HK1021772A1 - Multilayer electronic component and manufacturing method thereof - Google Patents

Multilayer electronic component and manufacturing method thereof

Info

Publication number
HK1021772A1
HK1021772A1 HK00100385A HK00100385A HK1021772A1 HK 1021772 A1 HK1021772 A1 HK 1021772A1 HK 00100385 A HK00100385 A HK 00100385A HK 00100385 A HK00100385 A HK 00100385A HK 1021772 A1 HK1021772 A1 HK 1021772A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
electronic component
multilayer electronic
multilayer
component
Prior art date
Application number
HK00100385A
Other languages
English (en)
Inventor
Syunichi Ohno
Masahiko Yamagishi
Original Assignee
Taiyo Yuden Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP02069998A external-priority patent/JP4290237B2/ja
Priority claimed from JP10094851A external-priority patent/JPH11297531A/ja
Application filed by Taiyo Yuden Kk filed Critical Taiyo Yuden Kk
Publication of HK1021772A1 publication Critical patent/HK1021772A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
HK00100385A 1998-02-02 2000-01-21 Multilayer electronic component and manufacturing method thereof HK1021772A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02069998A JP4290237B2 (ja) 1998-02-02 1998-02-02 積層電子部品の製造方法
JP10094851A JPH11297531A (ja) 1998-04-07 1998-04-07 積層電子部品

Publications (1)

Publication Number Publication Date
HK1021772A1 true HK1021772A1 (en) 2000-06-30

Family

ID=26357674

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00100385A HK1021772A1 (en) 1998-02-02 2000-01-21 Multilayer electronic component and manufacturing method thereof

Country Status (6)

Country Link
US (1) US6304164B1 (xx)
EP (1) EP0933788B1 (xx)
KR (1) KR100552010B1 (xx)
DE (1) DE69909663T2 (xx)
HK (1) HK1021772A1 (xx)
MY (1) MY122218A (xx)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6675462B1 (en) * 1998-05-01 2004-01-13 Taiyo Yuden Co., Ltd. Method of manufacturing a multi-laminated inductor
JP3465649B2 (ja) * 1999-11-11 2003-11-10 株式会社村田製作所 セラミックインダクタ部品及び複合部品
EP1367611A4 (en) 2001-03-08 2010-01-13 Panasonic Corp INDUCTANCE PART AND METHOD FOR PRODUCING THE SAME
US20060091534A1 (en) * 2002-12-13 2006-05-04 Matsushita Electric Industrial Co., Ltd. Chip part manufacturing method and chip parts
US20040145441A1 (en) * 2003-01-28 2004-07-29 Arnett David W. Inductor with resistive termination
US7167070B2 (en) * 2003-09-01 2007-01-23 Murata Manufacturing Co., Ltd. Laminated coil component and method of producing the same
US7262680B2 (en) 2004-02-27 2007-08-28 Illinois Institute Of Technology Compact inductor with stacked via magnetic cores for integrated circuits
JP2006253371A (ja) * 2005-03-10 2006-09-21 Tdk Corp 多端子型積層コンデンサ及びその製造方法
US7629860B2 (en) * 2007-06-08 2009-12-08 Stats Chippac, Ltd. Miniaturized wide-band baluns for RF applications
JP5533673B2 (ja) * 2009-02-10 2014-06-25 株式会社村田製作所 電子部品
CN102741956B (zh) * 2010-02-01 2014-08-20 株式会社村田制作所 电子部件的制造方法
JP5482554B2 (ja) * 2010-08-04 2014-05-07 株式会社村田製作所 積層型コイル
WO2012023315A1 (ja) * 2010-08-18 2012-02-23 株式会社村田製作所 電子部品及びその製造方法
KR101218985B1 (ko) * 2011-05-31 2013-01-04 삼성전기주식회사 칩형 코일 부품
JP5644957B2 (ja) * 2011-10-14 2014-12-24 株式会社村田製作所 電子部品
JP5598492B2 (ja) * 2012-03-30 2014-10-01 Ｔｄｋ株式会社 積層コイル部品
KR101983149B1 (ko) * 2013-09-24 2019-05-28 삼성전기주식회사 적층형 인덕터 및 그 제조 방법
KR20150114747A (ko) * 2014-04-02 2015-10-13 삼성전기주식회사 칩형 코일 부품 및 그 실장 기판
KR101642643B1 (ko) 2015-01-27 2016-07-29 삼성전기주식회사 코일 부품 및 이의 제조 방법
JP6376000B2 (ja) * 2015-03-02 2018-08-22 株式会社村田製作所 電子部品およびその製造方法
JP6418135B2 (ja) * 2015-11-04 2018-11-07 株式会社村田製作所 電子部品
JP6569654B2 (ja) * 2016-12-14 2019-09-04 株式会社村田製作所 チップインダクタ
WO2018159481A1 (ja) 2017-02-28 2018-09-07 株式会社村田製作所 積層型電子部品および積層型電子部品の製造方法
JP6912976B2 (ja) * 2017-09-04 2021-08-04 株式会社村田製作所 インダクタ部品
KR102494352B1 (ko) * 2017-10-20 2023-02-03 삼성전기주식회사 코일 전자부품
JP7180329B2 (ja) * 2018-11-30 2022-11-30 Tdk株式会社 積層コイル部品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812442A (en) 1972-02-29 1974-05-21 W Muckelroy Ceramic inductor
JP2601666Y2 (ja) * 1992-05-08 1999-11-29 株式会社村田製作所 積層型コイル
JPH07192921A (ja) * 1993-12-27 1995-07-28 Taiyo Yuden Co Ltd 積層型電子部品
US5610565A (en) * 1994-02-02 1997-03-11 Murata Manufacturing Co., Ltd. Composite LC device with a ground electrode not formed on the inductor parts
JPH0855726A (ja) * 1994-08-10 1996-02-27 Taiyo Yuden Co Ltd 積層型電子部品及びその製造方法
CA2158784A1 (en) * 1994-11-09 1996-05-10 Jeffrey T. Adelman Electronic thick film component termination and method of making the same
JPH0969463A (ja) * 1995-08-30 1997-03-11 Nec Corp 積層セラミックコンデンサ及びその製造方法
JP3087648B2 (ja) * 1996-04-22 2000-09-11 株式会社村田製作所 積層型ｌｃフィルタ
JP3077056B2 (ja) * 1996-09-12 2000-08-14 株式会社村田製作所 積層型電子部品
JP3438859B2 (ja) * 1996-11-21 2003-08-18 ティーディーケイ株式会社 積層型電子部品とその製造方法
JP3201309B2 (ja) * 1997-05-23 2001-08-20 株式会社村田製作所 積層型コイル及びその製造方法

Also Published As

Publication number Publication date
KR19990072351A (ko) 1999-09-27
DE69909663T2 (de) 2004-04-15
US6304164B1 (en) 2001-10-16
EP0933788B1 (en) 2003-07-23
EP0933788A1 (en) 1999-08-04
KR100552010B1 (ko) 2006-02-17
DE69909663D1 (de) 2003-08-28
MY122218A (en) 2006-03-31

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100201