GB2239127B - Housings for semiconductor devices - Google Patents

Housings for semiconductor devices

Info

Publication number
GB2239127B
GB2239127B GB9027122A GB9027122A GB2239127B GB 2239127 B GB2239127 B GB 2239127B GB 9027122 A GB9027122 A GB 9027122A GB 9027122 A GB9027122 A GB 9027122A GB 2239127 B GB2239127 B GB 2239127B
Authority
GB
United Kingdom
Prior art keywords
housings
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9027122A
Other versions
GB2239127A (en
GB9027122D0 (en
Inventor
Roger Fillmore Calmead Bennett
David Charles Ham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Westinghouse Brake and Signal Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd, Westinghouse Brake and Signal Holdings Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Publication of GB9027122D0 publication Critical patent/GB9027122D0/en
Publication of GB2239127A publication Critical patent/GB2239127A/en
Application granted granted Critical
Publication of GB2239127B publication Critical patent/GB2239127B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Bipolar Transistors (AREA)
GB9027122A 1989-12-18 1990-12-14 Housings for semiconductor devices Expired - Fee Related GB2239127B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898928492A GB8928492D0 (en) 1989-12-18 1989-12-18 Housings for semiconductor devices

Publications (3)

Publication Number Publication Date
GB9027122D0 GB9027122D0 (en) 1991-02-06
GB2239127A GB2239127A (en) 1991-06-19
GB2239127B true GB2239127B (en) 1993-07-07

Family

ID=10668090

Family Applications (2)

Application Number Title Priority Date Filing Date
GB898928492A Pending GB8928492D0 (en) 1989-12-18 1989-12-18 Housings for semiconductor devices
GB9027122A Expired - Fee Related GB2239127B (en) 1989-12-18 1990-12-14 Housings for semiconductor devices

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB898928492A Pending GB8928492D0 (en) 1989-12-18 1989-12-18 Housings for semiconductor devices

Country Status (4)

Country Link
JP (1) JPH0744050U (en)
DE (1) DE9016960U1 (en)
GB (2) GB8928492D0 (en)
IT (1) IT1244184B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469304B2 (en) * 1994-04-12 2003-11-25 三菱電機株式会社 Semiconductor device
JP5709491B2 (en) * 2010-11-30 2015-04-30 京セラクリスタルデバイス株式会社 Manufacturing method of electronic device
US11380557B2 (en) * 2017-06-05 2022-07-05 Applied Materials, Inc. Apparatus and method for gas delivery in semiconductor process chambers

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB905386A (en) * 1957-12-31 1962-09-05 Tung Sol Electric Inc Improvements relating to hermetically sealed enclosures
GB1038686A (en) * 1964-06-04 1966-08-10 Westinghouse Brake & Signal Improvements relating to the encapsulation of semi-conductor devices
GB1176519A (en) * 1967-11-28 1970-01-07 Westinghouse Brake & Signal Semiconductor Devices and the Manufacture Thereof
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
US3751800A (en) * 1970-08-04 1973-08-14 Gen Motors Corp Method of fabricating a semiconductor enclosure
US3753054A (en) * 1970-01-02 1973-08-14 Texas Instruments Inc Hermetically sealed electronic package
GB1362942A (en) * 1972-05-03 1974-08-07 Siemens Ag Semiconductor components
US4775916A (en) * 1985-09-04 1988-10-04 Hitachi Ltd. Pressure contact semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB905386A (en) * 1957-12-31 1962-09-05 Tung Sol Electric Inc Improvements relating to hermetically sealed enclosures
GB1038686A (en) * 1964-06-04 1966-08-10 Westinghouse Brake & Signal Improvements relating to the encapsulation of semi-conductor devices
GB1176519A (en) * 1967-11-28 1970-01-07 Westinghouse Brake & Signal Semiconductor Devices and the Manufacture Thereof
US3753054A (en) * 1970-01-02 1973-08-14 Texas Instruments Inc Hermetically sealed electronic package
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
US3751800A (en) * 1970-08-04 1973-08-14 Gen Motors Corp Method of fabricating a semiconductor enclosure
GB1362942A (en) * 1972-05-03 1974-08-07 Siemens Ag Semiconductor components
US4775916A (en) * 1985-09-04 1988-10-04 Hitachi Ltd. Pressure contact semiconductor device

Also Published As

Publication number Publication date
IT9022401A1 (en) 1991-06-19
IT9022401A0 (en) 1990-12-17
GB2239127A (en) 1991-06-19
GB9027122D0 (en) 1991-02-06
DE9016960U1 (en) 1991-04-04
IT1244184B (en) 1994-07-08
GB8928492D0 (en) 1990-02-21
JPH0744050U (en) 1995-10-24

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20021214