HK1098516A1 - Surface-treating agent for metal - Google Patents

Surface-treating agent for metal

Info

Publication number
HK1098516A1
HK1098516A1 HK07104975.4A HK07104975A HK1098516A1 HK 1098516 A1 HK1098516 A1 HK 1098516A1 HK 07104975 A HK07104975 A HK 07104975A HK 1098516 A1 HK1098516 A1 HK 1098516A1
Authority
HK
Hong Kong
Prior art keywords
metal
treating agent
treating
agent
Prior art date
Application number
HK07104975.4A
Other languages
English (en)
Inventor
Akihiro Aiba
Tomoharu Mimura
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1098516A1 publication Critical patent/HK1098516A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D257/00—Heterocyclic compounds containing rings having four nitrogen atoms as the only ring hetero atoms
    • C07D257/02—Heterocyclic compounds containing rings having four nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D257/04—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/18—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using inorganic inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Chemical Treatment Of Metals (AREA)
HK07104975.4A 2004-02-05 2007-05-10 Surface-treating agent for metal HK1098516A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004028905 2004-02-05
PCT/JP2005/000755 WO2005075706A1 (ja) 2004-02-05 2005-01-21 金属の表面処理剤

Publications (1)

Publication Number Publication Date
HK1098516A1 true HK1098516A1 (en) 2007-07-20

Family

ID=34835936

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07104975.4A HK1098516A1 (en) 2004-02-05 2007-05-10 Surface-treating agent for metal

Country Status (7)

Country Link
US (1) US7393395B2 (ja)
JP (1) JP4721904B2 (ja)
KR (1) KR100817973B1 (ja)
CN (2) CN101498002B (ja)
HK (1) HK1098516A1 (ja)
TW (1) TWI274793B (ja)
WO (1) WO2005075706A1 (ja)

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EP1795296B1 (en) 2004-08-31 2014-08-06 Senju Metal Industry Co., Ltd. Copper land-soldering flux
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US9045380B1 (en) * 2007-10-31 2015-06-02 Tk Holdings Inc. Gas generating compositions
TWI453301B (zh) * 2007-11-08 2014-09-21 Enthone 浸鍍銀塗層上的自組分子
US8057587B2 (en) * 2008-05-12 2011-11-15 Michael Beeck Composition for coloring solder
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
US8236204B1 (en) 2011-03-11 2012-08-07 Wincom, Inc. Corrosion inhibitor compositions comprising tetrahydrobenzotriazoles solubilized in activating solvents and methods for using same
US8236205B1 (en) 2011-03-11 2012-08-07 Wincom, Inc. Corrosion inhibitor compositions comprising tetrahydrobenzotriazoles and other triazoles and methods for using same
JP5722134B2 (ja) * 2011-06-23 2015-05-20 オリンパスイメージング株式会社 光学機器
US20130186764A1 (en) * 2012-01-19 2013-07-25 Kesheng Feng Low Etch Process for Direct Metallization
JP5940843B2 (ja) * 2012-03-14 2016-06-29 四国化成工業株式会社 銅または銅合金の表面処理剤およびその利用
US9309205B2 (en) 2013-10-28 2016-04-12 Wincom, Inc. Filtration process for purifying liquid azole heteroaromatic compound-containing mixtures
EP3077573B1 (en) 2013-12-02 2019-07-10 Ecolab USA Inc. Tetrazole based corrosion inhibitors
US20160122562A1 (en) * 2014-10-29 2016-05-05 C3Nano Inc. Stable transparent conductive elements based on sparse metal conductive layers
WO2016191672A1 (en) 2015-05-28 2016-12-01 Ecolab Usa Inc. 2-substituted imidazole and benzimidazole corrosion inhibitors
CN107614497B (zh) 2015-05-28 2021-08-03 艺康美国股份有限公司 腐蚀抑制剂
EP3314038B1 (en) 2015-05-28 2021-12-29 Ecolab Usa Inc. Purine-based corrosion inhibitors
EP3303655A4 (en) 2015-05-28 2019-02-27 Ecolab Usa Inc. WATER-SOLUBLE PYRAZOLE DERIVATIVES AS CORROSION INHIBITORS
CN109804439B (zh) 2016-10-14 2022-02-11 C3内诺公司 经稳定化的稀疏金属导电膜及用于稳定化合物的递送的溶液

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JPH04206681A (ja) 1990-11-30 1992-07-28 Hitachi Ltd 印刷配線板の表面処理方法及び印刷配線板
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KR20020048419A (ko) * 1999-09-27 2002-06-22 고지마 아끼로, 오가와 다이스께 염기성 금속 질산염, 그 제조법 및 가스 발생제 조성물
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JP4687852B2 (ja) 2001-06-25 2011-05-25 三菱瓦斯化学株式会社 銅および銅合金の表面処理剤
US6818313B2 (en) * 2002-07-24 2004-11-16 University Of Dayton Corrosion-inhibiting coating
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Also Published As

Publication number Publication date
JP4721904B2 (ja) 2011-07-13
CN101498002B (zh) 2011-06-22
US7393395B2 (en) 2008-07-01
WO2005075706A1 (ja) 2005-08-18
KR100817973B1 (ko) 2008-03-31
TWI274793B (en) 2007-03-01
KR20060121989A (ko) 2006-11-29
CN101498002A (zh) 2009-08-05
CN1914356B (zh) 2010-05-05
CN1914356A (zh) 2007-02-14
JPWO2005075706A1 (ja) 2007-10-11
US20070157845A1 (en) 2007-07-12
TW200536957A (en) 2005-11-16

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