408XA patent/CN101230241B/zh not_active Expired - Fee Related
- 2001-03-07 KR KR1020010011646A patent/KR100547454B1/ko not_active IP Right Cessation
-
2002
- 2002-04-26 HK HK02103139.4A patent/HK1041496B/zh not_active IP Right Cessation
- 2002-04-26 HK HK08111905.3A patent/HK1117188A1/xx not_active IP Right Cessation
-
2005
- 2005-07-13 KR KR1020050063414A patent/KR100841584B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW487935B (en) | 2002-05-21 |
KR20010088423A (ko) | 2001-09-26 |
CN101230241A (zh) | 2008-07-30 |
CN101250386A (zh) | 2008-08-27 |
US20030029559A1 (en) | 2003-02-13 |
KR100547454B1 (ko) | 2006-02-01 |
KR100841584B1 (ko) | 2008-06-26 |
CN101230241B (zh) | 2011-09-21 |
JP2001323246A (ja) | 2001-11-22 |
CN1319636A (zh) | 2001-10-31 |
HK1041496A1 (en) | 2002-07-12 |
KR20050080116A (ko) | 2005-08-11 |
CN101250386B (zh) | 2011-01-26 |
HK1117188A1 (en) | 2009-01-09 |
CN100398620C (zh) | 2008-07-02 |
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