GB826823A - Improvements in or relating to semi-conductor electrode devices - Google Patents

Improvements in or relating to semi-conductor electrode devices

Info

Publication number
GB826823A
GB826823A GB11944/58A GB1194458A GB826823A GB 826823 A GB826823 A GB 826823A GB 11944/58 A GB11944/58 A GB 11944/58A GB 1194458 A GB1194458 A GB 1194458A GB 826823 A GB826823 A GB 826823A
Authority
GB
United Kingdom
Prior art keywords
semi
parts
grooves
relating
conductor electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB11944/58A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB826823A publication Critical patent/GB826823A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H01J5/22—Vacuum-tight joints between parts of vessel
    • H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49938—Radially expanding part in cavity, aperture, or hollow body

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)

Abstract

826,823. Semi-conductor system envelopes. PHILIPS ELECTRICAL INDUSTRIES Ltd. April 15, 1958 [April 16, 1957], No. 11944/58. Class 37. A vacuum-tight envelope for a semi-conductor system comprises two parts of, e.g. iron, copper, brass, or aluminium provided with facing plane surfaces, one or more meeting grooves being formed in each of these surfaces, the walls of the grooves being substantially at right-angles to the surfaces. A layer of very soft metal, e.g. lead, tin or indium, is provided between the surfaces and fills the grooves. One of the parts has a flanged rim which embraces the other parts and maintains the parts pressed together.
GB11944/58A 1957-04-16 1958-04-15 Improvements in or relating to semi-conductor electrode devices Expired GB826823A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL359789X 1957-04-16

Publications (1)

Publication Number Publication Date
GB826823A true GB826823A (en) 1960-01-20

Family

ID=19785356

Family Applications (1)

Application Number Title Priority Date Filing Date
GB11944/58A Expired GB826823A (en) 1957-04-16 1958-04-15 Improvements in or relating to semi-conductor electrode devices

Country Status (6)

Country Link
US (1) US3024299A (en)
BE (1) BE566767A (en)
CH (1) CH359789A (en)
DE (1) DE1072323B (en)
FR (1) FR1194674A (en)
GB (1) GB826823A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132601A (en) * 1982-12-23 1984-07-11 Ferranti Plc Joining articles of materials of different expansion coefficients

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3191268A (en) * 1958-02-28 1965-06-29 Gen Motors Corp Process for encapsulating transistors
US3125709A (en) * 1960-10-17 1964-03-17 Housing assembly
GB956054A (en) * 1960-10-26 1964-04-22 Asea Ab Semi-conductor device with a gas-tight casing
NL270996A (en) * 1960-11-09
NL132800C (en) * 1960-11-16
US3203083A (en) * 1961-02-08 1965-08-31 Texas Instruments Inc Method of manufacturing a hermetically sealed semiconductor capsule
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
US3242555A (en) * 1961-06-08 1966-03-29 Gen Motors Corp Method of making a semiconductor package
DE1210489B (en) * 1961-08-10 1966-02-10 Siemens Ag Semiconductor component with a semiconductor element enclosed in a gastight manner in a housing
DE1237695B (en) * 1961-10-24 1967-03-30 Siemens Ag Semiconductor arrangement with a semiconductor element enclosed in a gas-tight housing
DE1218620B (en) * 1962-02-05 1966-06-08 Siemens Ag Application of electrical resistance soldering to the vacuum-tight sealing of a semiconductor arrangement
US3217216A (en) * 1962-07-12 1965-11-09 Gianni A Dotto Rotary capacitor apparatus
US3249982A (en) * 1963-01-07 1966-05-10 Hughes Aircraft Co Semiconductor diode and method of making same
US3358152A (en) * 1963-07-22 1967-12-12 Nicholas G Alexakis Temperature compensated transistor and means for controlling
US3268779A (en) * 1963-11-06 1966-08-23 Int Rectifier Corp Hermetically sealed semiconductor device
DE1514473C3 (en) * 1965-06-05 1981-08-20 Siemens AG, 1000 Berlin und 8000 München Semiconductor component
US3422320A (en) * 1965-12-23 1969-01-14 Gen Motors Corp Sealing technique for composite ferrous-copper base alloy capsules for semiconductor devices
US3937383A (en) * 1975-03-24 1976-02-10 Continental Can Company, Inc. High speed room temperature seam bonding of metal sheets
US4037749A (en) * 1976-03-15 1977-07-26 Bell Telephone Laboratories, Incorporated Hermetically sealed envelope and method of making the same
US6507147B1 (en) * 2000-08-31 2003-01-14 Intevac, Inc. Unitary vacuum tube incorporating high voltage isolation
US20130167482A1 (en) * 2011-09-08 2013-07-04 Advanced Numicro Systems, Inc. Vacuum sealing process of a mems package

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1512298A (en) * 1919-11-12 1924-10-21 Adolph Mueller Pipe coupling
US1783791A (en) * 1928-11-08 1930-12-02 New Departure Mfg Co Method of assembling antifriction bearings
US2342422A (en) * 1942-05-05 1944-02-22 Walworth Patents Inc High pressure joint
CH243668A (en) * 1944-04-29 1946-07-31 Sulzer Ag Drum rotor assembled from individual disks and process for its manufacture.
US2763708A (en) * 1950-07-11 1956-09-18 Joseph B Brennan Closure, terminal and mounting constructions for electrical devices
US2701483A (en) * 1950-07-12 1955-02-08 Gen Electric Co Ltd Method of securing inserts in ductile metal members by pressure welding
US2754065A (en) * 1952-04-25 1956-07-10 Jesse E Hawley Railroad rail joint construction
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device
BE546710A (en) * 1955-06-08 1900-01-01
NL209559A (en) * 1955-08-09
US2808543A (en) * 1956-01-30 1957-10-01 Hughes Aircraft Co Mounting means for semiconductor crystal body
BE563190A (en) * 1956-09-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132601A (en) * 1982-12-23 1984-07-11 Ferranti Plc Joining articles of materials of different expansion coefficients
US4930676A (en) * 1982-12-23 1990-06-05 Ferranti International Plc Joint between articles of materials of different coefficients of thermal expansion

Also Published As

Publication number Publication date
US3024299A (en) 1962-03-06
DE1072323B (en)
FR1194674A (en) 1959-11-12
CH359789A (en) 1962-01-31
BE566767A (en)

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