GB905386A - Improvements relating to hermetically sealed enclosures - Google Patents

Improvements relating to hermetically sealed enclosures

Info

Publication number
GB905386A
GB905386A GB34835/59A GB3483559A GB905386A GB 905386 A GB905386 A GB 905386A GB 34835/59 A GB34835/59 A GB 34835/59A GB 3483559 A GB3483559 A GB 3483559A GB 905386 A GB905386 A GB 905386A
Authority
GB
United Kingdom
Prior art keywords
lip
ring
wall
base
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB34835/59A
Inventor
Raymond G Chamberlin
Herbert S Evander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tung Sol Electric Inc
Original Assignee
Tung Sol Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US706443A priority Critical patent/US2941688A/en
Application filed by Tung Sol Electric Inc filed Critical Tung Sol Electric Inc
Priority to GB34835/59A priority patent/GB905386A/en
Publication of GB905386A publication Critical patent/GB905386A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20Seals between parts of vessels
    • H01J5/22Vacuum-tight joints between parts of vessel
    • H01J5/28Vacuum-tight joints between parts of vessel between conductive parts of vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0033Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037Solid sealing members other than lamp bases
    • H01J2893/0044Direct connection between two metal elements, in particular via material a connecting material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Pressure Vessels And Lids Thereof (AREA)

Abstract

905,386. Welding by pressure. TUNG-SOL ELECTRIC Inc. Oct. 14, 1959, No. 34835/59. Class 83 (4). [Also in Group XXXVI] In forming an hermetically-sealed enclosure by joining an annular lip 16 of a cover 14 to a base 2 having a minimum width greater than the outside diameter of the cover, the base 2 is provided with a cylindrical wall 6, a metal ring is positioned on the base to engage a surface of the wall, the free end of the wall is flared over the ring to form an annular lip and the lip is cold-pressure welded to the annular lip 16 of the cover member, the ring being locked to the base by forcing the two lips together against the ring as an anvil. A copper or aluminium base 2 on which an electrical component, e.g. a transistor 4 is mounted, is provided with a cylindrical wall 6, Fig. 2, and a steel ring 8 is slid over the wall. The transistor leads are welded to rods 10 fused through the base. The upper end of the wall is flared to form a lip 12 and this lip and the lip 16 of a copper or aluminium cover 14 are pressed together against the ring to form a cold weld and lock the ring in place. Alternatively, a ring 8<SP>1</SP>, Fig. 6, may be fitted within the wall, the wall is flared inwardly to form a lip 12<SP>1</SP> and this lip and lip 16 of the cover are cold-welded as before. The leads may be sealed through the cover.
GB34835/59A 1957-12-31 1959-10-14 Improvements relating to hermetically sealed enclosures Expired GB905386A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US706443A US2941688A (en) 1957-12-31 1957-12-31 Encapsulation of electronic component and method of making the same
GB34835/59A GB905386A (en) 1957-12-31 1959-10-14 Improvements relating to hermetically sealed enclosures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US706443A US2941688A (en) 1957-12-31 1957-12-31 Encapsulation of electronic component and method of making the same
GB34835/59A GB905386A (en) 1957-12-31 1959-10-14 Improvements relating to hermetically sealed enclosures

Publications (1)

Publication Number Publication Date
GB905386A true GB905386A (en) 1962-09-05

Family

ID=26262457

Family Applications (1)

Application Number Title Priority Date Filing Date
GB34835/59A Expired GB905386A (en) 1957-12-31 1959-10-14 Improvements relating to hermetically sealed enclosures

Country Status (2)

Country Link
US (1) US2941688A (en)
GB (1) GB905386A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3345735A (en) * 1963-02-25 1967-10-10 Augustus H Nicholls Honeycomb core construction through the application of heat and pressure
GB2239127A (en) * 1989-12-18 1991-06-19 Westinghouse Brake & Signal "A housing for a semiconductor device"
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211827A (en) * 1959-11-17 1965-10-12 Texas Instruments Inc Container closure device
GB959556A (en) * 1960-03-29 1964-06-03 Pye Ltd Cold welding arrangements
US3184534A (en) * 1961-11-24 1965-05-18 Texas Instruments Inc Semiconductor device enclosure with weld reinforcing ring
US3219748A (en) * 1961-12-04 1965-11-23 Motorola Inc Semiconductor device with cold welded package and method of sealing the same
US3408451A (en) * 1965-09-01 1968-10-29 Texas Instruments Inc Electrical device package

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734097A (en) * 1956-02-07 avery
US2248817A (en) * 1940-04-25 1941-07-08 Vincent G Eiben Electrical housing box
US2344325A (en) * 1941-09-15 1944-03-14 Continental Can Co Wire opening container
US2568512A (en) * 1948-08-21 1951-09-18 Evans Case Co Assembly of shells of containers
US2608887A (en) * 1949-03-28 1952-09-02 Gen Electric Co Ltd Means for cold pressure welding
US2751674A (en) * 1951-02-01 1956-06-26 Int Standard Electric Corp Methods of sealing electrical components in metal casings
FR1088170A (en) * 1952-04-15 1955-03-03 Gen Motors Corp Advanced process for joining metal tubes
US2728546A (en) * 1953-05-21 1955-12-27 Liquidometer Corp Vibration-resistant mounting for a capacitor type tank unit
GB784939A (en) * 1954-08-23 1957-10-23 Gen Electric Co Ltd Improvements in and relating to pressure welding
GB793402A (en) * 1955-05-10 1958-04-16 Gen Electric Co Ltd Improvements in or relating to cold pressure welding

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3345735A (en) * 1963-02-25 1967-10-10 Augustus H Nicholls Honeycomb core construction through the application of heat and pressure
GB2239127A (en) * 1989-12-18 1991-06-19 Westinghouse Brake & Signal "A housing for a semiconductor device"
GB2239127B (en) * 1989-12-18 1993-07-07 Westinghouse Brake & Signal Housings for semiconductor devices
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Also Published As

Publication number Publication date
US2941688A (en) 1960-06-21

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