HK1023225A1 - Chip scale ball grid array for integrated circuit package. - Google Patents

Chip scale ball grid array for integrated circuit package.

Info

Publication number
HK1023225A1
HK1023225A1 HK00102180A HK00102180A HK1023225A1 HK 1023225 A1 HK1023225 A1 HK 1023225A1 HK 00102180 A HK00102180 A HK 00102180A HK 00102180 A HK00102180 A HK 00102180A HK 1023225 A1 HK1023225 A1 HK 1023225A1
Authority
HK
Hong Kong
Prior art keywords
integrated circuit
chip scale
grid array
ball grid
circuit package
Prior art date
Application number
HK00102180A
Other languages
English (en)
Inventor
Randolph D Schueller
John D Geissinger
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of HK1023225A1 publication Critical patent/HK1023225A1/xx

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    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
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    • H01L2924/3025—Electromagnetic shielding
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
HK00102180A 1996-12-02 2000-04-10 Chip scale ball grid array for integrated circuit package. HK1023225A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/759,253 US5990545A (en) 1996-12-02 1996-12-02 Chip scale ball grid array for integrated circuit package
PCT/US1997/005489 WO1998025303A1 (en) 1996-12-02 1997-04-02 Chip scale ball grid array for integrated circuit package

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HK1023225A1 true HK1023225A1 (en) 2000-09-01

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HK00102180A HK1023225A1 (en) 1996-12-02 2000-04-10 Chip scale ball grid array for integrated circuit package.

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US (1) US5990545A (de)
EP (1) EP0948814B1 (de)
JP (1) JP2001506057A (de)
KR (1) KR100532179B1 (de)
CN (1) CN1239589A (de)
AT (1) ATE273564T1 (de)
AU (1) AU2435397A (de)
CA (1) CA2272434A1 (de)
DE (1) DE69730239D1 (de)
HK (1) HK1023225A1 (de)
MY (1) MY119341A (de)
WO (1) WO1998025303A1 (de)

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ATE273564T1 (de) 2004-08-15
JP2001506057A (ja) 2001-05-08
US5990545A (en) 1999-11-23
KR20000057332A (ko) 2000-09-15
DE69730239D1 (de) 2004-09-16
MY119341A (en) 2005-05-31
KR100532179B1 (ko) 2005-12-01
WO1998025303A1 (en) 1998-06-11
CA2272434A1 (en) 1998-06-11
EP0948814B1 (de) 2004-08-11
CN1239589A (zh) 1999-12-22
EP0948814A1 (de) 1999-10-13
AU2435397A (en) 1998-06-29

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