GB890455A - Improvements in or relating to methods of enclosing electrical components in housings and to components enclosed by such methods - Google Patents

Improvements in or relating to methods of enclosing electrical components in housings and to components enclosed by such methods

Info

Publication number
GB890455A
GB890455A GB4097159A GB4097159A GB890455A GB 890455 A GB890455 A GB 890455A GB 4097159 A GB4097159 A GB 4097159A GB 4097159 A GB4097159 A GB 4097159A GB 890455 A GB890455 A GB 890455A
Authority
GB
United Kingdom
Prior art keywords
ring
methods
pressure
cap
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4097159A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens AG
Original Assignee
Siemens and Halske AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens AG filed Critical Siemens and Halske AG
Publication of GB890455A publication Critical patent/GB890455A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Abstract

890,455. Making electrical components; welding by pressure; jointing by forging. SIEMENS & HALSKE A.G. Dec. 2, 1959 (Jan. 13, 1959], No. 40971/59. Classes 83 (2) and 83 (4). [Also in Group XXXVI] In a method of enclosing an electrical component in a housing, a ring 3 of deformable metal is inserted in a flatbottomed groove in a baseplate 1 a flanged edge of a metal cap 2 is placed in the groove over the ring and pressure is applied to seal the joint between the flanged edge of the cap and the base-plate. As described, the electrical component is a semi-conductor device, the base-plate 1 consists of electrolytic copper which is gold-plated at least where it contacts the device, the cap 2 consists of anodized aluminium or lacquered iron or copper, and the ring 3 consists of tin, indium, lead or aluminium. Pressure is applied by an hydraulic press to deform the edge 7 of the groove and cause the material of the ring 3 to flow and form an air-tight seal. The baseplate 1 is provided with a central recess to improve the contact with a chassis 8 which may not be truly flat.
GB4097159A 1959-01-13 1959-12-02 Improvements in or relating to methods of enclosing electrical components in housings and to components enclosed by such methods Expired GB890455A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0061301 1959-01-13

Publications (1)

Publication Number Publication Date
GB890455A true GB890455A (en) 1962-02-28

Family

ID=7494754

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4097159A Expired GB890455A (en) 1959-01-13 1959-12-02 Improvements in or relating to methods of enclosing electrical components in housings and to components enclosed by such methods

Country Status (3)

Country Link
CH (1) CH378422A (en)
FR (1) FR1242768A (en)
GB (1) GB890455A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132601A (en) * 1982-12-23 1984-07-11 Ferranti Plc Joining articles of materials of different expansion coefficients

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132601A (en) * 1982-12-23 1984-07-11 Ferranti Plc Joining articles of materials of different expansion coefficients
US4930676A (en) * 1982-12-23 1990-06-05 Ferranti International Plc Joint between articles of materials of different coefficients of thermal expansion

Also Published As

Publication number Publication date
CH378422A (en) 1964-06-15
FR1242768A (en) 1960-09-30

Similar Documents

Publication Publication Date Title
GB1488476A (en) Terminal-cover assembly for an electrical component package
GB826823A (en) Improvements in or relating to semi-conductor electrode devices
ES273659U (en) Sealed electrical connector.
GB1526510A (en) Output power semiconductor device
GB1094699A (en) Method of attaching leads to thin films
GB914592A (en) Electrical semi-conductor device
GB890455A (en) Improvements in or relating to methods of enclosing electrical components in housings and to components enclosed by such methods
GB942331A (en) Improvements in or relating to semiconductor devices
GB875823A (en) Improvements in or relating to hermetic seals
JPS5263095A (en) Press-in type hermetic seal
GB905386A (en) Improvements relating to hermetically sealed enclosures
GB753136A (en) Improvements in or relating to light cells or rectifiers
GB1502066A (en) Controllable semiconductor components
GB956054A (en) Semi-conductor device with a gas-tight casing
GB1447852A (en) Electric terminals
GB780012A (en) Improvements in or relating to the formation of hermetic seals between metallic parts
GB913243A (en) Improvements in or relating to the passage of electrical or fluid conductors througha wall in fluid-sealing relation therewith
GB905418A (en) Improvements in or relating to hermetically sealed metal parts of envelopes
GB860395A (en) Improvements in and relating to the assembly of semi-conductor devices
GB942457A (en) Improvements in or relating to devices for connecting in electric circuits
GB1272964A (en) Semiconductor component elements
GB895232A (en) Semiconductor diodes
JPS6411351A (en) Package for sealing circuit component
GB904427A (en) Improvements in or relating to a method for making a vacuum-tight connection betweena metal member and the rim of a housing
GB966019A (en) Improvements in or relating to composite piece-parts for use in apparatus manufacture