HK1026329A1 - Plasma treatment apparatus and plasma treatment method performed by use of the same apparatus - Google Patents

Plasma treatment apparatus and plasma treatment method performed by use of the same apparatus

Info

Publication number
HK1026329A1
HK1026329A1 HK00105475A HK00105475A HK1026329A1 HK 1026329 A1 HK1026329 A1 HK 1026329A1 HK 00105475 A HK00105475 A HK 00105475A HK 00105475 A HK00105475 A HK 00105475A HK 1026329 A1 HK1026329 A1 HK 1026329A1
Authority
HK
Hong Kong
Prior art keywords
plasma treatment
method performed
treatment method
same apparatus
same
Prior art date
Application number
HK00105475A
Other languages
English (en)
Inventor
Yasushi Sawada
Kosuke Nakamura
Hiroaki Kitamura
Yoshitami Inoue
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of HK1026329A1 publication Critical patent/HK1026329A1/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348Dielectric barrier discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32541Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • H01J37/32559Protection means, e.g. coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32715Workpiece holder
    • H01J37/32724Temperature

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Treatment Of Fiber Materials (AREA)
HK00105475A 1998-10-26 2000-09-01 Plasma treatment apparatus and plasma treatment method performed by use of the same apparatus HK1026329A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30400398 1998-10-26

Publications (1)

Publication Number Publication Date
HK1026329A1 true HK1026329A1 (en) 2000-12-08

Family

ID=17927898

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00105475A HK1026329A1 (en) 1998-10-26 2000-09-01 Plasma treatment apparatus and plasma treatment method performed by use of the same apparatus

Country Status (7)

Country Link
US (1) US6424091B1 (fr)
EP (1) EP0997926B1 (fr)
KR (1) KR100320574B1 (fr)
CN (1) CN1141009C (fr)
DE (1) DE69929271T2 (fr)
HK (1) HK1026329A1 (fr)
TW (1) TW518367B (fr)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6441553B1 (en) * 1999-02-01 2002-08-27 Sigma Technologies International, Inc. Electrode for glow-discharge atmospheric-pressure plasma treatment
JP2001147424A (ja) * 1999-11-19 2001-05-29 Hitachi Ltd 導電性薄膜形成用の絶縁基板およびこの絶縁基板を用いた液晶表示素子
EP1162646A3 (fr) * 2000-06-06 2004-10-13 Matsushita Electric Works, Ltd. Appareil et méthode de traitement par plasma
US20040052028A1 (en) * 2000-10-26 2004-03-18 O'reilly Fergal Atmospheric pressure plasma assembly
KR100408604B1 (ko) * 2000-12-07 2003-12-06 주식회사제4기한국 대기압 플라즈마를 이용한 정밀세정과 표면개질방법 및 그장치
EP2397576A1 (fr) * 2000-12-12 2011-12-21 Konica Corporation Procédé de formation d'une couche, produit comprenant la couche, film optique, électrode à revêtement diélectrique et dispositif à décharge de plasma
US7591957B2 (en) * 2001-01-30 2009-09-22 Rapt Industries, Inc. Method for atmospheric pressure reactive atom plasma processing for surface modification
US7510664B2 (en) * 2001-01-30 2009-03-31 Rapt Industries, Inc. Apparatus and method for atmospheric pressure reactive atom plasma processing for shaping of damage free surfaces
KR20020085149A (ko) * 2001-05-07 2002-11-16 주식회사 우광유니텍 상온/상압에서의 플라즈마 건식세정장치
KR100491140B1 (ko) * 2001-06-15 2005-05-27 주식회사 셈테크놀러지 대기압 플라즈마를 이용한 표면 세정방법 및 장치
US6849306B2 (en) * 2001-08-23 2005-02-01 Konica Corporation Plasma treatment method at atmospheric pressure
KR20030018121A (ko) * 2001-08-27 2003-03-06 주식회사 우광유니텍 대기압 플라즈마를 이용한 세정장치
US6660177B2 (en) * 2001-11-07 2003-12-09 Rapt Industries Inc. Apparatus and method for reactive atom plasma processing for material deposition
US20030164143A1 (en) 2002-01-10 2003-09-04 Hitachi Kokusai Electric Inc. Batch-type remote plasma processing apparatus
DE10202311B4 (de) * 2002-01-23 2007-01-04 Schott Ag Vorrichtung und Verfahren zur Plasmabehandlung von dielektrischen Körpern
JP3957549B2 (ja) * 2002-04-05 2007-08-15 株式会社日立国際電気 基板処埋装置
KR100829327B1 (ko) 2002-04-05 2008-05-13 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치 및 반응 용기
JP4847009B2 (ja) * 2002-05-23 2011-12-28 ラム リサーチ コーポレーション 半導体処理プラズマ反応器用の多部品電極および多部品電極の一部を取り換える方法
CA2471987C (fr) * 2002-10-07 2008-09-02 Sekisui Chemical Co., Ltd. Dispositif de traitement plasmique de surface
KR100462772B1 (ko) * 2002-12-02 2004-12-23 에이치아이티 주식회사 플라즈마를 이용한 세정장치
JP4907088B2 (ja) * 2003-02-05 2012-03-28 株式会社半導体エネルギー研究所 表示装置の製造方法
EP1592049A1 (fr) * 2003-02-05 2005-11-02 Sel Semiconductor Energy Laboratory Co., Ltd. Procede de fabrication d'un ecran
KR101186919B1 (ko) * 2003-02-06 2012-10-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치의 제조 방법
KR101032338B1 (ko) * 2003-02-06 2011-05-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치의 제작방법
JP4748990B2 (ja) * 2003-02-06 2011-08-17 株式会社半導体エネルギー研究所 半導体装置の製造方法
US7371992B2 (en) * 2003-03-07 2008-05-13 Rapt Industries, Inc. Method for non-contact cleaning of a surface
WO2004090931A2 (fr) * 2003-04-10 2004-10-21 Bae Systems Plc Procede et dispositif pour le traitement d'une surface par decharge de plasma
US7387738B2 (en) 2003-04-28 2008-06-17 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment for wafer bumping applications
US8361340B2 (en) 2003-04-28 2013-01-29 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US7897029B2 (en) 2008-03-04 2011-03-01 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
CA2524484A1 (fr) * 2003-05-14 2004-11-25 Sekisui Chemical Co., Ltd. Appareil de traitement au plasma et procede permettant de produire cet appareil
US7304263B2 (en) * 2003-08-14 2007-12-04 Rapt Industries, Inc. Systems and methods utilizing an aperture with a reactive atom plasma torch
US7297892B2 (en) * 2003-08-14 2007-11-20 Rapt Industries, Inc. Systems and methods for laser-assisted plasma processing
DE102004019741B4 (de) * 2004-04-20 2006-04-27 Centrotherm Photovoltaics Gmbh + Co. Kg Plasmareaktor zur Oberflächenmodifikation von Gegenständen
US20060091117A1 (en) * 2004-11-04 2006-05-04 United Technologies Corporation Plasma spray apparatus
US20060139039A1 (en) * 2004-12-23 2006-06-29 Dutton David T Systems and methods for a contactless electrical probe
EP1689216A1 (fr) * 2005-02-04 2006-08-09 Vlaamse Instelling Voor Technologisch Onderzoek (Vito) Jet de plasma à pression atmosphérique
JP2006278236A (ja) * 2005-03-30 2006-10-12 Ngk Insulators Ltd プラズマ発生電極及びプラズマ反応器
EP1741826A1 (fr) * 2005-07-08 2007-01-10 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Méthode pour déposer une couche de polymère contenant un nano-materiau sur un substrat et appareil pour celà
CN101233792B (zh) * 2005-08-02 2011-07-27 日本普瑞伦有限责任公司 等离子体发生装置和使用等离子体发生装置的膜沉积方法
US7691278B2 (en) * 2005-09-27 2010-04-06 Lam Research Corporation Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor
US20070079936A1 (en) * 2005-09-29 2007-04-12 Applied Materials, Inc. Bonded multi-layer RF window
US20070116891A1 (en) * 2005-11-22 2007-05-24 The Regents Of The University Of California Plasma brush apparatus and method
US7434719B2 (en) 2005-12-09 2008-10-14 Air Products And Chemicals, Inc. Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
DE102007006786B4 (de) 2006-02-22 2022-02-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anlage und Verfahren zum Beschichten eines Substrates
KR100805690B1 (ko) * 2006-07-11 2008-02-21 한국기계연구원 슬롯형 리모트 저온 플라즈마 반응기
JP4884180B2 (ja) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4629068B2 (ja) 2007-05-25 2011-02-09 株式会社サイアン ワーク処理装置
US7453191B1 (en) 2007-07-06 2008-11-18 Uion Co., Ltd. Induction concentration remote atmospheric pressure plasma generating apparatus
US8097217B2 (en) * 2007-07-06 2012-01-17 Uion Co., Ltd Atmospheric pressure plasma generating apparatus by induction electrode
CN101376980B (zh) * 2007-08-27 2011-09-21 宝山钢铁股份有限公司 一种改善带钢润湿性的工艺
US7701145B2 (en) * 2007-09-07 2010-04-20 Nexolve Corporation Solid expellant plasma generator
US20090151322A1 (en) * 2007-12-18 2009-06-18 Perriquest Defense Research Enterprises Llc Plasma Assisted Combustion Device
US20100037820A1 (en) * 2008-08-13 2010-02-18 Synos Technology, Inc. Vapor Deposition Reactor
US20100037824A1 (en) * 2008-08-13 2010-02-18 Synos Technology, Inc. Plasma Reactor Having Injector
US8770142B2 (en) * 2008-09-17 2014-07-08 Veeco Ald Inc. Electrode for generating plasma and plasma generator
US8851012B2 (en) * 2008-09-17 2014-10-07 Veeco Ald Inc. Vapor deposition reactor using plasma and method for forming thin film using the same
EP2175047B1 (fr) * 2008-10-09 2017-02-08 Bobst Manchester Ltd Dispositif de traitement par plasma des substrats et procédé
EP2180768A1 (fr) * 2008-10-23 2010-04-28 TNO Nederlandse Organisatie voor Toegepast Wetenschappelijk Onderzoek Appareil et procédé pour traiter un objet
US8871628B2 (en) * 2009-01-21 2014-10-28 Veeco Ald Inc. Electrode structure, device comprising the same and method for forming electrode structure
US20100203287A1 (en) * 2009-02-10 2010-08-12 Ngimat Co. Hypertransparent Nanostructured Superhydrophobic and Surface Modification Coatings
DE102009008907B4 (de) 2009-02-13 2014-07-24 Airbus Operations Gmbh Verfahren zur Plasmabehandlung und Lackierung einer Fläche
WO2010095901A2 (fr) 2009-02-23 2010-08-26 Synos Technology, Inc. Procédé de formation de couche mince au moyen de radicaux générés par plasma
US10299887B2 (en) * 2009-04-23 2019-05-28 Nanova, Inc. Atmospheric non-thermal gas plasma method for dental surface treatment
CN102460635B (zh) * 2009-05-06 2014-12-24 3M创新有限公司 对容器进行等离子体处理的装置和方法
US8758512B2 (en) * 2009-06-08 2014-06-24 Veeco Ald Inc. Vapor deposition reactor and method for forming thin film
JP5287592B2 (ja) * 2009-08-11 2013-09-11 東京エレクトロン株式会社 成膜装置
US8454850B2 (en) * 2009-09-02 2013-06-04 Air Products And Chemicals, Inc. Method for the removal of surface oxides by electron attachment
KR101051449B1 (ko) * 2009-11-13 2011-07-22 한국기계연구원 플라즈마 처치기
US20110132543A1 (en) * 2009-12-09 2011-06-09 Electronics And Telecommunications Research Institute Brush type plasma surface treatment apparatus
JP5603219B2 (ja) * 2009-12-28 2014-10-08 キヤノンアネルバ株式会社 薄膜形成装置
JP2011144412A (ja) * 2010-01-13 2011-07-28 Honda Motor Co Ltd プラズマ成膜装置
US8771791B2 (en) 2010-10-18 2014-07-08 Veeco Ald Inc. Deposition of layer using depositing apparatus with reciprocating susceptor
US8877300B2 (en) 2011-02-16 2014-11-04 Veeco Ald Inc. Atomic layer deposition using radicals of gas mixture
US9163310B2 (en) 2011-02-18 2015-10-20 Veeco Ald Inc. Enhanced deposition of layer on substrate using radicals
JP5815967B2 (ja) * 2011-03-31 2015-11-17 東京エレクトロン株式会社 基板洗浄装置及び真空処理システム
GB201110282D0 (en) * 2011-06-17 2011-08-03 Linde Ag Device for providing a flow of plasma
MX2015003569A (es) * 2012-09-19 2016-06-21 Apjet Inc Aparato y metodo para procesar plasma bajo presion atmosferica.
US9447205B2 (en) * 2012-11-19 2016-09-20 Ut-Battelle, Llc Atmospheric pressure plasma processing of polymeric materials utilizing close proximity indirect exposure
CZ2012935A3 (cs) * 2012-12-19 2014-07-02 Masarykova Univerzita Způsob vytváření plazmatu za atmosférického tlaku ve štěrbinové trysce a zařízení k jeho provádění
CN103889138B (zh) * 2012-12-24 2016-06-29 中国科学院微电子研究所 等离子体放电装置
EP2953431B1 (fr) * 2013-02-04 2018-04-18 Creative Technology Corporation Générateur de plasma
CN103107059B (zh) * 2013-02-05 2015-09-30 珠海宝丰堂电子科技有限公司 等离子处理装置
EP2866318A1 (fr) * 2013-10-24 2015-04-29 OCE-Technologies B.V. Électrode pour traitement de décharge à barrière diélectrique d'un substrat
CN105990080B (zh) * 2015-02-02 2019-02-22 苏州爱特维电子科技有限公司 等离子体处理装置
WO2016168502A1 (fr) * 2015-04-14 2016-10-20 The Board Of Regents For Oklahoma State University Fil plasma
KR101682903B1 (ko) * 2015-05-20 2016-12-20 주식회사 플라즈맵 표면 처리용 선형 유전체 장벽 방전 플라즈마 발생장치
KR102424566B1 (ko) * 2016-03-14 2022-07-22 가부시키가이샤 후지 플라스마 발생 장치
CN105929507B (zh) * 2016-06-29 2018-04-03 深圳长飞智连技术有限公司 一种具有粘接涂覆层的钢丝加强元件及其制造方法
US10300711B2 (en) 2017-05-04 2019-05-28 Xerox Corporation Device for providing multiple surface treatments to three-dimensional objects prior to printing and system using the device
CN107172796A (zh) * 2017-05-31 2017-09-15 江南大学 一种圆角矩形轮廓‑球形曲面电极的低温等离子体杀菌处理腔
US10468236B2 (en) * 2017-06-02 2019-11-05 XEI Scienctific, Inc. Plasma device with an external RF hollow cathode for plasma cleaning of high vacuum systems
CN110916294A (zh) * 2018-09-19 2020-03-27 钜翁企业有限公司 一种用于处理鞋材的电浆生成器及其处理方法
CN112087854B (zh) * 2019-06-12 2024-01-23 中国石油化工股份有限公司 介质阻挡放电等离子体发生装置
CN112218418A (zh) * 2020-11-30 2021-01-12 清华大学 一种介质阻挡面放电单元以及电子设备
CN112509907A (zh) * 2020-11-30 2021-03-16 中船重工安谱(湖北)仪器有限公司 一种介质阻挡辉光放电离子源结构
CN113141700B (zh) * 2021-03-16 2022-07-12 深圳大学 大气压空气均匀介质阻挡放电的电极结构和方法
CN114269059A (zh) * 2021-12-06 2022-04-01 北京天恒盛通科技发展有限公司 单侧虹杠式等离子体发生器
CN117116787A (zh) * 2023-10-24 2023-11-24 苏州芯慧联半导体科技有限公司 晶圆键合方法及系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0748480B2 (ja) 1988-08-15 1995-05-24 新技術事業団 大気圧プラズマ反応方法
JPH0672308B2 (ja) 1988-07-04 1994-09-14 新技術事業団 大気圧プラズマ反応方法
JP2589599B2 (ja) 1989-11-30 1997-03-12 住友精密工業株式会社 吹出型表面処理装置
JP2537304B2 (ja) 1989-12-07 1996-09-25 新技術事業団 大気圧プラズマ反応方法とその装置
US5185132A (en) 1989-12-07 1993-02-09 Research Development Corporation Of Japan Atomspheric plasma reaction method and apparatus therefor
JPH0817171B2 (ja) * 1990-12-31 1996-02-21 株式会社半導体エネルギー研究所 プラズマ発生装置およびそれを用いたエッチング方法
JP2657850B2 (ja) 1990-10-23 1997-09-30 株式会社半導体エネルギー研究所 プラズマ発生装置およびそれを用いたエッチング方法
JP2947981B2 (ja) * 1991-06-05 1999-09-13 本田技研工業株式会社 自動車の組立方法、及び組立装置
JP3207469B2 (ja) 1991-10-21 2001-09-10 益弘 小駒 大気圧吹き出し型プラズマ反応装置
EP0700577A4 (fr) 1993-05-28 1996-12-27 Univ Tennessee Res Corp Procede et appareil pour le traitement au plasma a decharge luminescente de materiaux polymeres a la pression atmospherique
US5387842A (en) * 1993-05-28 1995-02-07 The University Of Tennessee Research Corp. Steady-state, glow discharge plasma
US5692006A (en) 1995-07-31 1997-11-25 Qualcomm Incorporated Adaptive despreader
US5981899A (en) * 1997-01-17 1999-11-09 Balzers Aktiengesellschaft Capacitively coupled RF-plasma reactor
JP3219082B2 (ja) 2000-01-20 2001-10-15 日本電気株式会社 データ格納方法

Also Published As

Publication number Publication date
DE69929271D1 (de) 2006-03-30
DE69929271T2 (de) 2006-09-21
KR20000029287A (ko) 2000-05-25
US6424091B1 (en) 2002-07-23
EP0997926A3 (fr) 2000-05-17
CN1141009C (zh) 2004-03-03
KR100320574B1 (ko) 2002-01-12
EP0997926A2 (fr) 2000-05-03
EP0997926B1 (fr) 2006-01-04
TW518367B (en) 2003-01-21
CN1254250A (zh) 2000-05-24

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PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20091025