JP4629068B2 - ワーク処理装置 - Google Patents
ワーク処理装置 Download PDFInfo
- Publication number
- JP4629068B2 JP4629068B2 JP2007139174A JP2007139174A JP4629068B2 JP 4629068 B2 JP4629068 B2 JP 4629068B2 JP 2007139174 A JP2007139174 A JP 2007139174A JP 2007139174 A JP2007139174 A JP 2007139174A JP 4629068 B2 JP4629068 B2 JP 4629068B2
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- plasma generator
- workpiece
- processing apparatus
- generator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims description 41
- 238000009434 installation Methods 0.000 claims description 69
- 230000032258 transport Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 22
- 238000012423 maintenance Methods 0.000 description 18
- 239000007789 gas Substances 0.000 description 14
- 238000012546 transfer Methods 0.000 description 10
- 238000005096 rolling process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32311—Circuits specially adapted for controlling the microwave discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
4 据付枠
4d ガイドレール
4e 係合部
6 プラズマ発生装置
8 制御部
14 電源部
18 プラズマ発生部
20 移動支持部材
W ワーク
S ワーク処理装置
Claims (4)
- 供給される所定のガスをプラズマ化するプラズマ発生部を有し、このプラズマ発生部からプラズマ化したガスを放出するプラズマ発生装置と、そのプラズマ発生装置の下側に設置され、前記プラズマ発生部の下方で処理対象であるワークを支持する支持部とを備え、前記ワークに対して前記プラズマ化したガスを照射することにより所定の処理を施与するワーク処理装置であって、
前記プラズマ発生装置のうち前記プラズマ発生部が前記支持部の上方に配置される据付位置に前記プラズマ発生装置を据え付け可能な据付枠を備え、
前記支持部は、前記プラズマ発生装置の下側に設置され、前記ワークを支持しながらそのワークを前記プラズマ発生装置が前記据付位置に据え付けられた場合に前記プラズマ発生部が配置される位置の下方の位置へ搬送する搬送装置からなり、
前記プラズマ発生装置は、当該プラズマ発生装置の前記プラズマ発生部が前記搬送装置上の位置から外れるように前記据付位置から水平方向でかつ前記搬送装置による前記ワークの搬送方向に対して直交する方向に引き出し可能に前記据付枠に対して取り付けられている、ワーク処理装置。 - 前記据付枠は、水平方向に延びるガイドレールを有し、
前記プラズマ発生装置は、前記据付位置から引き出される際に前記ガイドレール上を移動しながら当該プラズマ発生装置を前記ガイドレールに対して支える移動支持部材を有する、請求項1に記載のワーク処理装置。 - 前記据付枠は、前記移動支持部材と係合することにより前記プラズマ発生装置を前記据付位置で保持する係合部を有する、請求項2に記載のワーク処理装置。
- 前記プラズマ発生装置には、前記プラズマ発生部にマイクロ波電力を供給する電源部が設けられている一方、前記据付枠には、前記プラズマ発生装置を制御する制御部が設けられている、請求項1〜3のいずれか1項に記載のワーク処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007139174A JP4629068B2 (ja) | 2007-05-25 | 2007-05-25 | ワーク処理装置 |
TW097113932A TW200847854A (en) | 2007-05-25 | 2008-04-17 | Workpiece processing apparatus |
KR1020080041243A KR100996620B1 (ko) | 2007-05-25 | 2008-05-02 | 워크 처리 장치 |
US12/152,039 US20080289577A1 (en) | 2007-05-25 | 2008-05-12 | Workpiece processing apparatus |
CN2008100997039A CN101312122B (zh) | 2007-05-25 | 2008-05-21 | 工件处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007139174A JP4629068B2 (ja) | 2007-05-25 | 2007-05-25 | ワーク処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008293839A JP2008293839A (ja) | 2008-12-04 |
JP4629068B2 true JP4629068B2 (ja) | 2011-02-09 |
Family
ID=40071218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007139174A Expired - Fee Related JP4629068B2 (ja) | 2007-05-25 | 2007-05-25 | ワーク処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080289577A1 (ja) |
JP (1) | JP4629068B2 (ja) |
KR (1) | KR100996620B1 (ja) |
CN (1) | CN101312122B (ja) |
TW (1) | TW200847854A (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051490A (ja) * | 2001-08-03 | 2003-02-21 | Tokyo Electron Ltd | プラズマ処理装置 |
JP2004148282A (ja) * | 2002-11-01 | 2004-05-27 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
WO2004064129A1 (ja) * | 2003-01-15 | 2004-07-29 | Hirata Corporation | 基板処理方法及び基板処理装置 |
JP2004228136A (ja) * | 2003-01-20 | 2004-08-12 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP2006035045A (ja) * | 2004-07-23 | 2006-02-09 | Seiko Epson Corp | プラズマ処理装置、プラズマ処理方法、電気光学装置の製造方法、電気光学装置、および電子機器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5378170A (en) * | 1976-12-22 | 1978-07-11 | Toshiba Corp | Continuous processor for gas plasma etching |
DE69929271T2 (de) | 1998-10-26 | 2006-09-21 | Matsushita Electric Works, Ltd., Kadoma | Apparat und Verfahren zur Plasmabehandlung |
US6222155B1 (en) * | 2000-06-14 | 2001-04-24 | The Esab Group, Inc. | Cutting apparatus with thermal and nonthermal cutters, and associated methods |
JP4244176B2 (ja) | 2002-10-25 | 2009-03-25 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US6827075B1 (en) * | 2002-11-20 | 2004-12-07 | Robert Bellospirito | Apparatus for burning stone |
US7806077B2 (en) * | 2004-07-30 | 2010-10-05 | Amarante Technologies, Inc. | Plasma nozzle array for providing uniform scalable microwave plasma generation |
JP2006134829A (ja) | 2004-11-09 | 2006-05-25 | Seiko Epson Corp | プラズマ処理装置 |
-
2007
- 2007-05-25 JP JP2007139174A patent/JP4629068B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-17 TW TW097113932A patent/TW200847854A/zh unknown
- 2008-05-02 KR KR1020080041243A patent/KR100996620B1/ko not_active IP Right Cessation
- 2008-05-12 US US12/152,039 patent/US20080289577A1/en not_active Abandoned
- 2008-05-21 CN CN2008100997039A patent/CN101312122B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003051490A (ja) * | 2001-08-03 | 2003-02-21 | Tokyo Electron Ltd | プラズマ処理装置 |
JP2004148282A (ja) * | 2002-11-01 | 2004-05-27 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
WO2004064129A1 (ja) * | 2003-01-15 | 2004-07-29 | Hirata Corporation | 基板処理方法及び基板処理装置 |
JP2004228136A (ja) * | 2003-01-20 | 2004-08-12 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP2006035045A (ja) * | 2004-07-23 | 2006-02-09 | Seiko Epson Corp | プラズマ処理装置、プラズマ処理方法、電気光学装置の製造方法、電気光学装置、および電子機器 |
Also Published As
Publication number | Publication date |
---|---|
JP2008293839A (ja) | 2008-12-04 |
CN101312122A (zh) | 2008-11-26 |
US20080289577A1 (en) | 2008-11-27 |
KR100996620B1 (ko) | 2010-11-25 |
TW200847854A (en) | 2008-12-01 |
CN101312122B (zh) | 2010-07-21 |
KR20080103899A (ko) | 2008-11-28 |
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