HK10822265A1 - Process for producing high-purity epoxy resin and epoxy resin composition - Google Patents
Process for producing high-purity epoxy resin and epoxy resin compositionInfo
- Publication number
- HK10822265A1 HK10822265A1 HK06104243A HK06104243A HK10822265A1 HK 10822265 A1 HK10822265 A1 HK 10822265A1 HK 06104243 A HK06104243 A HK 06104243A HK 06104243 A HK06104243 A HK 06104243A HK 10822265 A1 HK10822265 A1 HK 10822265A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- epoxy resin
- producing high
- purity
- resin composition
- purity epoxy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/145—Compounds containing one epoxy group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003038326A JP3986445B2 (ja) | 2003-02-17 | 2003-02-17 | 高純度エポキシ樹脂の製造方法およびエポキシ樹脂組成物 |
PCT/JP2004/001646 WO2004072146A1 (ja) | 2003-02-17 | 2004-02-16 | 高純度エポキシ樹脂の製造方法およびエポキシ樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK10822265A1 true HK10822265A1 (en) | 2008-01-04 |
Family
ID=32866388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06104243A HK10822265A1 (en) | 2003-02-17 | 2006-04-07 | Process for producing high-purity epoxy resin and epoxy resin composition |
Country Status (7)
Country | Link |
---|---|
US (1) | US7268192B2 (xx) |
EP (1) | EP1595905B1 (xx) |
JP (1) | JP3986445B2 (xx) |
KR (1) | KR100611733B1 (xx) |
CN (1) | CN100335523C (xx) |
HK (1) | HK10822265A1 (xx) |
WO (1) | WO2004072146A1 (xx) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8852382B2 (en) * | 2007-02-08 | 2014-10-07 | Huntsman International Llc | Thermosetting composition |
TW200842135A (en) * | 2007-04-23 | 2008-11-01 | Chang Chun Plastics Co Ltd | Flame retardant resin composition |
FR2917403B1 (fr) * | 2007-06-18 | 2009-07-31 | Saint Gobain Technical Fabrics | Structure de fils de verre destinee a renforcer des articles abrasifs agglomeres |
JP5228404B2 (ja) * | 2007-08-27 | 2013-07-03 | Dic株式会社 | エポキシ樹脂組成物、その硬化物、ビルドアップフィルム用樹脂組成物、新規エポキシ樹脂、及びその製造方法 |
KR20130061132A (ko) | 2010-04-16 | 2013-06-10 | 발스파 소싱 인코포레이티드 | 패키징 용품을 위한 코팅 조성물 및 코팅 방법 |
EP2576489A1 (en) | 2010-05-26 | 2013-04-10 | Dow Global Technologies LLC | Process for hydrochlorination of multihydroxylated aliphatic hydrocarbons |
US20130243715A1 (en) * | 2010-11-24 | 2013-09-19 | L'oreal S.A. | Compositions containing acrylic thickener and oil |
BR112013020026B1 (pt) | 2011-02-07 | 2021-03-02 | Swimc Llc | artigo, composição de revestimento, e, método |
KR101139280B1 (ko) | 2012-02-10 | 2012-04-26 | 주식회사 신아티앤씨 | 결정성 에폭시 수지 |
ES2849526T3 (es) | 2012-08-09 | 2021-08-19 | Swimc Llc | Composiciones para contenedores y otros artículos y métodos de utilización de los mismos |
EP3131965B1 (en) | 2014-04-14 | 2024-06-12 | Swimc Llc | Methods of preparing compositions for containers and other articles and methods of using same |
SG11201704514XA (en) * | 2014-12-04 | 2017-07-28 | Mitsubishi Chem Corp | Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product and semiconductor sealing material |
TWI548693B (zh) * | 2015-03-05 | 2016-09-11 | 南亞塑膠工業股份有限公司 | 聚苯醚改質酚-苯甲醛多官能基環氧樹脂與應用 |
TWI614275B (zh) * | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | 用於製備聚合物的液體環氧樹脂組合物 |
CN111094383B (zh) * | 2017-09-18 | 2022-09-13 | 阿迪塔亚博拉化学品(泰国)有限公司 | 用于结构复合材料的环氧树脂体系 |
JP2019104906A (ja) | 2017-12-12 | 2019-06-27 | 三菱ケミカル株式会社 | エポキシ樹脂組成物、硬化物及び電気・電子部品 |
US10961208B1 (en) | 2019-12-24 | 2021-03-30 | Chang Chun Plastics Co., Ltd. | Product of glycidyl ether of a mono or polyhydric phenol |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5943014A (ja) * | 1982-09-06 | 1984-03-09 | Mitsui Petrochem Ind Ltd | 加水分解性塩素の低減化方法 |
US4535150A (en) | 1984-12-04 | 1985-08-13 | Celanese Corporation | Process for preparing epoxy resins having low hydrolyzable chlorine contents |
US4668807A (en) * | 1984-12-21 | 1987-05-26 | Ciba-Geigy Corporation | Process for reducing the content of hydrolyzable chlorine in glycidyl compounds |
JPS6264817A (ja) | 1985-09-17 | 1987-03-23 | Yuka Shell Epoxy Kk | エポキシ樹脂の精製方法 |
US4810776A (en) * | 1986-07-14 | 1989-03-07 | Ciba-Geigy Corporation | Process for producing epoxy resin having a low-EHC-content from chlorine-substituted crude epoxy resin of high EHC-content and apparatus for automatically controlling such process |
US4785061A (en) * | 1987-08-13 | 1988-11-15 | The Dow Chemical Company | Method for reducing the aliphatic halide content of epoxy resins using a solvent mixture including a polar aprotic solvent |
JP2532119B2 (ja) | 1987-12-24 | 1996-09-11 | 旭チバ株式会社 | 多官能化エポキシ樹脂の製造方法 |
US5098965A (en) * | 1991-01-31 | 1992-03-24 | Shell Oil Company | Process for preparing low-chlorine epoxy resins |
JP3238196B2 (ja) | 1992-05-19 | 2001-12-10 | 日本化薬株式会社 | エポキシ樹脂、樹脂組成物及び硬化物 |
JPH06298904A (ja) | 1993-04-15 | 1994-10-25 | Nippon Kayaku Co Ltd | エポキシ樹脂組成物、エポキシ樹脂配合物およびその硬化物 |
JPH06298902A (ja) * | 1993-04-16 | 1994-10-25 | Toto Kasei Kk | エポキシ樹脂組成物 |
JP4113289B2 (ja) | 1998-09-21 | 2008-07-09 | 東都化成株式会社 | 粉体塗料組成物 |
JP3889520B2 (ja) | 1999-02-17 | 2007-03-07 | ジャパンエポキシレジン株式会社 | エポキシ化合物の精製方法 |
US6211389B1 (en) * | 2000-05-23 | 2001-04-03 | Dexter Corporation | Methods of reducing the chloride content of epoxy compounds |
JP4469474B2 (ja) | 2000-07-28 | 2010-05-26 | 阪本薬品工業株式会社 | 新規なエポキシ樹脂の製造法、およびその方法で製造されたエポキシ樹脂を含むエポキシ樹脂組成物 |
JP2002114834A (ja) | 2000-10-04 | 2002-04-16 | Japan U-Pica Co Ltd | エポキシ化合物の製造方法 |
JP4675500B2 (ja) | 2001-05-14 | 2011-04-20 | 新日鐵化学株式会社 | 高純度エポキシ樹脂の製造方法 |
-
2003
- 2003-02-17 JP JP2003038326A patent/JP3986445B2/ja not_active Expired - Lifetime
-
2004
- 2004-02-16 CN CNB2004800001333A patent/CN100335523C/zh not_active Expired - Fee Related
- 2004-02-16 WO PCT/JP2004/001646 patent/WO2004072146A1/ja active IP Right Grant
- 2004-02-16 KR KR1020047016535A patent/KR100611733B1/ko active IP Right Grant
- 2004-02-16 EP EP04711446A patent/EP1595905B1/en not_active Expired - Lifetime
- 2004-02-16 US US10/511,553 patent/US7268192B2/en not_active Expired - Fee Related
-
2006
- 2006-04-07 HK HK06104243A patent/HK10822265A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US20050131195A1 (en) | 2005-06-16 |
KR20040103951A (ko) | 2004-12-09 |
JP2004262977A (ja) | 2004-09-24 |
WO2004072146A1 (ja) | 2004-08-26 |
EP1595905A4 (en) | 2010-03-31 |
US7268192B2 (en) | 2007-09-11 |
KR100611733B1 (ko) | 2006-08-11 |
CN100335523C (zh) | 2007-09-05 |
EP1595905A1 (en) | 2005-11-16 |
EP1595905B1 (en) | 2011-08-31 |
CN1697848A (zh) | 2005-11-16 |
JP3986445B2 (ja) | 2007-10-03 |
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