HK1027827A1 - Semiconductor sealing resin composition semiconductor device sealed with the same and process for preparing semiconductor device - Google Patents
Semiconductor sealing resin composition semiconductor device sealed with the same and process for preparing semiconductor deviceInfo
- Publication number
- HK1027827A1 HK1027827A1 HK00107126A HK00107126A HK1027827A1 HK 1027827 A1 HK1027827 A1 HK 1027827A1 HK 00107126 A HK00107126 A HK 00107126A HK 00107126 A HK00107126 A HK 00107126A HK 1027827 A1 HK1027827 A1 HK 1027827A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor device
- resin composition
- same
- sealing resin
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10364697 | 1997-04-21 | ||
PCT/JP1998/001190 WO1998047968A1 (en) | 1997-04-21 | 1998-03-19 | Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1027827A1 true HK1027827A1 (en) | 2001-01-23 |
Family
ID=14359548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00107126A HK1027827A1 (en) | 1997-04-21 | 2000-11-09 | Semiconductor sealing resin composition semiconductor device sealed with the same and process for preparing semiconductor device |
Country Status (10)
Country | Link |
---|---|
US (1) | US6319619B1 (ko) |
EP (1) | EP0978542B1 (ko) |
JP (1) | JP3380560B2 (ko) |
KR (1) | KR100346974B1 (ko) |
CN (1) | CN1249168C (ko) |
DE (1) | DE69838610T2 (ko) |
HK (1) | HK1027827A1 (ko) |
MY (1) | MY122235A (ko) |
TW (1) | TW405233B (ko) |
WO (1) | WO1998047968A1 (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000036552A (ja) | 1998-07-17 | 2000-02-02 | Fujitsu Ltd | 半導体装置、及び半導体装置で用いる封止材中の金属分の分取方法 |
JP4438973B2 (ja) * | 2000-05-23 | 2010-03-24 | アムコア テクノロジー,インコーポレイテッド | シート状樹脂組成物及びそれを用いた半導体装置の製造方法 |
CN100343325C (zh) * | 2000-08-18 | 2007-10-17 | 长春人造树脂厂股份有限公司 | 阻燃性环氧树脂组合物、制备方法及其应用 |
JP2002141556A (ja) | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
TW521548B (en) * | 2000-10-13 | 2003-02-21 | Zeon Corp | Curable composition, molded article, multi-layer wiring substrate, particle and its manufacturing process, varnish and its manufacturing process, laminate, and flame retardant slurry |
JP2003082242A (ja) * | 2001-09-17 | 2003-03-19 | Nitto Denko Corp | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
JP2003092379A (ja) * | 2001-09-18 | 2003-03-28 | Hitachi Ltd | 半導体装置 |
US20050222300A1 (en) * | 2002-02-27 | 2005-10-06 | Ryoichi Ikezawa | Encapsulating epoxy resin composition, and electronic parts device using the same |
CN101429323B (zh) * | 2002-02-27 | 2011-07-20 | 日立化成工业株式会社 | 封装用环氧树脂组合物及使用该组合物的电子组件 |
CN101412838B (zh) * | 2002-02-27 | 2011-02-09 | 日立化成工业株式会社 | 封装用环氧树脂组合物及使用该组合物的电子组件 |
US7332229B2 (en) * | 2002-04-15 | 2008-02-19 | Zeon Corporation | Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particles and varnish |
US20040166241A1 (en) * | 2003-02-20 | 2004-08-26 | Henkel Loctite Corporation | Molding compositions containing quaternary organophosphonium salts |
WO2004090033A1 (ja) * | 2003-04-07 | 2004-10-21 | Hitachi Chemical Co., Ltd. | 封止用エポキシ樹脂成形材料及び半導体装置 |
US7456235B2 (en) | 2003-04-30 | 2008-11-25 | Henkel Corporation | Flame-retardant composition for coating powders |
US6936646B2 (en) | 2003-04-30 | 2005-08-30 | Henkel Corporation | Flame-retardant molding compositions |
WO2005090478A2 (de) * | 2004-03-15 | 2005-09-29 | Siemens Aktiengesellschaft | Wärmeleitfähiges material für elektronische und/oder elektronische bauteile sowie verwendung dazu |
WO2006006592A1 (ja) * | 2004-07-13 | 2006-01-19 | Hitachi Chemical Co., Ltd. | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP5353629B2 (ja) * | 2008-11-14 | 2013-11-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
CN102337002B (zh) * | 2011-06-17 | 2012-09-05 | 莱州市顺利达电子材料有限公司 | 有机硅改性酚醛树脂包封料及其制备方法和用途 |
JP5877745B2 (ja) * | 2012-03-27 | 2016-03-08 | タテホ化学工業株式会社 | 複合金属水酸化物粒子、及びそれを含む樹脂組成物 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7005269A (ko) * | 1970-04-13 | 1971-10-15 | ||
DE3118130A1 (de) | 1981-05-07 | 1982-12-02 | Siemens AG, 1000 Berlin und 8000 München | Elektrisch isolierende einkapselungsmasse fuer halbleiteranordnungen |
JPS58174434A (ja) | 1982-04-08 | 1983-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂系成形材料 |
US4719255A (en) | 1984-08-23 | 1988-01-12 | Kabushiki Kaisha Toshiba | Epoxy resin composition for encapsulation of semi-conductor device |
CA1335616C (en) | 1987-04-14 | 1995-05-16 | Kaoru Tominaga | Polyimide resin compositions |
JPH01272619A (ja) | 1987-07-22 | 1989-10-31 | Mitsubishi Gas Chem Co Inc | エポキシ樹脂組成物 |
JPH0814933B2 (ja) | 1987-09-14 | 1996-02-14 | アンリツ株式会社 | 磁気テープ装置のバッファ制御装置 |
US4963291A (en) | 1988-06-13 | 1990-10-16 | Bercaw Robert M | Insulating electromagnetic shielding resin composition |
JP3157448B2 (ja) | 1988-10-05 | 2001-04-16 | 株式会社トプコン | 被加工レンズの加工システム |
JPH03157448A (ja) | 1989-11-15 | 1991-07-05 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
JPH06102715B2 (ja) | 1990-08-14 | 1994-12-14 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
JPH0529495A (ja) | 1991-07-18 | 1993-02-05 | Toshiba Corp | 樹脂封止型半導体装置 |
US5290882A (en) | 1991-08-13 | 1994-03-01 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
CN1090646C (zh) | 1993-08-20 | 2002-09-11 | 日东电工株式会社 | 半导体器件 |
JPH09100337A (ja) | 1995-10-04 | 1997-04-15 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物及びこれを用いた半導体装置 |
JPH1077390A (ja) | 1996-08-30 | 1998-03-24 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
-
1998
- 1998-03-19 EP EP98909770A patent/EP0978542B1/en not_active Expired - Lifetime
- 1998-03-19 US US09/403,311 patent/US6319619B1/en not_active Expired - Lifetime
- 1998-03-19 KR KR1019997008926A patent/KR100346974B1/ko not_active IP Right Cessation
- 1998-03-19 CN CNB98804319XA patent/CN1249168C/zh not_active Expired - Fee Related
- 1998-03-19 DE DE69838610T patent/DE69838610T2/de not_active Expired - Lifetime
- 1998-03-19 JP JP54541798A patent/JP3380560B2/ja not_active Expired - Fee Related
- 1998-03-19 WO PCT/JP1998/001190 patent/WO1998047968A1/ja active Search and Examination
- 1998-04-14 TW TW087105594A patent/TW405233B/zh not_active IP Right Cessation
- 1998-04-21 MY MYPI98001788A patent/MY122235A/en unknown
-
2000
- 2000-11-09 HK HK00107126A patent/HK1027827A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20010005851A (ko) | 2001-01-15 |
DE69838610T2 (de) | 2008-02-07 |
JP3380560B2 (ja) | 2003-02-24 |
MY122235A (en) | 2006-04-29 |
WO1998047968A1 (en) | 1998-10-29 |
TW405233B (en) | 2000-09-11 |
CN1249168C (zh) | 2006-04-05 |
EP0978542B1 (en) | 2007-10-24 |
KR100346974B1 (ko) | 2002-07-31 |
CN1252828A (zh) | 2000-05-10 |
US6319619B1 (en) | 2001-11-20 |
EP0978542A1 (en) | 2000-02-09 |
EP0978542A4 (en) | 2000-07-12 |
DE69838610D1 (de) | 2007-12-06 |
WO1998047968A9 (en) | 2000-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1027827A1 (en) | Semiconductor sealing resin composition semiconductor device sealed with the same and process for preparing semiconductor device | |
SG42780A1 (en) | Epoxy resin molding material for sealing electronic parts and sealed semiconductor device usin the same | |
SG87012A1 (en) | Epoxy resin composition and semiconductor device using the same | |
EP0658935A3 (en) | Semiconductor device of the resin encapsulation type and manufacturing method. | |
AU4571297A (en) | Phase-separation structure, resin composition comprising said structure, molding material for sealing electronic component, and electronic component device | |
EP0680095A3 (en) | Light-transmissive resin sealed semiconductor | |
EP0713250A3 (en) | Material for semiconductor substrate, its manufacture and product from this substrate | |
HK1025298A1 (en) | Wafer shipper and package | |
SG65533A1 (en) | Resin sealing type semiconductor device and method of making the same | |
SG45124A1 (en) | Resin sealing type semiconductor device and method of making the same | |
EP0484157A3 (en) | Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition | |
SG78295A1 (en) | Flame-retardant resin composition and semiconductor sealant using the same | |
SG70032A1 (en) | Polyphenylene sulfide resin composition and resin-encapsulated semiconductor device | |
HK1013734A1 (en) | Resin sealing type semiconductor device and method of making the same | |
SG38933A1 (en) | Resin sealing type semiconductor device and method of making the same | |
GB2291426B (en) | Epoxy resin composition process for producing the same and resin-sealed semiconductor device | |
TW467401U (en) | Lead frame and the semiconductor device utilizing the lead frame | |
HK1027370A1 (en) | Semiconductor sealing epoxy resin composition and semiconductor device using the same | |
GB2249313B (en) | Epoxy resin composition for use in sealing semiconductors | |
EP0359500A3 (en) | Resin compositions for sealing semiconductors | |
GB2291093B (en) | Sealing device | |
SG64845A1 (en) | Epoxy resin composition and resin-encapsulated semiconductor device | |
GB2292556B (en) | Sealing envelopes and packages | |
GB9426344D0 (en) | Sealing device | |
EP0486027A3 (en) | Resin sealed semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20130319 |