GB890455A - Improvements in or relating to methods of enclosing electrical components in housings and to components enclosed by such methods - Google Patents
Improvements in or relating to methods of enclosing electrical components in housings and to components enclosed by such methodsInfo
- Publication number
- GB890455A GB890455A GB4097159A GB4097159A GB890455A GB 890455 A GB890455 A GB 890455A GB 4097159 A GB4097159 A GB 4097159A GB 4097159 A GB4097159 A GB 4097159A GB 890455 A GB890455 A GB 890455A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ring
- methods
- pressure
- cap
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
890,455. Making electrical components; welding by pressure; jointing by forging. SIEMENS & HALSKE A.G. Dec. 2, 1959 (Jan. 13, 1959], No. 40971/59. Classes 83 (2) and 83 (4). [Also in Group XXXVI] In a method of enclosing an electrical component in a housing, a ring 3 of deformable metal is inserted in a flatbottomed groove in a baseplate 1 a flanged edge of a metal cap 2 is placed in the groove over the ring and pressure is applied to seal the joint between the flanged edge of the cap and the base-plate. As described, the electrical component is a semi-conductor device, the base-plate 1 consists of electrolytic copper which is gold-plated at least where it contacts the device, the cap 2 consists of anodized aluminium or lacquered iron or copper, and the ring 3 consists of tin, indium, lead or aluminium. Pressure is applied by an hydraulic press to deform the edge 7 of the groove and cause the material of the ring 3 to flow and form an air-tight seal. The baseplate 1 is provided with a central recess to improve the contact with a chassis 8 which may not be truly flat.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0061301 | 1959-01-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB890455A true GB890455A (en) | 1962-02-28 |
Family
ID=7494754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4097159A Expired GB890455A (en) | 1959-01-13 | 1959-12-02 | Improvements in or relating to methods of enclosing electrical components in housings and to components enclosed by such methods |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH378422A (en) |
FR (1) | FR1242768A (en) |
GB (1) | GB890455A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2132601A (en) * | 1982-12-23 | 1984-07-11 | Ferranti Plc | Joining articles of materials of different expansion coefficients |
-
1959
- 1959-12-02 GB GB4097159A patent/GB890455A/en not_active Expired
- 1959-12-17 FR FR813339A patent/FR1242768A/en not_active Expired
-
1960
- 1960-01-06 CH CH11160A patent/CH378422A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2132601A (en) * | 1982-12-23 | 1984-07-11 | Ferranti Plc | Joining articles of materials of different expansion coefficients |
US4930676A (en) * | 1982-12-23 | 1990-06-05 | Ferranti International Plc | Joint between articles of materials of different coefficients of thermal expansion |
Also Published As
Publication number | Publication date |
---|---|
CH378422A (en) | 1964-06-15 |
FR1242768A (en) | 1960-09-30 |
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