HK10822265A1 - Process for producing high-purity epoxy resin and epoxy resin composition - Google Patents

Process for producing high-purity epoxy resin and epoxy resin composition

Info

Publication number
HK10822265A1
HK10822265A1 HK06104243A HK06104243A HK10822265A1 HK 10822265 A1 HK10822265 A1 HK 10822265A1 HK 06104243 A HK06104243 A HK 06104243A HK 06104243 A HK06104243 A HK 06104243A HK 10822265 A1 HK10822265 A1 HK 10822265A1
Authority
HK
Hong Kong
Prior art keywords
epoxy resin
producing high
purity
resin composition
purity epoxy
Prior art date
Application number
HK06104243A
Other languages
English (en)
Inventor
Hideyasu Asakage
Nobuhisa Saito
Yukio Nakamura
Original Assignee
Toto Kasei Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Kasei Kk filed Critical Toto Kasei Kk
Publication of HK10822265A1 publication Critical patent/HK10822265A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145—Compounds containing one epoxy group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
HK06104243A 2003-02-17 2006-04-07 Process for producing high-purity epoxy resin and epoxy resin composition HK10822265A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003038326A JP3986445B2 (ja) 2003-02-17 2003-02-17 高純度エポキシ樹脂の製造方法およびエポキシ樹脂組成物
PCT/JP2004/001646 WO2004072146A1 (ja) 2003-02-17 2004-02-16 高純度エポキシ樹脂の製造方法およびエポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
HK10822265A1 true HK10822265A1 (en) 2008-01-04

Family

ID=32866388

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06104243A HK10822265A1 (en) 2003-02-17 2006-04-07 Process for producing high-purity epoxy resin and epoxy resin composition

Country Status (7)

Country Link
US (1) US7268192B2 (ja)
EP (1) EP1595905B1 (ja)
JP (1) JP3986445B2 (ja)
KR (1) KR100611733B1 (ja)
CN (1) CN100335523C (ja)
HK (1) HK10822265A1 (ja)
WO (1) WO2004072146A1 (ja)

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WO2008095837A1 (en) * 2007-02-08 2008-08-14 Huntsman Advanced Materials (Switzerland) Gmbh Thermosetting composition
TW200842135A (en) * 2007-04-23 2008-11-01 Chang Chun Plastics Co Ltd Flame retardant resin composition
FR2917403B1 (fr) * 2007-06-18 2009-07-31 Saint Gobain Technical Fabrics Structure de fils de verre destinee a renforcer des articles abrasifs agglomeres
JP5228404B2 (ja) * 2007-08-27 2013-07-03 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、ビルドアップフィルム用樹脂組成物、新規エポキシ樹脂、及びその製造方法
EP2558543B1 (en) 2010-04-16 2017-08-30 Valspar Sourcing, Inc. Coating compositions for packaging articles and methods of coating
US9067845B2 (en) 2010-05-26 2015-06-30 Dow Global Technologies Llc Process for hydrochlorination of multihydroxylated aliphatic hydrocarbons
US20130243715A1 (en) * 2010-11-24 2013-09-19 L'oreal S.A. Compositions containing acrylic thickener and oil
ES2852198T3 (es) 2011-02-07 2021-09-13 Swimc Llc Composiciones de recubrimiento para recipientes y otros artículos, y métodos de recubrimiento
KR101139280B1 (ko) 2012-02-10 2012-04-26 주식회사 신아티앤씨 결정성 에폭시 수지
WO2014025997A1 (en) 2012-08-09 2014-02-13 Valspar Sourcing, Inc. Compositions for containers and other articles and methods of using same
MX2016012828A (es) 2014-04-14 2017-01-05 Valspar Sourcing Inc Metodos para preparar composiciones para contenedores y otros articulos y metodos para usarlas.
SG11201704514XA (en) * 2014-12-04 2017-07-28 Mitsubishi Chem Corp Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing material
TWI548693B (zh) * 2015-03-05 2016-09-11 南亞塑膠工業股份有限公司 聚苯醚改質酚－苯甲醛多官能基環氧樹脂與應用
TWI614275B (zh) * 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
CN111094383B (zh) * 2017-09-18 2022-09-13 阿迪塔亚博拉化学品（泰国）有限公司 用于结构复合材料的环氧树脂体系
JP2019104906A (ja) 2017-12-12 2019-06-27 三菱ケミカル株式会社 エポキシ樹脂組成物、硬化物及び電気・電子部品
US10961208B1 (en) 2019-12-24 2021-03-30 Chang Chun Plastics Co., Ltd. Product of glycidyl ether of a mono or polyhydric phenol

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Publication number Priority date Publication date Assignee Title
JPS5943014A (ja) * 1982-09-06 1984-03-09 Mitsui Petrochem Ind Ltd 加水分解性塩素の低減化方法
US4535150A (en) 1984-12-04 1985-08-13 Celanese Corporation Process for preparing epoxy resins having low hydrolyzable chlorine contents
US4668807A (en) * 1984-12-21 1987-05-26 Ciba-Geigy Corporation Process for reducing the content of hydrolyzable chlorine in glycidyl compounds
JPS6264817A (ja) 1985-09-17 1987-03-23 Yuka Shell Epoxy Kk エポキシ樹脂の精製方法
US4810776A (en) * 1986-07-14 1989-03-07 Ciba-Geigy Corporation Process for producing epoxy resin having a low-EHC-content from chlorine-substituted crude epoxy resin of high EHC-content and apparatus for automatically controlling such process
US4785061A (en) * 1987-08-13 1988-11-15 The Dow Chemical Company Method for reducing the aliphatic halide content of epoxy resins using a solvent mixture including a polar aprotic solvent
JP2532119B2 (ja) * 1987-12-24 1996-09-11 旭チバ株式会社 多官能化エポキシ樹脂の製造方法
US5098965A (en) * 1991-01-31 1992-03-24 Shell Oil Company Process for preparing low-chlorine epoxy resins
JP3238196B2 (ja) * 1992-05-19 2001-12-10 日本化薬株式会社 エポキシ樹脂、樹脂組成物及び硬化物
JPH06298904A (ja) * 1993-04-15 1994-10-25 Nippon Kayaku Co Ltd エポキシ樹脂組成物、エポキシ樹脂配合物およびその硬化物
JPH06298902A (ja) * 1993-04-16 1994-10-25 Toto Kasei Kk エポキシ樹脂組成物
JP4113289B2 (ja) * 1998-09-21 2008-07-09 東都化成株式会社 粉体塗料組成物
JP3889520B2 (ja) 1999-02-17 2007-03-07 ジャパンエポキシレジン株式会社 エポキシ化合物の精製方法
US6211389B1 (en) * 2000-05-23 2001-04-03 Dexter Corporation Methods of reducing the chloride content of epoxy compounds
JP4469474B2 (ja) * 2000-07-28 2010-05-26 阪本薬品工業株式会社 新規なエポキシ樹脂の製造法、およびその方法で製造されたエポキシ樹脂を含むエポキシ樹脂組成物
JP2002114834A (ja) 2000-10-04 2002-04-16 Japan U-Pica Co Ltd エポキシ化合物の製造方法
JP4675500B2 (ja) * 2001-05-14 2011-04-20 新日鐵化学株式会社 高純度エポキシ樹脂の製造方法

Also Published As

Publication number Publication date
EP1595905A4 (en) 2010-03-31
KR20040103951A (ko) 2004-12-09
KR100611733B1 (ko) 2006-08-11
EP1595905B1 (en) 2011-08-31
US7268192B2 (en) 2007-09-11
US20050131195A1 (en) 2005-06-16
JP3986445B2 (ja) 2007-10-03
CN100335523C (zh) 2007-09-05
JP2004262977A (ja) 2004-09-24
EP1595905A1 (en) 2005-11-16
CN1697848A (zh) 2005-11-16
WO2004072146A1 (ja) 2004-08-26

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